JP5917603B2 - 半導体装置およびその製造方法 - Google Patents
半導体装置およびその製造方法 Download PDFInfo
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- JP5917603B2 JP5917603B2 JP2014116618A JP2014116618A JP5917603B2 JP 5917603 B2 JP5917603 B2 JP 5917603B2 JP 2014116618 A JP2014116618 A JP 2014116618A JP 2014116618 A JP2014116618 A JP 2014116618A JP 5917603 B2 JP5917603 B2 JP 5917603B2
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- 239000004065 semiconductor Substances 0.000 title claims description 51
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 239000010949 copper Substances 0.000 claims description 128
- 229910021332 silicide Inorganic materials 0.000 claims description 58
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims description 58
- 229910052751 metal Inorganic materials 0.000 claims description 33
- 239000002184 metal Substances 0.000 claims description 33
- 239000000758 substrate Substances 0.000 claims description 18
- 229910052802 copper Inorganic materials 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 7
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 4
- JUZTWRXHHZRLED-UHFFFAOYSA-N [Si].[Cu].[Cu].[Cu].[Cu].[Cu] Chemical group [Si].[Cu].[Cu].[Cu].[Cu].[Cu] JUZTWRXHHZRLED-UHFFFAOYSA-N 0.000 claims description 4
- 229910021360 copper silicide Inorganic materials 0.000 claims description 4
- 229910000077 silane Inorganic materials 0.000 claims description 3
- 229910000881 Cu alloy Inorganic materials 0.000 claims 4
- 239000010410 layer Substances 0.000 description 194
- 238000000034 method Methods 0.000 description 32
- 239000007789 gas Substances 0.000 description 18
- 230000004888 barrier function Effects 0.000 description 13
- 229910052581 Si3N4 Inorganic materials 0.000 description 9
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 9
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 7
- 229910000365 copper sulfate Inorganic materials 0.000 description 6
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 6
- 238000009713 electroplating Methods 0.000 description 6
- 238000009832 plasma treatment Methods 0.000 description 5
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 239000011800 void material Substances 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 2
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000005360 phosphosilicate glass Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
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- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Description
12 BPSG膜
14 孔部
16 プラグ金属
18 SiN膜
20 TEOS膜
21 絶縁膜
22 溝部
24 バリア層
26 Cuシード層
28 Cuシリサイド層
30 Cu配線層
32 酸化膜
34 ボイド
100 半導体装置
Claims (5)
- 半導体基板上に設けられた、溝部を有する絶縁膜と、
前記溝部の内面に沿って設けられた金属シード層と、
前記金属シード層の表面に沿って設けられたシリサイド層と、
前記溝部に埋め込まれるように、前記シリサイド層の表面上に設けられた銅配線層と、を有し、
前記金属シード層は銅シード層または銅合金シード層であり、前記シリサイド層は銅シリサイド層または銅合金シリサイド層である半導体装置。 - 半導体基板上に形成された絶縁膜に溝部を形成する工程と、
前記溝部の表面に沿って金属シード層を形成する工程と、
前記金属シード層の表面に沿ってシリサイド層を形成する工程と、
前記溝部に埋め込まれるように、前記シリサイド層の表面上にメッキ法を用いて銅配線層を形成する工程と、を有し、
前記金属シード層は銅シード層または銅合金シード層であり、前記シリサイド層は銅シリサイド層または銅合金シリサイド層である半導体装置の製造方法。 - 前記シリサイド層を形成する工程の前に、前記金属シード層の表面に形成された酸化膜を除去する工程を有する請求項2記載の半導体装置の製造方法。
- 前記酸化膜を除去する工程と前記シリサイド層を形成する工程とは、大気に晒されることなく連続して処理される請求項3記載の半導体装置の製造方法。
- 前記シリサイド層を形成する工程は、シラン系ガス雰囲気中で前記金属シード層をプラズマ処理することにより、前記シリサイド層を形成する工程である請求項2から4のいずれか一項記載の半導体装置の製造方法。
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JP2014116618A JP5917603B2 (ja) | 2014-06-05 | 2014-06-05 | 半導体装置およびその製造方法 |
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JP2014116618A JP5917603B2 (ja) | 2014-06-05 | 2014-06-05 | 半導体装置およびその製造方法 |
Related Parent Applications (1)
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JP2008167044A Division JP2010010337A (ja) | 2008-06-26 | 2008-06-26 | 半導体装置およびその製造方法 |
Publications (2)
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JP2014158059A JP2014158059A (ja) | 2014-08-28 |
JP5917603B2 true JP5917603B2 (ja) | 2016-05-18 |
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JP2014116618A Expired - Fee Related JP5917603B2 (ja) | 2014-06-05 | 2014-06-05 | 半導体装置およびその製造方法 |
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Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2005340460A (ja) * | 2004-05-26 | 2005-12-08 | Renesas Technology Corp | 半導体装置の形成方法 |
JP2007123853A (ja) * | 2005-09-28 | 2007-05-17 | Ebara Corp | 層形成方法、層形成装置、基材処理装置、配線形成方法、および基板の配線構造 |
JP4741965B2 (ja) * | 2006-03-23 | 2011-08-10 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
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