JP2013089868A5 - - Google Patents
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- Publication number
- JP2013089868A5 JP2013089868A5 JP2011230884A JP2011230884A JP2013089868A5 JP 2013089868 A5 JP2013089868 A5 JP 2013089868A5 JP 2011230884 A JP2011230884 A JP 2011230884A JP 2011230884 A JP2011230884 A JP 2011230884A JP 2013089868 A5 JP2013089868 A5 JP 2013089868A5
- Authority
- JP
- Japan
- Prior art keywords
- metal film
- conductive
- forming
- film
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011230884A JP5882669B2 (ja) | 2011-10-20 | 2011-10-20 | 配線基板の製造装置及び配線基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011230884A JP5882669B2 (ja) | 2011-10-20 | 2011-10-20 | 配線基板の製造装置及び配線基板の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013089868A JP2013089868A (ja) | 2013-05-13 |
| JP2013089868A5 true JP2013089868A5 (enExample) | 2014-12-04 |
| JP5882669B2 JP5882669B2 (ja) | 2016-03-09 |
Family
ID=48533467
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011230884A Expired - Fee Related JP5882669B2 (ja) | 2011-10-20 | 2011-10-20 | 配線基板の製造装置及び配線基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5882669B2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6321906B2 (ja) * | 2013-01-16 | 2018-05-09 | 昭和電工株式会社 | 導電パターン形成用基板及び導電パターン形成基板、並びにその製造方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002344115A (ja) * | 2001-05-16 | 2002-11-29 | Matsushita Electric Ind Co Ltd | 成膜方法及びプリント基板の製造方法 |
| JP4219822B2 (ja) * | 2003-01-14 | 2009-02-04 | シャープ株式会社 | 配線材料、配線基板及びその製造方法並びに表示パネル |
| JP2005262598A (ja) * | 2004-03-18 | 2005-09-29 | Asahi Kasei Corp | 積層体およびその製造方法 |
| JP2006135278A (ja) * | 2004-10-08 | 2006-05-25 | Toppan Printing Co Ltd | プリント配線板用絶縁樹脂フィルム及びそれを用いたプリント配線板 |
-
2011
- 2011-10-20 JP JP2011230884A patent/JP5882669B2/ja not_active Expired - Fee Related
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