JP5881676B2 - ディスプレイ用の電子物品、及びその製造方法 - Google Patents
ディスプレイ用の電子物品、及びその製造方法 Download PDFInfo
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- JP5881676B2 JP5881676B2 JP2013502623A JP2013502623A JP5881676B2 JP 5881676 B2 JP5881676 B2 JP 5881676B2 JP 2013502623 A JP2013502623 A JP 2013502623A JP 2013502623 A JP2013502623 A JP 2013502623A JP 5881676 B2 JP5881676 B2 JP 5881676B2
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- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
- H05B33/145—Arrangements of the electroluminescent material
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- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
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- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/002—Inhomogeneous material in general
- H01B3/004—Inhomogeneous material in general with conductive additives or conductive layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/12—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances ceramics
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
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| DE102014005339B4 (de) * | 2014-01-28 | 2022-06-09 | Wolfgang B. Thörner | Verfahren zur Herstellung eines Kontaktelements |
| DE102015000120A1 (de) * | 2015-01-07 | 2016-07-07 | Merck Patent Gmbh | Elektronisches Bauelement |
| DE102015209594A1 (de) * | 2015-05-26 | 2016-12-01 | Siemens Aktiengesellschaft | Widerstandsbelag für einen Glimmschutz einer elektrischen Maschine |
| WO2018080755A1 (en) | 2016-10-25 | 2018-05-03 | 3M Innovative Properties Company | Method of making magnetizable abrasive particles |
| CN109890931B (zh) | 2016-10-25 | 2021-03-16 | 3M创新有限公司 | 可磁化磨料颗粒和包含可磁化磨料颗粒的磨料制品 |
| WO2018080765A1 (en) | 2016-10-25 | 2018-05-03 | 3M Innovative Properties Company | Structured abrasive articles and methods of making the same |
| US11484990B2 (en) | 2016-10-25 | 2022-11-01 | 3M Innovative Properties Company | Bonded abrasive wheel and method of making the same |
| WO2018080799A1 (en) | 2016-10-25 | 2018-05-03 | 3M Innovative Properties Company | Magnetizable abrasive particle and method of making the same |
| EP3541888B1 (en) | 2016-11-18 | 2025-12-24 | 3M Innovative Properties Company | Metal hybrid grinding wheel with coated filler particles |
| US11141835B2 (en) | 2017-01-19 | 2021-10-12 | 3M Innovative Properties Company | Manipulation of magnetizable abrasive particles with modulation of magnetic field angle or strength |
| WO2018134732A1 (en) | 2017-01-19 | 2018-07-26 | 3M Innovative Properties Company | Magnetically assisted transfer of magnetizable abrasive particles and methods, apparatuses and systems related thereto |
| EP3571013A4 (en) | 2017-01-19 | 2020-10-07 | 3M Innovative Properties Company | Use of magnetics with magnetizable abrasive particles, methods, apparatuses and systems using magnetics to make abrasive articles |
| US12269982B2 (en) | 2017-01-23 | 2025-04-08 | 3M Innovative Properties Company | Magnetically assisted disposition of magnetizable abrasive particles |
| US10448481B2 (en) * | 2017-08-15 | 2019-10-15 | Davorin Babic | Electrically conductive infrared emitter and back reflector in a solid state source apparatus and method of use thereof |
| EP3711070A1 (en) | 2017-11-16 | 2020-09-23 | 3M Innovative Properties Company | Polymer matrix composites comprising dielectric particles and methods of making the same |
| US10927228B2 (en) | 2017-11-16 | 2021-02-23 | 3M Innovative Properties Company | Polymer matrix composites comprising intumescent particles and methods of making the same |
| US10913834B2 (en) | 2017-11-16 | 2021-02-09 | 3M Innovative Properties Company | Polymer matrix composites comprising indicator particles and methods of making the same |
| US10836873B2 (en) | 2017-11-16 | 2020-11-17 | 3M Innovative Properties Company | Polymer matrix composites comprising thermally insulating particles and methods of making the same |
| CN111447993A (zh) | 2017-11-16 | 2020-07-24 | 3M创新有限公司 | 包含官能化颗粒的聚合物基质复合材料及其制备方法 |
| KR102722514B1 (ko) | 2017-11-16 | 2024-10-29 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 중합체 매트릭스 복합재의 제조 방법 |
| EP3784437B1 (en) | 2018-04-24 | 2025-12-24 | 3M Innovative Properties Company | Abrasive article with shaped abrasive particles with predetermined rake angles |
| CN112004642A (zh) | 2018-04-24 | 2020-11-27 | 3M创新有限公司 | 制备带涂层磨料制品的方法 |
| WO2019207416A1 (en) | 2018-04-24 | 2019-10-31 | 3M Innovative Properties Company | Coated abrasive article and method of making the same |
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| US11229987B2 (en) | 2018-08-27 | 2022-01-25 | 3M Innovative Properties Company | Embedded electronic circuit in grinding wheels and methods of embedding |
| WO2020089741A1 (en) | 2018-11-01 | 2020-05-07 | 3M Innovative Properties Company | Tetrahedral shaped abrasive particles with predetermined rake angles |
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| WO2021094901A1 (en) | 2019-11-15 | 2021-05-20 | 3M Innovative Properties Company | Expandable microsphere, markable article, marked article, and method of making the same |
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| CN113692212B (zh) * | 2021-08-23 | 2022-08-02 | 北京大学 | 一种多层吸波器结构及其应用 |
| US20240384069A1 (en) * | 2021-09-20 | 2024-11-21 | 3M Innovative Properties Company | Coated glass bubbles, composites therefrom, and methods of making the same |
| WO2025011523A1 (zh) * | 2023-07-11 | 2025-01-16 | 比亚迪股份有限公司 | 反射器件、反射器件制造方法及车辆 |
| WO2025133799A1 (en) | 2023-12-19 | 2025-06-26 | 3M Innovative Properties Company | Electromagnetically absorptive materials |
Family Cites Families (47)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2521594C2 (de) | 1975-05-15 | 1984-03-15 | Hoechst Ag, 6230 Frankfurt | Verfahren zur Herstellung perfluorierter Ketone |
| US4612242A (en) | 1985-06-03 | 1986-09-16 | Minnesota Mining And Manufacturing Company | Pressure-sensitive adhesive tape containing coated glass microbubbles |
| US6436532B1 (en) | 1991-02-28 | 2002-08-20 | 3M Innovative Properties Company | Multi-stage irradiation process for production of acrylic based adhesives and adhesives made thereby |
| AU1641492A (en) | 1991-02-28 | 1992-10-06 | Minnesota Mining And Manufacturing Company | Multi-stage irradiation process for production of acrylic based adhesives and adhesives made thereby |
| JP2737647B2 (ja) | 1994-03-10 | 1998-04-08 | カシオ計算機株式会社 | 異方導電性接着剤およびそれを用いた導電接続構造 |
| US5756936A (en) | 1994-05-18 | 1998-05-26 | Minnesota Mining And Manufacturing Company | Cylindrical radially shrinkable sleeve for an electrical cable and composition thereof |
| US5538756A (en) | 1994-09-23 | 1996-07-23 | W. L. Gore & Associates | High capacitance sheet adhesives and process for making the same |
| JPH1171560A (ja) | 1997-08-28 | 1999-03-16 | Ricoh Co Ltd | 異方導電性接着材および液晶表示装置および液晶表示装置の作製方法 |
| US20010046021A1 (en) | 1997-08-28 | 2001-11-29 | Takeshi Kozuka | A conductive particle to conductively bond conductive members to each other, an anisotropic adhesive containing the conductive particle, a liquid crystal display device using the anisotropic conductive adhesive, a method for manufacturing the liquid crystal display device |
| WO2001029920A1 (en) | 1999-10-18 | 2001-04-26 | The Regents Of The University Of California | Shutdown and redox shuttle additives for batteries |
| JP2001200224A (ja) | 2000-01-18 | 2001-07-24 | Murata Mfg Co Ltd | 異方導電性接着剤およびそれを用いたラダーフィルタ |
| US6562448B1 (en) | 2000-04-06 | 2003-05-13 | 3M Innovative Properties Company | Low density dielectric having low microwave loss |
| KR100533097B1 (ko) * | 2000-04-27 | 2005-12-02 | 티디케이가부시기가이샤 | 복합자성재료와 이것을 이용한 자성성형재료, 압분 자성분말성형재료, 자성도료, 복합 유전체재료와 이것을이용한 성형재료, 압분성형 분말재료, 도료, 프리프레그및 기판, 전자부품 |
| JP2001303102A (ja) * | 2000-04-27 | 2001-10-31 | Tdk Corp | 複合誘電体材料とこれを用いた成形材料、圧粉成形粉末材料、塗料、プリプレグおよび基板 |
| EP1231637A3 (en) | 2001-02-08 | 2004-08-25 | Hitachi, Ltd. | High dielectric constant composite material and multilayer wiring board using the same |
| JP2003077335A (ja) | 2001-08-30 | 2003-03-14 | Hitachi Chem Co Ltd | 表面処理導電性粒子、導電性粒子の処理方法及びそれを用いた回路接続用接着剤、回路接続構造体 |
| WO2003056879A1 (en) | 2001-12-21 | 2003-07-10 | Ifire Technology Inc. | Low firing temperature thick film dielectric layer for electroluminescent display |
| US20040003839A1 (en) | 2002-07-05 | 2004-01-08 | Curtin Lawrence F. | Nano photovoltaic/solar cells |
| JP2004043602A (ja) | 2002-07-10 | 2004-02-12 | Bridgestone Corp | 異方性導電フィルム |
| US7215473B2 (en) | 2002-08-17 | 2007-05-08 | 3M Innovative Properties Company | Enhanced heat mirror films |
| JP2004095269A (ja) | 2002-08-30 | 2004-03-25 | Idemitsu Kosan Co Ltd | 異方導電粒子及び異方導電性接着剤 |
| US7514359B2 (en) | 2003-01-14 | 2009-04-07 | Alcatel-Lucent Usa Inc. | Adhering layers to metals with dielectric adhesive layers |
| JP4867130B2 (ja) * | 2003-02-17 | 2012-02-01 | 三菱瓦斯化学株式会社 | 絶縁化超微粉末とその製造方法、およびそれを用いた高誘電率樹脂複合材料 |
| US7078095B2 (en) | 2004-07-07 | 2006-07-18 | Xerox Corporation | Adhesive film exhibiting anisotropic electrical conductivity |
| JP4770139B2 (ja) | 2004-08-10 | 2011-09-14 | 東レ株式会社 | 導電性粒子および異方導電性材料用組成物 |
| KR100589586B1 (ko) | 2004-10-22 | 2006-06-14 | 제일모직주식회사 | 절연 전도성 미립자 및 이를 이용한 이방 전도성 필름 |
| KR100598679B1 (ko) | 2004-10-25 | 2006-07-19 | 주식회사 마이크로글로브 | 압력 감응 전도성 필름 및 그 제조방법 |
| GB0500268D0 (en) | 2005-01-07 | 2005-02-16 | Pelikon Ltd | Electroluminescent displays |
| JP2006236925A (ja) | 2005-02-28 | 2006-09-07 | Fuji Photo Film Co Ltd | 分散型エレクトロルミネッセンス素子 |
| JP5152815B2 (ja) | 2005-04-25 | 2013-02-27 | 旭化成イーマテリアルズ株式会社 | 異方導電性接着シート及び微細接続構造体 |
| JP2006351390A (ja) * | 2005-06-16 | 2006-12-28 | Nitto Denko Corp | 複合材料 |
| KR100722493B1 (ko) | 2005-09-02 | 2007-05-28 | 제일모직주식회사 | 절연 전도성 미립자 및 이를 이용한 이방 전도성 접착필름 |
| US20070146426A1 (en) | 2005-12-28 | 2007-06-28 | Nelson Brian K | All-inkjet printed thin film transistor |
| CN101495587B (zh) | 2006-07-24 | 2011-08-10 | 3M创新有限公司 | 导电压敏粘合剂 |
| US20080187651A1 (en) | 2006-10-24 | 2008-08-07 | 3M Innovative Properties Company | Conductive ink formulations |
| JP2008123780A (ja) * | 2006-11-10 | 2008-05-29 | Kuraray Luminas Co Ltd | 分散型無機エレクトロルミネッセンス素子およびこれを備える照明装置 |
| KR100861010B1 (ko) | 2006-12-22 | 2008-09-30 | 제일모직주식회사 | 절연성 도전 입자 및 이를 이용한 이방 도전성 필름 |
| JP2008251321A (ja) * | 2007-03-30 | 2008-10-16 | Kuraray Luminas Co Ltd | 無機エレクトロルミネッセンス素子およびこれを備える照明装置 |
| KR20080098815A (ko) | 2007-05-07 | 2008-11-12 | 주식회사 엘지화학 | 절연피복 도전성 미립자 및 이를 포함하는 이방성도전접속재료 |
| JP4957695B2 (ja) | 2007-10-02 | 2012-06-20 | 日立化成工業株式会社 | 導電粒子、その製造方法及び絶縁被覆導電粒子の製造方法、並びに異方導電性接着剤フィルム |
| DE102008004942A1 (de) | 2007-12-10 | 2009-06-25 | Saint-Gobain Sekurit Deutschland Gmbh & Co. Kg | Mehrschichtelement mit einer ersten transparenten Flächenelektrode |
| WO2009078469A1 (ja) | 2007-12-18 | 2009-06-25 | Hitachi Chemical Company, Ltd. | 絶縁被覆導電粒子、異方導電接着フィルム及びそれらの製造方法 |
| KR20090073366A (ko) | 2007-12-31 | 2009-07-03 | 주식회사 효성 | 이방성 도전접속용 절연 도전성 입자 및 이를 이용한이방성 도전접속재료 |
| JP5395482B2 (ja) | 2008-03-25 | 2014-01-22 | 積水化学工業株式会社 | 被覆導電性微粒子、異方性導電材料、及び、導電接続構造体 |
| US8350451B2 (en) | 2008-06-05 | 2013-01-08 | 3M Innovative Properties Company | Ultrathin transparent EMI shielding film comprising a polymer basecoat and crosslinked polymer transparent dielectric layer |
| JP4386145B2 (ja) | 2009-05-08 | 2009-12-16 | 日立化成工業株式会社 | 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法 |
| JP2010010142A (ja) | 2009-10-07 | 2010-01-14 | Hitachi Chem Co Ltd | 熱硬化性回路接続部材及びそれを用いた電極の接続構造、電極の接続方法 |
-
2011
- 2011-03-18 WO PCT/US2011/028939 patent/WO2011123263A1/en not_active Ceased
- 2011-03-18 EP EP11714155A patent/EP2553688A1/en not_active Withdrawn
- 2011-03-18 CN CN2011800173698A patent/CN102822905A/zh active Pending
- 2011-03-18 US US13/635,445 patent/US8698394B2/en not_active Expired - Fee Related
- 2011-03-18 JP JP2013502623A patent/JP5881676B2/ja not_active Expired - Fee Related
- 2011-03-18 KR KR1020127027842A patent/KR20130018276A/ko not_active Abandoned
- 2011-03-18 SG SG2012070132A patent/SG184187A1/en unknown
- 2011-03-30 TW TW100111101A patent/TW201214468A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| EP2553688A1 (en) | 2013-02-06 |
| CN102822905A (zh) | 2012-12-12 |
| US20130009544A1 (en) | 2013-01-10 |
| WO2011123263A1 (en) | 2011-10-06 |
| SG184187A1 (en) | 2012-11-29 |
| JP2013542548A (ja) | 2013-11-21 |
| US8698394B2 (en) | 2014-04-15 |
| KR20130018276A (ko) | 2013-02-20 |
| TW201214468A (en) | 2012-04-01 |
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