JP2014503863A - 液体冷却式データセンタ、それに含まれるコンピュータ機器の加熱を防ぐ方法、及びプログラム - Google Patents
液体冷却式データセンタ、それに含まれるコンピュータ機器の加熱を防ぐ方法、及びプログラム Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 41
- 238000010438 heat treatment Methods 0.000 title description 2
- 239000002826 coolant Substances 0.000 claims abstract description 103
- 239000007788 liquid Substances 0.000 claims abstract description 9
- 238000001816 cooling Methods 0.000 claims abstract description 8
- 238000013021 overheating Methods 0.000 claims abstract description 8
- 238000004590 computer program Methods 0.000 claims description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 12
- 230000006870 function Effects 0.000 description 9
- 239000000498 cooling water Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000000644 propagated effect Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 230000003466 anti-cipated effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20745—Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20836—Thermal management, e.g. server temperature control
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20627—Liquid coolant without phase change
- H05K7/20645—Liquid coolant without phase change within cabinets for removing heat from sub-racks
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
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Abstract
【解決手段】 キャビネット内の冷却器への冷却剤の供給が欠乏したとき、キャビネット内のコンピュータ機器の過熱を防ぐ方法である。例示的な実施形態は、複数のキャビネットと、少なくとも2つの冷却剤供給ラインとを含むデータセンタである。キャビネットはコンピュータ機器を収容するように構成され、冷却剤供給ラインはキャビネットに冷却剤を与える。さらに、キャビネットは、少なくとも一列の隣接するキャビネットに配置され、隣接するキャビネットの各列が、交互する冷却剤供給ラインから冷却剤を受け取るようにされる。
【選択図】 図1
Description
102:キャビネット
103:コンピュータ機器
104、106:冷却剤供給ライン
105:キャビネットの列
108:冷却器
110:分配線
112:遮断弁
Claims (21)
- コンピュータ機器を収容するように構成された複数のキャビネットと、
前記複数のキャビネットが冷却剤を受け取る、少なくとも2つの冷却剤供給ラインと、
を含み、
前記複数のキャビネットは、少なくとも一列の隣接するキャビネットに配置され、隣接するキャビネットの各列が前記交互する冷却剤供給ラインから冷却剤を受け取るようにされる、データセンタ。 - 前記キャビネットの列内の隣り合うキャビネットは、前記2つの冷却剤供給ラインの異なるものに結合される、請求項1に記載のデータセンタ。
- 前記複数のキャビネットは、碁盤目状に、前記交互する冷却剤供給ラインから冷却剤を受け取る、請求項1又は請求項2に記載のデータセンタ。
- 前記複数のキャビネットの隣接するキャビネットのいずれも同じ冷却剤供給ラインに結合されず、互いに対角にあるキャビネットが同じ冷却剤供給ラインに結合される、前記請求項のいずれかに記載のデータセンタ。
- 前記複数のキャビネットの各々は、前記キャビネットへの吸入空気を冷却するための冷却器を含む、前記請求項のいずれかに記載のデータセンタ。
- 前記冷却器は後部ドア式熱交換器である、請求項5に記載のデータセンタ。
- 前記データセンタにおける前記キャビネットの配置は、前記キャビネットの熱負荷によって決定される、前記請求項のいずれかに記載のデータセンタ。
- 前記キャビネットの配置は、前記少なくとも2つの冷却剤供給ラインの一方が停止したときに、前記キャビネットへの吸入空気温度を32℃未満に維持するように構成される、前記請求項のいずれかに記載のデータセンタ。
- 前記供給冷却剤は液体である、前記請求項のいずれかに記載のデータセンタ。
- キャビネット内の冷却器への冷却剤が不足したときに、キャビネット内のコンピュータ機器の過熱を防ぐ方法であって、
少なくとも一列の隣接するキャビネットが、各々が前記冷却剤を複数のキャビネットに供給する、交互する前記冷却剤供給ラインから冷却剤を受け取るように、データセンタにおいてキャビネットを配置することを含む方法。 - 前記供給ラインの一方が故障したときに、故障していない供給ラインを通る前記冷却剤の流れを増大させることをさらに含む、請求項10に記載の方法。
- 前記冷却器が後部ドア式熱交換器である、請求項10又は請求項11に記載の方法。
- 前記キャビネットを配置することは、前記列内の隣り合うキャビネットが前記冷却剤の異なる供給ラインに結合されるように、前記キャビネットを構成することを含む、請求項10から請求項12までのいずれかに記載の方法。
- 前記キャビネットを配置することは、碁盤目状に、前記交互する冷却剤供給ラインから前記冷却剤を受け取るように、前記キャビネットを構成することを含む、請求項10から請求項13までのいずれかに記載の方法。
- 前記隣接するキャビネットのいずれも同じ供給ラインに結合されず、互いに対角にあるキャビネットが同じ供給ラインに結合される、請求項10から請求項14までのいずれかに記載の方法。
- 前記キャビネットを配置することは、少なくとも部分的に、前記キャビネットの熱負荷に基づいている、請求項10から請求項15までのいずれかに記載の方法。
- 前記キャビネットを配置することは、前記供給ラインの一方が停止したときに、前記キャビネットへの吸入空気温度を32℃未満に維持するように構成される、請求項10から請求項16までのいずれかに記載の方法。
- 前記供給冷却剤か液体である、請求項10から請求項17までのいずれかに記載の方法。
- 前記液体は冷水である、請求項18に記載の方法。
- コンピュータ・システム内にロードされ、そこで実行されたときに、前記コンピュータ・システムに、請求項10から請求項19までのいずれかに記載の方法の全てのステップを実行させる、コンピュータ可読媒体上に格納されたコンピュータ・プログラム・コードを含むコンピュータ・プログラム。
- 前記方法は、
キャビネットの列が交互する前記冷却剤供給ラインから冷却剤を受け取るように、データセンタにおける前記キャビネットの配置をシミュレーションすることと、
ある期間にわたる供給ラインの故障に起因する温度上昇を計算すること、
を含む、請求項20に記載のコンピュータ・プログラム。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/916,434 US8531839B2 (en) | 2010-10-29 | 2010-10-29 | Liquid cooled data center with alternating coolant supply lines |
US12/916,434 | 2010-10-29 | ||
PCT/EP2011/068845 WO2012055959A1 (en) | 2010-10-29 | 2011-10-27 | Liquid cooled data center with coolant supply lines |
Publications (2)
Publication Number | Publication Date |
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JP2014503863A true JP2014503863A (ja) | 2014-02-13 |
JP5911499B2 JP5911499B2 (ja) | 2016-04-27 |
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Application Number | Title | Priority Date | Filing Date |
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JP2013535436A Active JP5911499B2 (ja) | 2010-10-29 | 2011-10-27 | 液体冷却式データセンタ、それに含まれるコンピュータ機器の加熱を防ぐ方法、及びプログラム |
Country Status (8)
Country | Link |
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US (2) | US8531839B2 (ja) |
JP (1) | JP5911499B2 (ja) |
KR (1) | KR101476069B1 (ja) |
CN (1) | CN103190208B (ja) |
CA (1) | CA2814722C (ja) |
DE (1) | DE112011103570B4 (ja) |
GB (1) | GB2499158B (ja) |
WO (1) | WO2012055959A1 (ja) |
Families Citing this family (13)
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US11421921B2 (en) | 2012-09-07 | 2022-08-23 | David Lane Smith | Cooling electronic devices installed in a subsurface environment |
AU2013313223A1 (en) | 2012-09-07 | 2015-03-19 | David Smith | Apparatus and method for geothermally cooling electronic devices installed in a subsurface environment |
US10653044B2 (en) | 2013-01-10 | 2020-05-12 | International Business Machines Corporation | Energy efficiency based control for a cooling system |
US9137930B2 (en) * | 2013-05-28 | 2015-09-15 | Lenovo Enterprise Solutions (Singapore) Pte. Ltd. | Protecting devices against hot air backflow in a computer system rack having a rear door heat exchanger |
WO2015059710A2 (en) * | 2013-10-21 | 2015-04-30 | Tata Consultancy Services Limited | System and method for monitoring and controlling thermal condition of a data center in real-time |
CN103901985B (zh) * | 2014-03-19 | 2017-06-06 | 华为技术有限公司 | 集装箱数据中心的液冷系统、控制方法及集装箱数据中心 |
US10098258B2 (en) | 2015-03-12 | 2018-10-09 | International Business Machines Corporation | Minimizing leakage in liquid cooled electronic equipment |
US10085367B2 (en) | 2015-03-12 | 2018-09-25 | International Business Machines Corporation | Minimizing leakage in liquid cooled electronic equipment |
CN110447315B (zh) * | 2017-07-28 | 2020-11-06 | 百度时代网络技术(北京)有限公司 | 用于数据中心中的使it部件液体冷却的电子器件机架的液体冷却设计 |
WO2019086523A1 (en) | 2017-10-31 | 2019-05-09 | Envion Ag | Moblie data center and method of operating the same |
US11202392B2 (en) | 2019-10-16 | 2021-12-14 | International Business Machines Corporation | Multi-coolant heat exchanger for an electronics rack |
GB2610393A (en) * | 2021-09-01 | 2023-03-08 | New Nordic Data Cooling Aps | Computer or information technology rack hall cooling equipment |
KR102503776B1 (ko) | 2022-09-29 | 2023-02-24 | 주식회사 이온 | 고밀도 데이터센터 서버를 위한 스마트 캐비닛 및 그 동작 방법 |
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- 2011-10-27 WO PCT/EP2011/068845 patent/WO2012055959A1/en active Application Filing
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US20090100848A1 (en) * | 2007-10-22 | 2009-04-23 | Sanyo Electric Co., Ltd. | Electronic device cooling system and electronic device cooling apparatus |
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Publication number | Publication date |
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CN103190208B (zh) | 2016-02-17 |
DE112011103570B4 (de) | 2022-12-22 |
WO2012055959A1 (en) | 2012-05-03 |
CA2814722C (en) | 2018-09-04 |
GB201309199D0 (en) | 2013-07-03 |
US20130299137A1 (en) | 2013-11-14 |
KR101476069B1 (ko) | 2014-12-23 |
DE112011103570T5 (de) | 2013-07-25 |
US9258931B2 (en) | 2016-02-09 |
CA2814722A1 (en) | 2012-05-03 |
KR20130109125A (ko) | 2013-10-07 |
GB2499158A (en) | 2013-08-07 |
CN103190208A (zh) | 2013-07-03 |
GB2499158B (en) | 2014-08-20 |
US8531839B2 (en) | 2013-09-10 |
JP5911499B2 (ja) | 2016-04-27 |
US20120103566A1 (en) | 2012-05-03 |
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