JP2013175670A - 基板搬送装置及び当該基板搬送装置を用いた半導体製造装置 - Google Patents
基板搬送装置及び当該基板搬送装置を用いた半導体製造装置 Download PDFInfo
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- JP2013175670A JP2013175670A JP2012040458A JP2012040458A JP2013175670A JP 2013175670 A JP2013175670 A JP 2013175670A JP 2012040458 A JP2012040458 A JP 2012040458A JP 2012040458 A JP2012040458 A JP 2012040458A JP 2013175670 A JP2013175670 A JP 2013175670A
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- 239000000758 substrate Substances 0.000 title claims abstract description 182
- 239000004065 semiconductor Substances 0.000 title claims abstract description 15
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 238000012546 transfer Methods 0.000 claims description 57
- 238000007789 sealing Methods 0.000 claims description 7
- 239000000428 dust Substances 0.000 abstract description 14
- 238000012423 maintenance Methods 0.000 abstract description 7
- 238000005452 bending Methods 0.000 abstract description 5
- 238000005468 ion implantation Methods 0.000 description 25
- 238000012856 packing Methods 0.000 description 19
- 230000003749 cleanliness Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 7
- 238000010884 ion-beam technique Methods 0.000 description 6
- 238000003825 pressing Methods 0.000 description 6
- 238000005192 partition Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 230000006837 decompression Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Physical Vapour Deposition (AREA)
Abstract
【解決手段】基板搬送台4と、トグルリンク機構1と、真空室9又は真空予備室8を形成する壁体を貫通して、前記基板搬送台4と前記トグルリンク機構1との間を接続する複数のロッド21とを備え、前記トグルリンク機構1が、前記トグルリンク11の屈伸により前記ロッド21を進退させることによって前記基板搬送台4を移動させ、前記トグルリンク1が伸びた状態において前記基板搬送台4を前記閉塞位置に配置させるように構成されており、前記ロッド21と前記壁体との隙間を気密に密閉するシール構造3を設けた。
【選択図】図2
Description
11 :トグルリンク
12 :駆動部
13 :案内部
21 :ロッド
22 :調整機構
3 :ベローズ、Oリング(シール機構)
4 :基板搬送台
42 :境界開口
100 :基板搬送装置
200 :イオン注入装置
W :基板
11 :トグルリンク
12 :駆動部
13 :案内部
21 :ロッド
22 :調整機構
3 :ベローズ(シール構造)
31 :Oリング(シール構造)
4 :基板搬送台
42 :境界開口
100 :基板搬送装置
200 :イオン注入装置
W :基板
Claims (10)
- 所定の真空度に保たれている真空室と、外部との間で基板の搬出入を行うための真空予備室との境界開口を気密に閉塞する閉塞位置と前記境界開口を開放する前記真空室内の開放位置との間を移動可能に構成された基板搬送台と、
前記真空室及び前記真空予備室の外部に設けられたものであって、互いに枢結された複数のリンク要素からなるトグルリンクを具備し、前記トグルリンクを屈伸させることによって出力端を進退させるトグルリンク機構と、
前記真空室又は前記真空予備室を形成する壁体を貫通して前記基板搬送台と前記トグルリンク機構の出力端との間に介在し、前記出力端の進退動作を前記基板搬送台に伝達する1又は複数のロッドとを備え、
前記ロッドと前記壁体との間を気密に密閉するシール構造が設けられていることを特徴とする基板搬送装置。 - 前記ロッドが複数設けられており、
前記ロッドの進退方向から視て前記トグルリンク機構が、各ロッドの内側に設けられている請求項1記載の基板搬送装置。 - 前記トグルリンク機構が、その出力端の移動方向を前記ロッドの進退方向に規制する案内部を更に備え、
前記ロッドの進退方向から視て前記案内部が各ロッドよりも内側に配置されている請求項1又は2記載の基板搬送装置。 - 前記案内部が、前記ロッドの進退方向に延びるガイドバーと、前記トグルリンク及び前記ロッドの一端が取り付けられ、前記ガイドバーに沿って移動するスライダーと、前記ガイドバーを前記壁体の外側に取り付けるための取り付け部とを具備し、
前記ロッドの進退方向から視て前記取り付け部及びガイドバーが各ロッドの内側に配置されている請求項1乃至3いずれかに記載の基板搬送装置。 - 前記シール構造が、前記壁体の外表面と前記トグルリンク機構との間に設けられて前記ロッドを覆うベローズを有したものである請求項1乃至4いずれかに記載の基板搬送装置。
- 前記シール構造が、前記壁体の内表面と前記基板搬送台との間に設けられて前記ロッドを覆うベローズを有したものである請求項1乃至5いずれかに記載の基板搬送装置。
- 前記シール構造が、前記ロッドが貫通する貫通孔の内面に設けられたシールリングを有したものである請求項1乃至6いずれかに記載の基板搬送装置。
- 前記トグルリンクが、前記基板搬送台が前記閉塞位置にある場合に各リンク要素の少なくとも3つの枢結点が直線上に並ぶ伸びた状態となるように構成された請求項1乃至7いずれかに記載の基板搬送装置。
- 前記トグルリンク機構から前記基板搬送台までの前記ロッドの長さを調整する調整機構が設けられた請求項1乃至8いずれかに記載の基板搬送装置。
- 請求項1乃至9いずれかに記載の基板搬送装置を備えた半導体製造装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012040458A JP5903930B2 (ja) | 2012-02-27 | 2012-02-27 | 基板搬送装置及び当該基板搬送装置を用いた半導体製造装置 |
CN201210425485.XA CN103295943B (zh) | 2012-02-27 | 2012-10-30 | 基板输送装置和使用该基板输送装置的半导体制造装置 |
KR1020120132278A KR101401279B1 (ko) | 2012-02-27 | 2012-11-21 | 기판반송장치 및 당해 기판반송장치를 이용한 반도체 제조장치 |
TW101148332A TWI492327B (zh) | 2012-02-27 | 2012-12-19 | A substrate transfer device, and a semiconductor manufacturing apparatus using the substrate transfer device |
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JP2012040458A JP5903930B2 (ja) | 2012-02-27 | 2012-02-27 | 基板搬送装置及び当該基板搬送装置を用いた半導体製造装置 |
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JP2013175670A true JP2013175670A (ja) | 2013-09-05 |
JP5903930B2 JP5903930B2 (ja) | 2016-04-13 |
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JP (1) | JP5903930B2 (ja) |
KR (1) | KR101401279B1 (ja) |
CN (1) | CN103295943B (ja) |
TW (1) | TWI492327B (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104593744A (zh) * | 2013-11-01 | 2015-05-06 | 韦学运 | 一种等离子体处理盾构刀具的自动化设备 |
CN105702599A (zh) * | 2014-11-27 | 2016-06-22 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 反应腔室的上盖结构和反应腔室 |
WO2017146204A1 (ja) * | 2016-02-25 | 2017-08-31 | 株式会社アルバック | 真空装置 |
CN110144564A (zh) * | 2019-06-27 | 2019-08-20 | 浙江工业大学 | 一种适用于磁控溅射仪的靶与基之间间距自动调节装置 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104597715B (zh) * | 2013-10-30 | 2016-04-13 | 沈阳芯源微电子设备有限公司 | 光刻机对接接口模块的可抽拉式水平调节装置 |
CN111232658B (zh) * | 2020-01-14 | 2021-07-30 | 黄桂婷 | 一种吸附效果好的工作可靠的码垛机 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08288361A (ja) * | 1995-04-13 | 1996-11-01 | Nissin Electric Co Ltd | 真空処理装置 |
JPH1096074A (ja) * | 1996-09-19 | 1998-04-14 | Nissin Electric Co Ltd | 基板処理装置 |
JP2003181911A (ja) * | 2001-12-13 | 2003-07-03 | Asano Laboratories Co Ltd | 熱成形装置および熱成形方法 |
KR20060024486A (ko) * | 2004-09-14 | 2006-03-17 | 한국표준과학연구원 | 플라즈마 공정챔버의 기판냉각장치 및 방법 |
JP2011018799A (ja) * | 2009-07-09 | 2011-01-27 | Toyo Mach & Metal Co Ltd | イオンドーピング装置 |
JP2011530833A (ja) * | 2008-08-12 | 2011-12-22 | アプライド マテリアルズ インコーポレイテッド | 静電チャックアセンブリ |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3982402B2 (ja) * | 2002-02-28 | 2007-09-26 | 東京エレクトロン株式会社 | 処理装置及び処理方法 |
JP4736564B2 (ja) * | 2005-06-23 | 2011-07-27 | 東京エレクトロン株式会社 | 載置台装置の取付構造及び処理装置 |
JP2010135536A (ja) * | 2008-12-04 | 2010-06-17 | Tokyo Electron Ltd | ロードロック装置および真空処理システム |
TWI395633B (zh) * | 2010-04-23 | 2013-05-11 | 私立中原大學 | 肘節式定位平台 |
-
2012
- 2012-02-27 JP JP2012040458A patent/JP5903930B2/ja active Active
- 2012-10-30 CN CN201210425485.XA patent/CN103295943B/zh active Active
- 2012-11-21 KR KR1020120132278A patent/KR101401279B1/ko active IP Right Grant
- 2012-12-19 TW TW101148332A patent/TWI492327B/zh active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08288361A (ja) * | 1995-04-13 | 1996-11-01 | Nissin Electric Co Ltd | 真空処理装置 |
JPH1096074A (ja) * | 1996-09-19 | 1998-04-14 | Nissin Electric Co Ltd | 基板処理装置 |
JP2003181911A (ja) * | 2001-12-13 | 2003-07-03 | Asano Laboratories Co Ltd | 熱成形装置および熱成形方法 |
KR20060024486A (ko) * | 2004-09-14 | 2006-03-17 | 한국표준과학연구원 | 플라즈마 공정챔버의 기판냉각장치 및 방법 |
JP2011530833A (ja) * | 2008-08-12 | 2011-12-22 | アプライド マテリアルズ インコーポレイテッド | 静電チャックアセンブリ |
JP2011018799A (ja) * | 2009-07-09 | 2011-01-27 | Toyo Mach & Metal Co Ltd | イオンドーピング装置 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104593744A (zh) * | 2013-11-01 | 2015-05-06 | 韦学运 | 一种等离子体处理盾构刀具的自动化设备 |
CN105702599A (zh) * | 2014-11-27 | 2016-06-22 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 反应腔室的上盖结构和反应腔室 |
WO2017146204A1 (ja) * | 2016-02-25 | 2017-08-31 | 株式会社アルバック | 真空装置 |
CN110144564A (zh) * | 2019-06-27 | 2019-08-20 | 浙江工业大学 | 一种适用于磁控溅射仪的靶与基之间间距自动调节装置 |
Also Published As
Publication number | Publication date |
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JP5903930B2 (ja) | 2016-04-13 |
CN103295943B (zh) | 2016-03-30 |
KR20130098125A (ko) | 2013-09-04 |
TW201336011A (zh) | 2013-09-01 |
KR101401279B1 (ko) | 2014-05-30 |
TWI492327B (zh) | 2015-07-11 |
CN103295943A (zh) | 2013-09-11 |
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