JP5903930B2 - 基板搬送装置及び当該基板搬送装置を用いた半導体製造装置 - Google Patents

基板搬送装置及び当該基板搬送装置を用いた半導体製造装置 Download PDF

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Publication number
JP5903930B2
JP5903930B2 JP2012040458A JP2012040458A JP5903930B2 JP 5903930 B2 JP5903930 B2 JP 5903930B2 JP 2012040458 A JP2012040458 A JP 2012040458A JP 2012040458 A JP2012040458 A JP 2012040458A JP 5903930 B2 JP5903930 B2 JP 5903930B2
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Prior art keywords
rod
substrate
vacuum
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chamber
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JP2012040458A
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English (en)
Japanese (ja)
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JP2013175670A (ja
Inventor
正敏 小野田
正敏 小野田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissin Ion Equipment Co Ltd
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Nissin Ion Equipment Co Ltd
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Filing date
Publication date
Application filed by Nissin Ion Equipment Co Ltd filed Critical Nissin Ion Equipment Co Ltd
Priority to JP2012040458A priority Critical patent/JP5903930B2/ja
Priority to CN201210425485.XA priority patent/CN103295943B/zh
Priority to KR1020120132278A priority patent/KR101401279B1/ko
Priority to TW101148332A priority patent/TWI492327B/zh
Publication of JP2013175670A publication Critical patent/JP2013175670A/ja
Application granted granted Critical
Publication of JP5903930B2 publication Critical patent/JP5903930B2/ja
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
JP2012040458A 2012-02-27 2012-02-27 基板搬送装置及び当該基板搬送装置を用いた半導体製造装置 Active JP5903930B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012040458A JP5903930B2 (ja) 2012-02-27 2012-02-27 基板搬送装置及び当該基板搬送装置を用いた半導体製造装置
CN201210425485.XA CN103295943B (zh) 2012-02-27 2012-10-30 基板输送装置和使用该基板输送装置的半导体制造装置
KR1020120132278A KR101401279B1 (ko) 2012-02-27 2012-11-21 기판반송장치 및 당해 기판반송장치를 이용한 반도체 제조장치
TW101148332A TWI492327B (zh) 2012-02-27 2012-12-19 A substrate transfer device, and a semiconductor manufacturing apparatus using the substrate transfer device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012040458A JP5903930B2 (ja) 2012-02-27 2012-02-27 基板搬送装置及び当該基板搬送装置を用いた半導体製造装置

Publications (2)

Publication Number Publication Date
JP2013175670A JP2013175670A (ja) 2013-09-05
JP5903930B2 true JP5903930B2 (ja) 2016-04-13

Family

ID=49096605

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012040458A Active JP5903930B2 (ja) 2012-02-27 2012-02-27 基板搬送装置及び当該基板搬送装置を用いた半導体製造装置

Country Status (4)

Country Link
JP (1) JP5903930B2 (ko)
KR (1) KR101401279B1 (ko)
CN (1) CN103295943B (ko)
TW (1) TWI492327B (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104597715B (zh) * 2013-10-30 2016-04-13 沈阳芯源微电子设备有限公司 光刻机对接接口模块的可抽拉式水平调节装置
CN104593744A (zh) * 2013-11-01 2015-05-06 韦学运 一种等离子体处理盾构刀具的自动化设备
CN105702599B (zh) * 2014-11-27 2018-07-06 北京北方华创微电子装备有限公司 反应腔室的上盖结构和反应腔室
TW201741483A (zh) * 2016-02-25 2017-12-01 愛發科股份有限公司 真空裝置
CN110144564A (zh) * 2019-06-27 2019-08-20 浙江工业大学 一种适用于磁控溅射仪的靶与基之间间距自动调节装置
CN111232658B (zh) * 2020-01-14 2021-07-30 黄桂婷 一种吸附效果好的工作可靠的码垛机

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08288361A (ja) * 1995-04-13 1996-11-01 Nissin Electric Co Ltd 真空処理装置
JPH1096074A (ja) * 1996-09-19 1998-04-14 Nissin Electric Co Ltd 基板処理装置
JP3798309B2 (ja) * 2001-12-13 2006-07-19 株式会社浅野研究所 熱成形装置および熱成形方法
JP3982402B2 (ja) * 2002-02-28 2007-09-26 東京エレクトロン株式会社 処理装置及び処理方法
KR100631822B1 (ko) * 2004-09-14 2006-10-09 한국표준과학연구원 플라즈마 공정챔버의 기판냉각장치 및 방법
JP4736564B2 (ja) * 2005-06-23 2011-07-27 東京エレクトロン株式会社 載置台装置の取付構造及び処理装置
WO2010019430A2 (en) * 2008-08-12 2010-02-18 Applied Materials, Inc. Electrostatic chuck assembly
JP2010135536A (ja) * 2008-12-04 2010-06-17 Tokyo Electron Ltd ロードロック装置および真空処理システム
JP2011018799A (ja) * 2009-07-09 2011-01-27 Toyo Mach & Metal Co Ltd イオンドーピング装置
TWI395633B (zh) * 2010-04-23 2013-05-11 私立中原大學 肘節式定位平台

Also Published As

Publication number Publication date
KR101401279B1 (ko) 2014-05-30
CN103295943B (zh) 2016-03-30
CN103295943A (zh) 2013-09-11
JP2013175670A (ja) 2013-09-05
TW201336011A (zh) 2013-09-01
TWI492327B (zh) 2015-07-11
KR20130098125A (ko) 2013-09-04

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