JP5882669B2 - 配線基板の製造装置及び配線基板の製造方法 - Google Patents

配線基板の製造装置及び配線基板の製造方法 Download PDF

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JP5882669B2
JP5882669B2 JP2011230884A JP2011230884A JP5882669B2 JP 5882669 B2 JP5882669 B2 JP 5882669B2 JP 2011230884 A JP2011230884 A JP 2011230884A JP 2011230884 A JP2011230884 A JP 2011230884A JP 5882669 B2 JP5882669 B2 JP 5882669B2
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metal film
film
substrate
conductive
wiring
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JP2013089868A (ja
JP2013089868A5 (enExample
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悠 成田
悠 成田
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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JP2011230884A 2011-10-20 2011-10-20 配線基板の製造装置及び配線基板の製造方法 Expired - Fee Related JP5882669B2 (ja)

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JP2011230884A JP5882669B2 (ja) 2011-10-20 2011-10-20 配線基板の製造装置及び配線基板の製造方法

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JP2011230884A JP5882669B2 (ja) 2011-10-20 2011-10-20 配線基板の製造装置及び配線基板の製造方法

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JP2013089868A JP2013089868A (ja) 2013-05-13
JP2013089868A5 JP2013089868A5 (enExample) 2014-12-04
JP5882669B2 true JP5882669B2 (ja) 2016-03-09

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Publication number Priority date Publication date Assignee Title
JP6321906B2 (ja) * 2013-01-16 2018-05-09 昭和電工株式会社 導電パターン形成用基板及び導電パターン形成基板、並びにその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002344115A (ja) * 2001-05-16 2002-11-29 Matsushita Electric Ind Co Ltd 成膜方法及びプリント基板の製造方法
JP4219822B2 (ja) * 2003-01-14 2009-02-04 シャープ株式会社 配線材料、配線基板及びその製造方法並びに表示パネル
JP2005262598A (ja) * 2004-03-18 2005-09-29 Asahi Kasei Corp 積層体およびその製造方法
JP2006135278A (ja) * 2004-10-08 2006-05-25 Toppan Printing Co Ltd プリント配線板用絶縁樹脂フィルム及びそれを用いたプリント配線板

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