JP5885285B2 - 不揮発性メモリ用可変抵抗およびその製造方法並びに不揮発性メモリ - Google Patents
不揮発性メモリ用可変抵抗およびその製造方法並びに不揮発性メモリ Download PDFInfo
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- JP5885285B2 JP5885285B2 JP2007290103A JP2007290103A JP5885285B2 JP 5885285 B2 JP5885285 B2 JP 5885285B2 JP 2007290103 A JP2007290103 A JP 2007290103A JP 2007290103 A JP2007290103 A JP 2007290103A JP 5885285 B2 JP5885285 B2 JP 5885285B2
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- interlayer insulating
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- variable resistance
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- 238000004519 manufacturing process Methods 0.000 title claims description 39
- 230000015654 memory Effects 0.000 title claims description 26
- 238000000034 method Methods 0.000 title claims description 18
- 239000010410 layer Substances 0.000 claims description 232
- 239000011229 interlayer Substances 0.000 claims description 91
- 229910052751 metal Inorganic materials 0.000 claims description 34
- 239000002184 metal Substances 0.000 claims description 34
- 230000001590 oxidative effect Effects 0.000 claims description 10
- 230000008569 process Effects 0.000 claims description 4
- 125000006850 spacer group Chemical group 0.000 description 24
- 238000005229 chemical vapour deposition Methods 0.000 description 11
- 239000010949 copper Substances 0.000 description 11
- 239000000463 material Substances 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 229910052814 silicon oxide Inorganic materials 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- 230000004888 barrier function Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- 239000005751 Copper oxide Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 2
- 229910000431 copper oxide Inorganic materials 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000005291 magnetic effect Effects 0.000 description 2
- 239000010955 niobium Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910002367 SrTiO Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003302 ferromagnetic material Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000005415 magnetization Effects 0.000 description 1
- 229910001510 metal chloride Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- -1 tungsten nitride Chemical class 0.000 description 1
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- Semiconductor Memories (AREA)
- Hall/Mr Elements (AREA)
Description
12 第1配線層
14、15 可変抵抗層
16 貫通孔
18 凹部
20 層間絶縁膜
21 トンネル絶縁膜
22 バリア層
23 プラグ金属
24 第2配線層
26 ストッパ層
30 層間絶縁膜
32 貫通孔
34 下部スペーサ層
36 下部電極
38 可変抵抗層
40 上部電極
42 上部スペーサ層
44 第2配線層
Claims (5)
- 第1配線層表面の上面の全面上に設けられた可変抵抗層と、
前記第1配線層上に設けられた層間絶縁膜と、
前記層間絶縁膜内に設けられ前記可変抵抗層に接続するプラグ金属と、
を具備し、
前記可変抵抗層は、前記第1配線層の酸化物からなり、
前記第1配線層は、下部層間絶縁層に埋め込まれている、
ことを特徴とする不揮発性メモリ用可変抵抗。 - 前記プラグ金属上に、前記プラグ金属に接続し、前記層間絶縁膜に埋め込まれた第2配線層を具備することを特徴とする請求項1記載の不揮発性メモリ用可変抵抗。
- 請求項1又は2記載の不揮発性メモリ用可変抵抗を有する不揮発性メモリ。
- 第1配線層を形成する工程と、
前記第1配線層の上面の全面を酸化することにより、該上面の全面上に可変抵抗層を形成する工程と、
前記第1配線層上に層間絶縁膜を形成する工程と、
前記層間絶縁膜内に前記可変抵抗層に接続するプラグ金属を形成する工程と、
を有し、
前記第1配線層を形成する工程は、前記第1配線層が下部層間絶縁層に埋め込まれるように該第1配線層を形成する工程である、
ことを特徴とする不揮発性メモリ用可変抵抗の製造方法。 - 前記層間絶縁膜を形成する前に、前記第1配線層上方にストッパ層を形成する工程を有し、
前記プラグ金属を形成する工程は、前記層間絶縁膜内に前記ストッパ層まで達する貫通孔を形成する工程と、前記貫通孔内にプラグ金属を形成する工程と、を有する請求項4記載の不揮発性メモリ用可変抵抗の製造方法。
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JP2007290103A JP5885285B2 (ja) | 2007-11-07 | 2007-11-07 | 不揮発性メモリ用可変抵抗およびその製造方法並びに不揮発性メモリ |
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JP2007290103A JP5885285B2 (ja) | 2007-11-07 | 2007-11-07 | 不揮発性メモリ用可変抵抗およびその製造方法並びに不揮発性メモリ |
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JP2014233157A Division JP2015065459A (ja) | 2014-11-17 | 2014-11-17 | 不揮発性メモリ用可変抵抗およびその製造方法並びに不揮発性メモリ |
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JP2009117668A JP2009117668A (ja) | 2009-05-28 |
JP5885285B2 true JP5885285B2 (ja) | 2016-03-15 |
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Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JP5788274B2 (ja) | 2011-09-14 | 2015-09-30 | ルネサスエレクトロニクス株式会社 | 抵抗変化型不揮発記憶装置、半導体装置及び抵抗変化型不揮発記憶装置の製造方法 |
JP6489480B2 (ja) * | 2014-06-12 | 2019-03-27 | パナソニックIpマネジメント株式会社 | 不揮発性記憶装置およびその製造方法 |
JP2016063118A (ja) * | 2014-09-19 | 2016-04-25 | 株式会社東芝 | 撮像素子、撮像装置および半導体装置 |
US10541364B2 (en) * | 2018-02-09 | 2020-01-21 | Micron Technology, Inc. | Memory cells with asymmetrical electrode interfaces |
US10854813B2 (en) | 2018-02-09 | 2020-12-01 | Micron Technology, Inc. | Dopant-modulated etching for memory devices |
CN110546778A (zh) * | 2018-03-16 | 2019-12-06 | 深圳市汇顶科技股份有限公司 | 忆阻器的制造方法、忆阻器和阻变式随机存取存储器rram |
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KR100481866B1 (ko) * | 2002-11-01 | 2005-04-11 | 삼성전자주식회사 | 상변환 기억소자 및 그 제조방법 |
JP2005260082A (ja) * | 2004-03-12 | 2005-09-22 | Toshiba Corp | 磁気ランダムアクセスメモリ |
KR100622268B1 (ko) * | 2005-07-04 | 2006-09-11 | 한양대학교 산학협력단 | ReRAM 소자용 다층 이원산화박막의 형성방법 |
JP4017650B2 (ja) * | 2005-12-02 | 2007-12-05 | シャープ株式会社 | 可変抵抗素子及びその製造方法 |
JP4061328B2 (ja) * | 2005-12-02 | 2008-03-19 | シャープ株式会社 | 可変抵抗素子及びその製造方法 |
KR100745761B1 (ko) * | 2006-02-07 | 2007-08-02 | 삼성전자주식회사 | 다이오드겸용 저항소자를 구비하는 상변화 램과 그 제조 및동작 방법 |
JP5061469B2 (ja) * | 2006-02-15 | 2012-10-31 | パナソニック株式会社 | 不揮発性記憶素子およびその製造方法 |
KR101004207B1 (ko) * | 2006-03-09 | 2010-12-24 | 파나소닉 주식회사 | 저항 변화형 소자, 반도체 장치, 및 그 제조 방법 |
JP2008072031A (ja) * | 2006-09-15 | 2008-03-27 | Fujitsu Ltd | 不揮発性半導体記憶装置 |
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