JP5903672B2 - 発光装置及びそれを用いた照明装置 - Google Patents
発光装置及びそれを用いた照明装置 Download PDFInfo
- Publication number
- JP5903672B2 JP5903672B2 JP2011113979A JP2011113979A JP5903672B2 JP 5903672 B2 JP5903672 B2 JP 5903672B2 JP 2011113979 A JP2011113979 A JP 2011113979A JP 2011113979 A JP2011113979 A JP 2011113979A JP 5903672 B2 JP5903672 B2 JP 5903672B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- light emitting
- substrate
- solid
- emitting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45139—Silver (Ag) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45147—Copper (Cu) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Description
10 照明装置
2 LED(固体発光素子)
3 基板
4 光学部材
41 入射面
41a 収容部
42 透過面
42a 凹状湾曲面
43 全反射面
43a 凸状湾曲面
44 接続面
44a 側方透過面
5 器具本体(保持部材)
6 施工面
7 カバー部材
71a 拡散透過部
72a 透過部
Claims (6)
- 基板と、前記基板上に実装される固体発光素子と、前記固体発光素子の光導出方向に設けられた光学部材と、を備え、
前記光学部材は、
前記固体発光素子及び前記基板を覆うように配され、且つ前記基板の周縁部よりも外周側に延設されており、
前記固体発光素子と対向して、該固体発光素子からの出射光を入射する入射面と、
前記入射面と対峙し、該入射面から入射された光を透過する透過面と、
前記透過面の外周側に位置し、前記固体発光素子からの出射光を全反射する全反射面と、
前記全反射面の周縁部と前記入射面とを接続する接続面と、を有し、
前記接続面は、前記全反射面で全反射された光を透過して前記全反射面よりも外周側へ出射する側方透過面を有し、
前記側方透過面は、前記入射面側から前記全反射面側へ逆テーパ状に傾斜するように形成されており、
前記全反射面は、前記固体発光素子の実装位置を焦点とする放物線の一部の形状を含むように、且つ前記透過面と滑らかに連続する曲面として形成されていることを特徴とする発光装置。 - 前記入射面は、前記固体発光素子を収納する凹状の収容部を有し、
前記透過面は、前記固体発光素子方向に凹状となる凹状湾曲面を有し、
前記全反射面は、前記固体発光素子の光導出方向に凸状となる凸状湾曲面を有することを特徴とする請求項1に記載の発光装置。 - 前記基板上に複数の固体発光素子が実装され、
前記光学部材は、複数の前記固体発光素子を覆うように設けられていることを特徴とする請求項1又は請求項2に記載の発光装置。 - 前記基板上に複数の固体発光素子が実装され、
前記光学部材は、前記複数の固体発光素子のうち少なくとも前記基板の周縁部に近接する固体発光素子に設けられていることを特徴とする請求項1又は請求項2の発光装置。 - 請求項1乃至請求項4のいずれか一項に記載の発光装置を用いた照明装置。
- 前記光学部材を覆うカバー部材を更に備え、
該カバー部材は、前記入射面及び前記全反射面と対向する面に、光を拡散して透過する拡散透過部を有し、前記側方透過面と対向する面に、光を透過する透過部を有していることを特徴とする請求項5に記載の照明装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011113979A JP5903672B2 (ja) | 2011-05-20 | 2011-05-20 | 発光装置及びそれを用いた照明装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011113979A JP5903672B2 (ja) | 2011-05-20 | 2011-05-20 | 発光装置及びそれを用いた照明装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012243641A JP2012243641A (ja) | 2012-12-10 |
JP5903672B2 true JP5903672B2 (ja) | 2016-04-13 |
Family
ID=47465107
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011113979A Active JP5903672B2 (ja) | 2011-05-20 | 2011-05-20 | 発光装置及びそれを用いた照明装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5903672B2 (ja) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP4019833A1 (en) | 2012-10-30 | 2022-06-29 | Seoul Semiconductor Co., Ltd. | Lens and light emitting module for surface illumination |
JP6112389B2 (ja) * | 2012-12-10 | 2017-04-12 | パナソニックIpマネジメント株式会社 | 照明装置 |
KR20140132548A (ko) * | 2013-05-08 | 2014-11-18 | 주식회사 케이엠더블유 | 스탠드형 엘이디 조명장치 |
CN104154471A (zh) * | 2013-05-13 | 2014-11-19 | 欧普照明电器(中山)有限公司 | 一种led直下式面板灯具 |
JP6065280B2 (ja) * | 2013-05-17 | 2017-01-25 | パナソニックIpマネジメント株式会社 | 発光モジュールおよび照明器具 |
KR102108204B1 (ko) | 2013-08-26 | 2020-05-08 | 서울반도체 주식회사 | 면 조명용 렌즈 및 발광 모듈 |
JP6250137B2 (ja) * | 2014-03-04 | 2017-12-20 | 三菱電機株式会社 | 光源装置及び照明装置 |
US10278243B2 (en) | 2014-03-06 | 2019-04-30 | Seoul Semiconductor Co., Ltd. | Backlight module with MJT LED and backlight unit including the same |
KR102364160B1 (ko) * | 2014-03-06 | 2022-02-21 | 서울반도체 주식회사 | Mjt led를 이용한 백라이트 모듈 및 이를 포함하는 백라이트 유닛 |
JP6304538B2 (ja) * | 2014-03-28 | 2018-04-04 | パナソニックIpマネジメント株式会社 | 照明器具 |
WO2015185519A1 (en) | 2014-06-02 | 2015-12-10 | Koninklijke Philips N.V. | An optical system for collimation of light |
CN104456301B (zh) * | 2014-11-15 | 2018-02-16 | 青岛歌尔声学科技有限公司 | 一种led光源模块、led灯条和直下式背光模组 |
JP6693044B2 (ja) | 2015-03-13 | 2020-05-13 | 日亜化学工業株式会社 | 発光装置およびその製造方法 |
JP6544009B2 (ja) * | 2015-04-10 | 2019-07-17 | 岩崎電気株式会社 | 照明器具 |
KR200487775Y1 (ko) * | 2017-01-24 | 2018-10-30 | 김민재 | 다운라이트 |
CN107023787A (zh) * | 2017-05-27 | 2017-08-08 | 欧普照明股份有限公司 | 配光元件、光源模组和照明装置 |
CN113007618B (zh) * | 2019-12-19 | 2023-11-28 | 隆达电子股份有限公司 | 光学元件与发光装置 |
KR102285545B1 (ko) * | 2020-03-03 | 2021-08-05 | (주)현대룩스온 | 벽면 구조물상에 균일 조사 성능이 구비된 led조명기구 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4239525B2 (ja) * | 2002-08-29 | 2009-03-18 | 豊田合成株式会社 | 発光ダイオード |
JP4870950B2 (ja) * | 2005-08-09 | 2012-02-08 | 株式会社光波 | 光放射用光源ユニット及びそれを用いた面状発光装置 |
JP5025612B2 (ja) * | 2008-10-06 | 2012-09-12 | 三菱電機株式会社 | Led光源及びそれを用いた発光体 |
JP5495091B2 (ja) * | 2008-12-12 | 2014-05-21 | 東芝ライテック株式会社 | 照明器具 |
WO2010092632A1 (ja) * | 2009-02-12 | 2010-08-19 | パナソニック株式会社 | 照明用レンズ、発光装置、面光源および液晶ディスプレイ装置 |
-
2011
- 2011-05-20 JP JP2011113979A patent/JP5903672B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2012243641A (ja) | 2012-12-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5903672B2 (ja) | 発光装置及びそれを用いた照明装置 | |
JP5899508B2 (ja) | 発光装置及びそれを用いた照明装置 | |
JP5899507B2 (ja) | 発光装置及びそれを用いた照明装置 | |
JP5047162B2 (ja) | 発光装置 | |
JP2006237264A (ja) | 発光装置および照明装置 | |
JP2007266356A (ja) | 発光装置およびそれを用いた照明装置 | |
EP2565947A2 (en) | Light-emitting device and illumination device using same | |
TW200305291A (en) | Light emitting diode, LED lighting module, and lamp apparatus | |
JP4143043B2 (ja) | 発光装置および照明装置 | |
JP2006049814A (ja) | 発光装置および照明装置 | |
JP5796209B2 (ja) | 発光装置及びそれを用いた照明装置 | |
JP4948818B2 (ja) | 発光装置および照明装置 | |
US20100259916A1 (en) | Light-emitting device and method for fabricating the same | |
JP2006066657A (ja) | 発光装置および照明装置 | |
JP2012009632A (ja) | 発光素子パッケージ及びそれを備えた発光素子パッケージ群 | |
JP6173794B2 (ja) | 半導体発光装置およびそれを用いた照明装置 | |
JP2006156604A (ja) | 発光装置および照明装置 | |
JP5085851B2 (ja) | 発光装置および照明装置 | |
JP5899476B2 (ja) | 発光装置及びそれを用いた照明装置 | |
JP2004087630A (ja) | 発光ダイオードおよびledライト | |
JP2009224376A (ja) | 側面型発光装置及びその製造方法 | |
JP6583673B2 (ja) | 発光装置、及び照明装置 | |
JP2013149690A (ja) | 発光装置および照明装置 | |
JP2017163002A (ja) | 発光装置、及び、照明装置 | |
JP2017162997A (ja) | 発光装置、及び、照明装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20140326 |
|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20141008 |
|
RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20141016 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20141209 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150206 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20150507 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150706 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20151215 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20151229 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 5903672 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |