JP5913829B2 - プラズマ処理装置 - Google Patents

プラズマ処理装置 Download PDF

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Publication number
JP5913829B2
JP5913829B2 JP2011094601A JP2011094601A JP5913829B2 JP 5913829 B2 JP5913829 B2 JP 5913829B2 JP 2011094601 A JP2011094601 A JP 2011094601A JP 2011094601 A JP2011094601 A JP 2011094601A JP 5913829 B2 JP5913829 B2 JP 5913829B2
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JP
Japan
Prior art keywords
plasma
induction coil
magnetic field
conductor ring
induction
Prior art date
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Active
Application number
JP2011094601A
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English (en)
Japanese (ja)
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JP2012227398A (ja
JP2012227398A5 (enExample
Inventor
優作 属
優作 属
西尾　良司
良司 西尾
忠義 川口
忠義 川口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
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Hitachi High Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi High Technologies Corp filed Critical Hitachi High Technologies Corp
Priority to JP2011094601A priority Critical patent/JP5913829B2/ja
Priority to US13/190,654 priority patent/US20120267050A1/en
Publication of JP2012227398A publication Critical patent/JP2012227398A/ja
Publication of JP2012227398A5 publication Critical patent/JP2012227398A5/ja
Application granted granted Critical
Publication of JP5913829B2 publication Critical patent/JP5913829B2/ja
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H01J37/32119—Windows
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H01J37/3211—Antennas, e.g. particular shapes of coils

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
JP2011094601A 2011-04-21 2011-04-21 プラズマ処理装置 Active JP5913829B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011094601A JP5913829B2 (ja) 2011-04-21 2011-04-21 プラズマ処理装置
US13/190,654 US20120267050A1 (en) 2011-04-21 2011-07-26 Plasma processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011094601A JP5913829B2 (ja) 2011-04-21 2011-04-21 プラズマ処理装置

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2014248533A Division JP5865472B2 (ja) 2014-12-09 2014-12-09 プラズマ処理装置
JP2016057822A Division JP6239666B2 (ja) 2016-03-23 2016-03-23 プラズマ処理装置

Publications (3)

Publication Number Publication Date
JP2012227398A JP2012227398A (ja) 2012-11-15
JP2012227398A5 JP2012227398A5 (enExample) 2014-05-01
JP5913829B2 true JP5913829B2 (ja) 2016-04-27

Family

ID=47020378

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011094601A Active JP5913829B2 (ja) 2011-04-21 2011-04-21 プラズマ処理装置

Country Status (2)

Country Link
US (1) US20120267050A1 (enExample)
JP (1) JP5913829B2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140209244A1 (en) * 2013-01-25 2014-07-31 Applied Materials, Inc. Skew elimination and control in a plasma enhanced substrate processing chamber
JP6182375B2 (ja) * 2013-07-18 2017-08-16 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP6135455B2 (ja) * 2013-10-25 2017-05-31 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理方法
JP6277055B2 (ja) * 2014-04-25 2018-02-07 株式会社日立ハイテクノロジーズ プラズマ処理装置
US11081317B2 (en) * 2018-04-20 2021-08-03 Applied Materials, Inc. Modular high-frequency source
CN113424291B (zh) * 2018-12-20 2024-03-22 Asml荷兰有限公司 平台装置
US12374530B2 (en) * 2019-08-28 2025-07-29 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor processing apparatus for generating plasma
US20240071838A1 (en) * 2022-08-24 2024-02-29 Applied Materials, Inc. Substrate placement optimization using substrate measurements
US20240069537A1 (en) * 2022-08-24 2024-02-29 Applied Materials, Inc. Substrate placement optimization using substrate measurements

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6136140A (en) * 1993-01-12 2000-10-24 Tokyo Electron Limited Plasma processing apparatus
US5540800A (en) * 1994-06-23 1996-07-30 Applied Materials, Inc. Inductively coupled high density plasma reactor for plasma assisted materials processing
US6280563B1 (en) * 1997-12-31 2001-08-28 Lam Research Corporation Plasma device including a powered non-magnetic metal member between a plasma AC excitation source and the plasma
JP4384301B2 (ja) * 1999-09-13 2009-12-16 株式会社日立製作所 プラズマ処理装置
JP2002151481A (ja) * 2000-08-30 2002-05-24 Samco International Inc プラズマ処理装置及びプラズマ処理方法
US6716303B1 (en) * 2000-10-13 2004-04-06 Lam Research Corporation Vacuum plasma processor having a chamber with electrodes and a coil for plasma excitation and method of operating same
KR100486712B1 (ko) * 2002-09-04 2005-05-03 삼성전자주식회사 복층 코일 안테나를 구비한 유도결합 플라즈마 발생장치
JP2004134495A (ja) * 2002-10-09 2004-04-30 Fasl Japan Ltd プラズマ処理装置
KR100592241B1 (ko) * 2003-01-11 2006-06-23 삼성에스디아이 주식회사 유도결합형 플라즈마 처리장치
KR100553757B1 (ko) * 2003-11-19 2006-02-20 삼성에스디아이 주식회사 유도결합형 플라즈마 처리장치
JP3816081B2 (ja) * 2004-03-10 2006-08-30 松下電器産業株式会社 プラズマエッチング装置及びプラズマエッチング方法
JP2007012734A (ja) * 2005-06-29 2007-01-18 Matsushita Electric Ind Co Ltd プラズマエッチング装置及びプラズマエッチング方法
JP5072066B2 (ja) * 2006-10-16 2012-11-14 株式会社アルバック プラズマ形成方法
JP4888076B2 (ja) * 2006-11-17 2012-02-29 パナソニック株式会社 プラズマエッチング装置
JP5812561B2 (ja) * 2009-10-27 2015-11-17 東京エレクトロン株式会社 プラズマ処理装置
JP5451324B2 (ja) * 2009-11-10 2014-03-26 株式会社日立ハイテクノロジーズ プラズマ処理装置

Also Published As

Publication number Publication date
JP2012227398A (ja) 2012-11-15
US20120267050A1 (en) 2012-10-25

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