JP5911499B2 - 液体冷却式データセンタ、それに含まれるコンピュータ機器の加熱を防ぐ方法、及びプログラム - Google Patents
液体冷却式データセンタ、それに含まれるコンピュータ機器の加熱を防ぐ方法、及びプログラム Download PDFInfo
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- JP5911499B2 JP5911499B2 JP2013535436A JP2013535436A JP5911499B2 JP 5911499 B2 JP5911499 B2 JP 5911499B2 JP 2013535436 A JP2013535436 A JP 2013535436A JP 2013535436 A JP2013535436 A JP 2013535436A JP 5911499 B2 JP5911499 B2 JP 5911499B2
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- Prior art keywords
- cabinets
- coolant supply
- coolant
- cabinet
- data center
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20745—Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20836—Thermal management, e.g. server temperature control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20627—Liquid coolant without phase change
- H05K7/20645—Liquid coolant without phase change within cabinets for removing heat from sub-racks
Description
102:キャビネット
103:コンピュータ機器
104、106:冷却剤供給ライン
105:キャビネットの列
108:冷却器
110:分配線
112:遮断弁
Claims (7)
- コンピュータ機器を収容するように構成された複数のキャビネットと、
前記複数のキャビネットが冷却剤を受け取る、少なくとも2つの冷却剤供給ラインと、を含み、
前記複数のキャビネットは、少なくとも二列の列状に配置され、各列において隣接するキャビネットは異なる冷却剤供給ラインに結合され、隣接する列において互いに対角にあるキャビネットが同じ冷却剤供給ラインに結合され、全体として碁盤目状に配置されて各キャビネットが交互に異なる2つの冷却剤供給ラインに結合され、
前記異なる2つの冷却剤供給ラインは、一方の冷却剤供給ラインの冷却剤の供給量が不足した場合、もう一方の冷却剤供給ラインの冷却剤の供給量を増やすことにより、前記複数のキャビネット内の温度の均一化を図る、データセンタ。 - 前記複数のキャビネットの各々は、前記キャビネットへの吸入空気を冷却するための冷却器を含む、請求項1に記載のデータセンタ。
- 前記冷却器は後部ドア式熱交換器である、請求項2に記載のデータセンタ。
- 前記データセンタにおける前記キャビネットの配置は、前記キャビネットの熱負荷によって決定される、請求項1〜3のいずれかに記載のデータセンタ。
- 前記キャビネットの配置は、前記少なくとも2つの冷却剤供給ラインの一方が停止したときに、前記キャビネットへの吸入空気温度を32℃未満に維持するように構成される、請求項1〜4のいずれかに記載のデータセンタ。
- 前記供給冷却剤は液体である、請求項1に記載のデータセンタ。
- キャビネット内の冷却器への冷却剤が不足したときに、キャビネット内のコンピュータ機器の過熱を防ぐ方法であって、
複数のキャビネットを、少なくとも二列の列状に配置し、各列において隣接するキャビネットは異なる冷却剤供給ラインから冷却剤を受け取り、隣接する列において互いに対角にあるキャビネットが同じ冷却剤供給ラインから冷却剤を受け取るように、データセンタにおいてキャビネットを全体として碁盤目状に配置して各キャビネットが交互に異なる2つの冷却剤供給ラインに結合することを含み、
前前記異なる2つの冷却剤供給ラインは、一方の冷却剤供給ラインの冷却剤の供給量が不足した場合、もう一方の冷却剤供給ラインの冷却剤の供給量を増やすことにより、前記複数のキャビネット内のコンピュータ機器の過熱を防ぐ、方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/916,434 US8531839B2 (en) | 2010-10-29 | 2010-10-29 | Liquid cooled data center with alternating coolant supply lines |
US12/916,434 | 2010-10-29 | ||
PCT/EP2011/068845 WO2012055959A1 (en) | 2010-10-29 | 2011-10-27 | Liquid cooled data center with coolant supply lines |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014503863A JP2014503863A (ja) | 2014-02-13 |
JP5911499B2 true JP5911499B2 (ja) | 2016-04-27 |
Family
ID=45001713
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2013535436A Active JP5911499B2 (ja) | 2010-10-29 | 2011-10-27 | 液体冷却式データセンタ、それに含まれるコンピュータ機器の加熱を防ぐ方法、及びプログラム |
Country Status (8)
Country | Link |
---|---|
US (2) | US8531839B2 (ja) |
JP (1) | JP5911499B2 (ja) |
KR (1) | KR101476069B1 (ja) |
CN (1) | CN103190208B (ja) |
CA (1) | CA2814722C (ja) |
DE (1) | DE112011103570B4 (ja) |
GB (1) | GB2499158B (ja) |
WO (1) | WO2012055959A1 (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11421921B2 (en) | 2012-09-07 | 2022-08-23 | David Lane Smith | Cooling electronic devices installed in a subsurface environment |
JP2015534164A (ja) * | 2012-09-07 | 2015-11-26 | スミス,ディビッド | 地熱地下環境内に設置される電子冷却装置及び方法 |
US10653044B2 (en) | 2013-01-10 | 2020-05-12 | International Business Machines Corporation | Energy efficiency based control for a cooling system |
US9137930B2 (en) * | 2013-05-28 | 2015-09-15 | Lenovo Enterprise Solutions (Singapore) Pte. Ltd. | Protecting devices against hot air backflow in a computer system rack having a rear door heat exchanger |
WO2015059710A2 (en) * | 2013-10-21 | 2015-04-30 | Tata Consultancy Services Limited | System and method for monitoring and controlling thermal condition of a data center in real-time |
CN103901985B (zh) * | 2014-03-19 | 2017-06-06 | 华为技术有限公司 | 集装箱数据中心的液冷系统、控制方法及集装箱数据中心 |
US10098258B2 (en) | 2015-03-12 | 2018-10-09 | International Business Machines Corporation | Minimizing leakage in liquid cooled electronic equipment |
US10085367B2 (en) | 2015-03-12 | 2018-09-25 | International Business Machines Corporation | Minimizing leakage in liquid cooled electronic equipment |
WO2019019151A1 (en) * | 2017-07-28 | 2019-01-31 | Baidu.Com Times Technology (Beijing) Co., Ltd. | LIQUID COOLING DESIGN FOR ELECTRONIC CONTAINERS WITH LIQUID COOLED COMPUTER COMPONENTS IN COMPUTER CENTERS |
WO2019086523A1 (en) | 2017-10-31 | 2019-05-09 | Envion Ag | Moblie data center and method of operating the same |
US11202392B2 (en) | 2019-10-16 | 2021-12-14 | International Business Machines Corporation | Multi-coolant heat exchanger for an electronics rack |
GB2610393A (en) * | 2021-09-01 | 2023-03-08 | New Nordic Data Cooling Aps | Computer or information technology rack hall cooling equipment |
KR102503776B1 (ko) | 2022-09-29 | 2023-02-24 | 주식회사 이온 | 고밀도 데이터센터 서버를 위한 스마트 캐비닛 및 그 동작 방법 |
CN116997151A (zh) * | 2023-08-04 | 2023-11-03 | 北京有竹居网络技术有限公司 | 用于数据中心的应急供冷设备 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6938433B2 (en) * | 2002-08-02 | 2005-09-06 | Hewlett-Packard Development Company, Lp. | Cooling system with evaporators distributed in series |
US6775137B2 (en) | 2002-11-25 | 2004-08-10 | International Business Machines Corporation | Method and apparatus for combined air and liquid cooling of stacked electronics components |
US7046514B2 (en) * | 2003-03-19 | 2006-05-16 | American Power Conversion Corporation | Data center cooling |
US7106590B2 (en) * | 2003-12-03 | 2006-09-12 | International Business Machines Corporation | Cooling system and method employing multiple dedicated coolant conditioning units for cooling multiple electronics subsystems |
US7342789B2 (en) | 2005-06-30 | 2008-03-11 | International Business Machines Corporation | Method and apparatus for cooling an equipment enclosure through closed-loop, liquid-assisted air cooling in combination with direct liquid cooling |
US7644051B1 (en) * | 2006-07-28 | 2010-01-05 | Hewlett-Packard Development Company, L.P. | Management of data centers using a model |
US7477514B2 (en) * | 2007-05-04 | 2009-01-13 | International Business Machines Corporation | Method of facilitating cooling of electronics racks of a data center employing multiple cooling stations |
US8094452B1 (en) * | 2007-06-27 | 2012-01-10 | Exaflop Llc | Cooling and power grids for data center |
US8411439B1 (en) * | 2007-09-28 | 2013-04-02 | Exaflop Llc | Cooling diversity in data centers |
EP2053911B1 (en) | 2007-10-22 | 2013-05-15 | Sanyo Electric Co., Ltd. | Electronic device cooling system |
JP4940095B2 (ja) * | 2007-10-22 | 2012-05-30 | 三洋電機株式会社 | 電子機器冷却システム |
JP4914800B2 (ja) * | 2007-10-22 | 2012-04-11 | 三洋電機株式会社 | 電子機器冷却装置 |
US7757506B2 (en) * | 2007-11-19 | 2010-07-20 | International Business Machines Corporation | System and method for facilitating cooling of a liquid-cooled electronics rack |
US8250877B2 (en) | 2008-03-10 | 2012-08-28 | Cooligy Inc. | Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door |
JP2010041007A (ja) | 2008-08-08 | 2010-02-18 | Hitachi Information & Communication Engineering Ltd | 冷却ユニット、電子装置ラック、冷却システム及びその構築方法 |
JP2010211363A (ja) * | 2009-03-09 | 2010-09-24 | Sanyo Electric Co Ltd | 電子機器冷却装置 |
JP2010218330A (ja) * | 2009-03-18 | 2010-09-30 | Sanyo Electric Co Ltd | 電子機器冷却システム |
CN102103399B (zh) * | 2011-02-18 | 2013-10-23 | 艾默生网络能源有限公司 | 超高热密度冷却系统 |
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2010
- 2010-10-29 US US12/916,434 patent/US8531839B2/en active Active
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2011
- 2011-10-27 CA CA2814722A patent/CA2814722C/en active Active
- 2011-10-27 KR KR1020137007457A patent/KR101476069B1/ko active IP Right Grant
- 2011-10-27 GB GB1309199.6A patent/GB2499158B/en active Active
- 2011-10-27 WO PCT/EP2011/068845 patent/WO2012055959A1/en active Application Filing
- 2011-10-27 CN CN201180052566.3A patent/CN103190208B/zh active Active
- 2011-10-27 JP JP2013535436A patent/JP5911499B2/ja active Active
- 2011-10-27 DE DE112011103570.5T patent/DE112011103570B4/de active Active
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Also Published As
Publication number | Publication date |
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US9258931B2 (en) | 2016-02-09 |
CA2814722A1 (en) | 2012-05-03 |
CN103190208B (zh) | 2016-02-17 |
KR101476069B1 (ko) | 2014-12-23 |
KR20130109125A (ko) | 2013-10-07 |
GB201309199D0 (en) | 2013-07-03 |
GB2499158B (en) | 2014-08-20 |
DE112011103570T5 (de) | 2013-07-25 |
GB2499158A (en) | 2013-08-07 |
CA2814722C (en) | 2018-09-04 |
US8531839B2 (en) | 2013-09-10 |
US20130299137A1 (en) | 2013-11-14 |
DE112011103570B4 (de) | 2022-12-22 |
WO2012055959A1 (en) | 2012-05-03 |
CN103190208A (zh) | 2013-07-03 |
US20120103566A1 (en) | 2012-05-03 |
JP2014503863A (ja) | 2014-02-13 |
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