JP2013089868A5 - - Google Patents

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Publication number
JP2013089868A5
JP2013089868A5 JP2011230884A JP2011230884A JP2013089868A5 JP 2013089868 A5 JP2013089868 A5 JP 2013089868A5 JP 2011230884 A JP2011230884 A JP 2011230884A JP 2011230884 A JP2011230884 A JP 2011230884A JP 2013089868 A5 JP2013089868 A5 JP 2013089868A5
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JP
Japan
Prior art keywords
metal film
conductive
forming
film
substrate
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Application number
JP2011230884A
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English (en)
Japanese (ja)
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JP5882669B2 (ja
JP2013089868A (ja
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Priority to JP2011230884A priority Critical patent/JP5882669B2/ja
Priority claimed from JP2011230884A external-priority patent/JP5882669B2/ja
Publication of JP2013089868A publication Critical patent/JP2013089868A/ja
Publication of JP2013089868A5 publication Critical patent/JP2013089868A5/ja
Application granted granted Critical
Publication of JP5882669B2 publication Critical patent/JP5882669B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2011230884A 2011-10-20 2011-10-20 配線基板の製造装置及び配線基板の製造方法 Expired - Fee Related JP5882669B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011230884A JP5882669B2 (ja) 2011-10-20 2011-10-20 配線基板の製造装置及び配線基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011230884A JP5882669B2 (ja) 2011-10-20 2011-10-20 配線基板の製造装置及び配線基板の製造方法

Publications (3)

Publication Number Publication Date
JP2013089868A JP2013089868A (ja) 2013-05-13
JP2013089868A5 true JP2013089868A5 (enExample) 2014-12-04
JP5882669B2 JP5882669B2 (ja) 2016-03-09

Family

ID=48533467

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011230884A Expired - Fee Related JP5882669B2 (ja) 2011-10-20 2011-10-20 配線基板の製造装置及び配線基板の製造方法

Country Status (1)

Country Link
JP (1) JP5882669B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6321906B2 (ja) * 2013-01-16 2018-05-09 昭和電工株式会社 導電パターン形成用基板及び導電パターン形成基板、並びにその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002344115A (ja) * 2001-05-16 2002-11-29 Matsushita Electric Ind Co Ltd 成膜方法及びプリント基板の製造方法
JP4219822B2 (ja) * 2003-01-14 2009-02-04 シャープ株式会社 配線材料、配線基板及びその製造方法並びに表示パネル
JP2005262598A (ja) * 2004-03-18 2005-09-29 Asahi Kasei Corp 積層体およびその製造方法
JP2006135278A (ja) * 2004-10-08 2006-05-25 Toppan Printing Co Ltd プリント配線板用絶縁樹脂フィルム及びそれを用いたプリント配線板

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