JP5877432B2 - レーザー加工装置 - Google Patents

レーザー加工装置 Download PDF

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Publication number
JP5877432B2
JP5877432B2 JP2012044411A JP2012044411A JP5877432B2 JP 5877432 B2 JP5877432 B2 JP 5877432B2 JP 2012044411 A JP2012044411 A JP 2012044411A JP 2012044411 A JP2012044411 A JP 2012044411A JP 5877432 B2 JP5877432 B2 JP 5877432B2
Authority
JP
Japan
Prior art keywords
nozzle
space
laser processing
air
processing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012044411A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013180308A (ja
Inventor
真嗣 常本
真嗣 常本
信行 寺
信行 寺
篤志 野口
篤志 野口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sugino Machine Ltd
Original Assignee
Sugino Machine Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sugino Machine Ltd filed Critical Sugino Machine Ltd
Priority to JP2012044411A priority Critical patent/JP5877432B2/ja
Priority to TW102106941A priority patent/TWI566871B/zh
Priority to KR1020130021510A priority patent/KR102060673B1/ko
Priority to SG2013014725A priority patent/SG193126A1/en
Publication of JP2013180308A publication Critical patent/JP2013180308A/ja
Application granted granted Critical
Publication of JP5877432B2 publication Critical patent/JP5877432B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
    • B23K26/147—Features outside the nozzle for feeding the fluid stream towards the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
JP2012044411A 2012-02-29 2012-02-29 レーザー加工装置 Active JP5877432B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012044411A JP5877432B2 (ja) 2012-02-29 2012-02-29 レーザー加工装置
TW102106941A TWI566871B (zh) 2012-02-29 2013-02-27 Laser processing device
KR1020130021510A KR102060673B1 (ko) 2012-02-29 2013-02-27 레이저 가공 장치
SG2013014725A SG193126A1 (en) 2012-02-29 2013-02-27 Laser machining apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012044411A JP5877432B2 (ja) 2012-02-29 2012-02-29 レーザー加工装置

Publications (2)

Publication Number Publication Date
JP2013180308A JP2013180308A (ja) 2013-09-12
JP5877432B2 true JP5877432B2 (ja) 2016-03-08

Family

ID=49271350

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012044411A Active JP5877432B2 (ja) 2012-02-29 2012-02-29 レーザー加工装置

Country Status (4)

Country Link
JP (1) JP5877432B2 (zh)
KR (1) KR102060673B1 (zh)
SG (1) SG193126A1 (zh)
TW (1) TWI566871B (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2957378A1 (de) * 2014-06-16 2015-12-23 Synova SA Bearbeitungskopf zum Einkopplen eines Laserstrahles in einem Flüssigkeitsstrahl mit einer Flüssigkeitschnittstelle
DE102015224115B4 (de) * 2015-12-02 2021-04-01 Avonisys Ag Laserstrahl-bearbeitungsvorrichtung mit einer einkoppelvorrichtung zum einkoppeln eines fokussierten laserstrahls in einen flüssigkeitsstrahl
US10335900B2 (en) * 2016-03-03 2019-07-02 General Electric Company Protective shield for liquid guided laser cutting tools
US10160059B2 (en) * 2016-03-03 2018-12-25 General Electric Company Decoupled liquid-jet guided laser nozzle cap
EP3470165B1 (en) * 2017-10-13 2023-08-16 Synova S.A. Apparatus for machining a workpiece with a liquid jet guided laser beam and the assembly thereof
JP6511665B2 (ja) * 2018-02-01 2019-05-15 株式会社スギノマシン レーザー加工装置
KR102129555B1 (ko) * 2019-01-22 2020-07-02 (주)디이엔티 금속 3d 프린터용 레이저 헤드 센터링장치
CN112296563B (zh) * 2020-11-24 2022-06-24 常熟市天银机电股份有限公司 电机起动保护器静触点焊接机的静触点弹簧片移运结构

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH043637Y2 (zh) * 1986-01-14 1992-02-04
DE3844344A1 (de) * 1988-12-30 1990-07-12 Geesthacht Gkss Forschung Verfahren und vorrichtung zum schneiden und reinigen von gegenstaenden, sowie zum gezielten materialabtrag mittels eines wasser-abrasivmittel-gemisches
US5773791A (en) * 1996-09-03 1998-06-30 Kuykendal; Robert Water laser machine tool
CA2330426C (en) * 1998-04-30 2007-11-13 Synova S.A. Material shaping device with a laser beam which is injected into a stream of liquid
JP3056723B1 (ja) * 1999-01-04 2000-06-26 ファナック株式会社 レ―ザ加工装置
TW575473B (en) * 2003-02-18 2004-02-11 Trend Laser Technology Co Ltd Splash prevention device for a water-jet guiding laser nozzle
JP2007029980A (ja) * 2005-07-26 2007-02-08 Shibuya Kogyo Co Ltd ハイブリッドレーザ加工装置
JP5326183B2 (ja) * 2005-10-14 2013-10-30 澁谷工業株式会社 レーザアニール方法
US8134098B2 (en) * 2007-09-28 2012-03-13 Sugino Machine Limited Laser machining apparatus using laser beam introduced into jet liquid column
JP5147445B2 (ja) * 2007-09-28 2013-02-20 株式会社スギノマシン 噴流液柱内に導かれたレーザー光によるレーザー加工装置
JP5192216B2 (ja) * 2007-11-09 2013-05-08 株式会社ディスコ レーザー加工装置
JP2009241138A (ja) 2008-03-31 2009-10-22 Sugino Mach Ltd レーザー加工装置
JP5324828B2 (ja) * 2008-06-04 2013-10-23 株式会社ディスコ レーザー加工装置
EP2189236B1 (en) 2008-11-21 2012-06-20 Synova S.A. Method and apparatus for improving reliability of a machining process
TWI425994B (zh) * 2009-03-20 2014-02-11 Hon Hai Prec Ind Co Ltd 水導雷射裝置
JP5448042B2 (ja) * 2009-03-24 2014-03-19 株式会社スギノマシン レーザー加工装置、レーザー加工装置の製造方法、及びレーザー加工方法
JP2011125870A (ja) * 2009-12-15 2011-06-30 Disco Abrasive Syst Ltd レーザ加工装置

Also Published As

Publication number Publication date
SG193126A1 (en) 2013-09-30
JP2013180308A (ja) 2013-09-12
TW201400223A (zh) 2014-01-01
TWI566871B (zh) 2017-01-21
KR20130099888A (ko) 2013-09-06
KR102060673B1 (ko) 2019-12-30

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