JP5892664B2 - 定着用金属複層部材 - Google Patents
定着用金属複層部材 Download PDFInfo
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- JP5892664B2 JP5892664B2 JP2013537520A JP2013537520A JP5892664B2 JP 5892664 B2 JP5892664 B2 JP 5892664B2 JP 2013537520 A JP2013537520 A JP 2013537520A JP 2013537520 A JP2013537520 A JP 2013537520A JP 5892664 B2 JP5892664 B2 JP 5892664B2
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- Prior art keywords
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- nickel
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- belt
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- 229910052751 metal Inorganic materials 0.000 title claims description 81
- 239000002184 metal Substances 0.000 title claims description 81
- 239000010410 layer Substances 0.000 claims description 167
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 86
- 229910052759 nickel Inorganic materials 0.000 claims description 41
- 238000007747 plating Methods 0.000 claims description 24
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 17
- 239000012790 adhesive layer Substances 0.000 claims description 16
- 229910052802 copper Inorganic materials 0.000 claims description 16
- 239000010949 copper Substances 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 16
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 238000005260 corrosion Methods 0.000 claims description 7
- 230000007797 corrosion Effects 0.000 claims description 7
- 239000002245 particle Substances 0.000 claims description 7
- 238000005323 electroforming Methods 0.000 description 25
- 239000010408 film Substances 0.000 description 12
- 238000010438 heat treatment Methods 0.000 description 12
- 238000005452 bending Methods 0.000 description 11
- 238000000034 method Methods 0.000 description 9
- 229910052698 phosphorus Inorganic materials 0.000 description 8
- 238000003825 pressing Methods 0.000 description 8
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 7
- 239000011574 phosphorus Substances 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 229910000365 copper sulfate Inorganic materials 0.000 description 5
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 5
- 239000002659 electrodeposit Substances 0.000 description 5
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 4
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 4
- 229910018104 Ni-P Inorganic materials 0.000 description 3
- 229910018536 Ni—P Inorganic materials 0.000 description 3
- 229910001096 P alloy Inorganic materials 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 3
- 239000004327 boric acid Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 239000011572 manganese Substances 0.000 description 3
- 229920002379 silicone rubber Polymers 0.000 description 3
- 239000004945 silicone rubber Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 2
- 229910052748 manganese Inorganic materials 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 2
- 229910001453 nickel ion Inorganic materials 0.000 description 2
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 2
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 2
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- IIACRCGMVDHOTQ-UHFFFAOYSA-M sulfamate Chemical compound NS([O-])(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-M 0.000 description 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
- NCPXQVVMIXIKTN-UHFFFAOYSA-N trisodium;phosphite Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])[O-] NCPXQVVMIXIKTN-UHFFFAOYSA-N 0.000 description 2
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910001339 C alloy Inorganic materials 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 208000025599 Heat Stress disease Diseases 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 229910017709 Ni Co Inorganic materials 0.000 description 1
- 229910003267 Ni-Co Inorganic materials 0.000 description 1
- 229910003271 Ni-Fe Inorganic materials 0.000 description 1
- 229910003286 Ni-Mn Inorganic materials 0.000 description 1
- 229910021585 Nickel(II) bromide Inorganic materials 0.000 description 1
- 229910003262 Ni‐Co Inorganic materials 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 229920006311 Urethane elastomer Polymers 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- NGWYLXQWBJHCSO-UHFFFAOYSA-N [Na].[Na].[Na].OS(=O)(=O)C1=CC(S(O)(=O)=O)=CC2=CC(S(=O)(=O)O)=CC=C21 Chemical compound [Na].[Na].[Na].OS(=O)(=O)C1=CC(S(O)(=O)=O)=CC2=CC(S(=O)(=O)O)=CC=C21 NGWYLXQWBJHCSO-UHFFFAOYSA-N 0.000 description 1
- MQRWBMAEBQOWAF-UHFFFAOYSA-N acetic acid;nickel Chemical compound [Ni].CC(O)=O.CC(O)=O MQRWBMAEBQOWAF-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- DLDJFQGPPSQZKI-UHFFFAOYSA-N but-2-yne-1,4-diol Chemical compound OCC#CCO DLDJFQGPPSQZKI-UHFFFAOYSA-N 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- WLQXLCXXAPYDIU-UHFFFAOYSA-L cobalt(2+);disulfamate Chemical compound [Co+2].NS([O-])(=O)=O.NS([O-])(=O)=O WLQXLCXXAPYDIU-UHFFFAOYSA-L 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- DOBRDRYODQBAMW-UHFFFAOYSA-N copper(i) cyanide Chemical compound [Cu+].N#[C-] DOBRDRYODQBAMW-UHFFFAOYSA-N 0.000 description 1
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 description 1
- 239000002305 electric material Substances 0.000 description 1
- 230000005674 electromagnetic induction Effects 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- SQZYOZWYVFYNFV-UHFFFAOYSA-L iron(2+);disulfamate Chemical compound [Fe+2].NS([O-])(=O)=O.NS([O-])(=O)=O SQZYOZWYVFYNFV-UHFFFAOYSA-L 0.000 description 1
- KEXSCPNGYFGPFU-UHFFFAOYSA-L manganese(2+);disulfamate Chemical compound [Mn+2].NS([O-])(=O)=O.NS([O-])(=O)=O KEXSCPNGYFGPFU-UHFFFAOYSA-L 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- VMWYVTOHEQQZHQ-UHFFFAOYSA-N methylidynenickel Chemical compound [Ni]#[C] VMWYVTOHEQQZHQ-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 235000013379 molasses Nutrition 0.000 description 1
- 229940078494 nickel acetate Drugs 0.000 description 1
- IPLJNQFXJUCRNH-UHFFFAOYSA-L nickel(2+);dibromide Chemical compound [Ni+2].[Br-].[Br-] IPLJNQFXJUCRNH-UHFFFAOYSA-L 0.000 description 1
- TXRHHNYLWVQULI-UHFFFAOYSA-L nickel(2+);disulfamate;tetrahydrate Chemical compound O.O.O.O.[Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O TXRHHNYLWVQULI-UHFFFAOYSA-L 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 239000006174 pH buffer Substances 0.000 description 1
- 239000006179 pH buffering agent Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- SQTLECAKIMBJGK-UHFFFAOYSA-I potassium;titanium(4+);pentafluoride Chemical compound [F-].[F-].[F-].[F-].[F-].[K+].[Ti+4] SQTLECAKIMBJGK-UHFFFAOYSA-I 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- IIACRCGMVDHOTQ-UHFFFAOYSA-N sulfamic acid group Chemical group S(N)(O)(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-N 0.000 description 1
- WWNBZGLDODTKEM-UHFFFAOYSA-N sulfanylidenenickel Chemical compound [Ni]=S WWNBZGLDODTKEM-UHFFFAOYSA-N 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G15/00—Apparatus for electrographic processes using a charge pattern
- G03G15/20—Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat
- G03G15/2003—Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat using heat
- G03G15/2014—Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat using heat using contact heat
- G03G15/2053—Structural details of heat elements, e.g. structure of roller or belt, eddy current, induction heating
- G03G15/2057—Structural details of heat elements, e.g. structure of roller or belt, eddy current, induction heating relating to the chemical composition of the heat element and layers thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G15/00—Apparatus for electrographic processes using a charge pattern
- G03G15/20—Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat
- G03G15/2003—Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat using heat
- G03G15/2014—Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat using heat using contact heat
- G03G15/206—Structural details or chemical composition of the pressure elements and layers thereof
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12542—More than one such component
- Y10T428/12549—Adjacent to each other
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Fixing For Electrophotography (AREA)
- Laminated Bodies (AREA)
Description
このように、本発明の定着用金属複層部材10は、押圧部材20,21を介して加圧ロールに押圧されて大きなピッチで加圧ロールと接触させるような定着ベルトに適用してより効果的である。
スルファミン酸ニッケルを500g/L、亜リン酸ナトリウムを150mg/L、硼酸を30g/L、一次光沢剤としてナフタレン−1,3,6−トリスルホン酸三ナトリウムを1.0g/L、二次光沢剤として2−ブチン−1,4−ジオールを20mg/L添加して、所望のスルファミン酸リン電鋳浴を調製した。
サンプル1〜10の第1層と同様に厚さ30μmの金属基体を得、比較サンプルとした。
JIS 8115の耐折性試験(MIT)に準拠した、耐折性試験機を用い、図4に示すような試験を行った。
(結果のまとめ)
破断回数を比較すると、第2層の総厚に対する比が0.05であるサンプル1では、比較サンプルに対して10%程度の耐久性の向上であったが、比が0.18のサンプル2では破断回数が200回を越え、比較サンプルに対して48%と、50%近い耐久性の向上を示し、比が0.20のサンプル3、0.25のサンプル4、0.35のサンプル5、0.50のサンプル6、0.65のサンプル7、0.68のサンプル8では、100%以上の改善を示した。ここで、耐久性のピークは第2層の比が0.35〜0.50の範囲にあることが推測でき、その後、比が大きくなると耐久性が低下する傾向にあることがわかった。結果として、比が0.18〜0.80の範囲で破断回数が200回以上となり、比較サンプルに対して50%近い改善ができ、効果が顕著に見られる範囲であり、特に比が0.20〜0.68の範囲では100%以上と、さらに大きな耐久性の改善が見られることがわかった。
11 第1層
12 第2層
13 第3層
14 第一接着層
15 弾性層
16 第二接着層
17 フッ素樹脂層
Claims (4)
- ニッケル又はニッケル合金からなるシームレス電鋳ベルトからなる第1層と、この第1層よりヤング率が2/3以下の金属のシームレス電鋳ベルトからなる第2層と、この第2層上に当該第2層より耐食性の高い金属からなる第3層とを有する金属基体と、前記金属基体の前記第2層側に接着層を介して設けられたフッ素樹脂層とを具備し、前記金属基体の総厚に対する前記第2層の厚さの比が、0.25〜0.65であり、前記フッ素樹脂層を接着する接着層が、PFA粒子を含有する接着剤の塗布層の加熱溶融物からなるものであることを特徴とする定着用金属複層部材。
- 請求項1に記載の定着用金属複層部材において、前記第2層が、銅又は銅合金のメッキ層からなることを特徴とする定着用金属複層部材。
- 請求項2に記載の定着用金属複層部材において、前記第3層は、ニッケル又はニッケル合金のメッキ層からなることを特徴とする定着用金属複層部材。
- 請求項1〜3の何れか1項に記載の定着用金属複層部材において、前記金属基体と前記フッ素樹脂層との間に弾性層を具備することを特徴とする定着用金属複層部材。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013537520A JP5892664B2 (ja) | 2011-10-07 | 2012-10-02 | 定着用金属複層部材 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011223400 | 2011-10-07 | ||
JP2011223400 | 2011-10-07 | ||
JP2013537520A JP5892664B2 (ja) | 2011-10-07 | 2012-10-02 | 定着用金属複層部材 |
PCT/JP2012/075561 WO2013051582A1 (ja) | 2011-10-07 | 2012-10-02 | 定着用金属複層部材 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2013051582A1 JPWO2013051582A1 (ja) | 2015-03-30 |
JP5892664B2 true JP5892664B2 (ja) | 2016-03-23 |
Family
ID=48043738
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013537520A Active JP5892664B2 (ja) | 2011-10-07 | 2012-10-02 | 定着用金属複層部材 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20140242412A1 (ja) |
EP (1) | EP2765461A4 (ja) |
JP (1) | JP5892664B2 (ja) |
CN (1) | CN103842913A (ja) |
WO (1) | WO2013051582A1 (ja) |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3869113A (en) * | 1973-07-16 | 1975-03-04 | Gen Tire & Rubber Co | High load bushing |
US6321712B1 (en) * | 2000-04-07 | 2001-11-27 | Dana Corporation | Racing engine having trimetal bearings with a thick overlay for high speed and/or high load applications |
JP2004004660A (ja) | 2002-04-02 | 2004-01-08 | Nitto Kogyo Co Ltd | 定着ベルト及びこの定着ベルトを備えた定着装置 |
DE102005023541A1 (de) * | 2005-05-21 | 2006-11-23 | Federal-Mogul Wiesbaden Gmbh & Co. Kg | Gleitlagerverbundwerkstoff, Verwendung des Gleitlagerverbundwerkstoffes und Verfahren zur Herstellung des Gleitlagerverbundwerkstoffes |
CN101652724A (zh) | 2007-04-11 | 2010-02-17 | 住友电工超效能高分子股份有限公司 | 定影辊/定影带及其制造方法 |
JP4998497B2 (ja) * | 2009-03-19 | 2012-08-15 | コニカミノルタビジネステクノロジーズ株式会社 | 定着装置および画像形成装置 |
CN102474915A (zh) * | 2009-07-31 | 2012-05-23 | 新智德株式会社 | 电磁感应发热体及固定带 |
JP5380718B2 (ja) * | 2009-08-11 | 2014-01-08 | アキレス株式会社 | 金属ベルトおよびこれを用いた定着ベルト |
JP5365478B2 (ja) * | 2009-11-13 | 2013-12-11 | コニカミノルタ株式会社 | 定着装置および画像形成装置 |
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- 2012-10-02 JP JP2013537520A patent/JP5892664B2/ja active Active
- 2012-10-02 WO PCT/JP2012/075561 patent/WO2013051582A1/ja active Application Filing
- 2012-10-02 EP EP12838647.1A patent/EP2765461A4/en not_active Withdrawn
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WO2013051582A1 (ja) | 2013-04-11 |
EP2765461A4 (en) | 2015-07-08 |
EP2765461A1 (en) | 2014-08-13 |
JPWO2013051582A1 (ja) | 2015-03-30 |
CN103842913A (zh) | 2014-06-04 |
US20140242412A1 (en) | 2014-08-28 |
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