JP5875816B2 - Ledモジュール - Google Patents
Ledモジュール Download PDFInfo
- Publication number
- JP5875816B2 JP5875816B2 JP2011216979A JP2011216979A JP5875816B2 JP 5875816 B2 JP5875816 B2 JP 5875816B2 JP 2011216979 A JP2011216979 A JP 2011216979A JP 2011216979 A JP2011216979 A JP 2011216979A JP 5875816 B2 JP5875816 B2 JP 5875816B2
- Authority
- JP
- Japan
- Prior art keywords
- glass film
- led chip
- led module
- sealing resin
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16J—PISTONS; CYLINDERS; SEALINGS
- F16J15/00—Sealings
- F16J15/02—Sealings between relatively-stationary surfaces
- F16J15/06—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces
- F16J15/061—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with positioning means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16J—PISTONS; CYLINDERS; SEALINGS
- F16J15/00—Sealings
- F16J15/02—Sealings between relatively-stationary surfaces
- F16J15/06—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces
- F16J15/08—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with exclusively metal packing
- F16J15/0881—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with exclusively metal packing the sealing effect being obtained by plastic deformation of the packing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01T—SPARK GAPS; OVERVOLTAGE ARRESTERS USING SPARK GAPS; SPARKING PLUGS; CORONA DEVICES; GENERATING IONS TO BE INTRODUCED INTO NON-ENCLOSED GASES
- H01T13/00—Sparking plugs
- H01T13/02—Details
- H01T13/08—Mounting, fixing or sealing of sparking plugs, e.g. in combustion chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Led Device Packages (AREA)
Description
210,220 リード
211,221 Ag膜
212,222 実装端子
230 樹脂
240 基板(絶縁基板)
250 配線パターン
251,252 ボンディング部
251A,252A Ag膜
253,254 迂回部
255,256 実装端子
257,258 貫通導体部
260 サブマウント基板
261,262 導電性ペースト
263 絶縁性ペースト
209 露出部(第1露出部)
300 LEDチップ
310,320,330,340 電極パッド
350 絶縁性ペースト
400 ワイヤ
410 ボンディング部
500 リフレクタ
501 反射面
509 露出部(第2露出部)
600 ガラス膜
601 境界面
610 ガラス膜(追加のガラス膜)
700 封止樹脂
Claims (13)
- LEDチップと、
上記LEDチップが搭載された基材と、
上記LEDチップを覆い、且つ、上記LEDチップからの光を透過させる封止樹脂と、
少なくとも一部が上記基材と上記封止樹脂との間に介在するガラス膜と、
上記LEDチップおよび上記基材にボンディングされたワイヤと、を備え、
上記基材は、上記ガラス膜から露出している第1露出部を含み、
上記ワイヤは、上記第1露出部にボンディングされたボンディング部を含み、
上記ガラス膜は、上記LEDチップのうち上記基材に搭載される面とは反対側の面の少なくとも一部と上記ワイヤのうち上記LEDチップにボンディングされた部分とを覆っているとともに、上記ワイヤの上記ボンディング部を露出させている、LEDモジュール。 - 上記LEDチップを囲む反射面を有するリフレクタを更に備え、
上記反射面は、上記ガラス膜から露出している第2露出部を有する、請求項1に記載のLEDモジュール。 - 上記第1露出部は、上記基材の厚さ方向視において上記ガラス膜を囲む形状を呈する、請求項1または請求項2に記載のLEDモジュール。
- 上記反射面は、上記ガラス膜に覆われている部位を有する、請求項2に記載のLEDモジュール。
- 上記基材は、Ag膜と金属製の複数のリードとを含み、
上記Ag膜は、上記複数のリードの各々における上記LEDチップが搭載される側の面に形成され、
上記ガラス膜は、上記Ag膜の少なくとも一部を覆っている、請求項1ないし請求項4のいずれかに記載のLEDモジュール。 - 上記基材は、絶縁基板と配線パターンとを含み、
上記配線パターンは、上記絶縁基板における上記LEDチップが搭載される側の面に形成されている、請求項1ないし請求項4のいずれかに記載のLEDモジュール。 - 上記基材は、上記配線パターン上に形成されたAg膜を含む、請求項6に記載のLEDモジュール。
- 上記ガラス膜の厚さは、1〜10μmである、請求項1ないし請求項7のいずれかに記載のLEDモジュール。
- 上記ガラス膜における上記封止樹脂との境界面は、凹凸状とされている、請求項1ないし請求項8のいずれかに記載のLEDモジュール。
- 上記ガラス膜は、上記LEDチップから発せられる光によって励起されて上記LEDチップの発光色とは異なる色の光を発する蛍光体を含有しており、かつ上記LEDチップを覆っている、請求項1ないし請求項9のいずれかに記載のLEDモジュール。
- 上記LEDチップは、青色光を発し、
上記ガラス膜に含まれる上記蛍光体は、赤色光を発する赤色蛍光体であり、
上記封止樹脂は、上記LEDチップから発せられる光によって励起された緑色光を発する緑色蛍光体を含有している、請求項10に記載のLEDモジュール。 - 上記LEDチップは、青色光を発し、
上記ガラス膜を覆う追加のガラス膜を更に備えており、
上記ガラス膜に含まれる上記蛍光体は、赤色光を発する赤色蛍光体であり、
上記追加のガラス膜は、上記LEDチップから発せられる光によって励起されて緑色光を発する緑色蛍光体を含有している、請求項10に記載のLEDモジュール。 - 上記封止樹脂は、上記蛍光体を含有していない、請求項12に記載のLEDモジュール。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011216979A JP5875816B2 (ja) | 2011-07-11 | 2011-09-30 | Ledモジュール |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011152785 | 2011-07-11 | ||
JP2011152785 | 2011-07-11 | ||
JP2011216979A JP5875816B2 (ja) | 2011-07-11 | 2011-09-30 | Ledモジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013038373A JP2013038373A (ja) | 2013-02-21 |
JP5875816B2 true JP5875816B2 (ja) | 2016-03-02 |
Family
ID=47887660
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011216979A Expired - Fee Related JP5875816B2 (ja) | 2011-07-11 | 2011-09-30 | Ledモジュール |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5875816B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10270014B2 (en) | 2016-11-11 | 2019-04-23 | Samsung Electronics Co., Ltd. | Light-emitting device package |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2983217B1 (en) | 2013-04-04 | 2018-10-31 | Toshiba Lighting & Technology Corporation | Lighting device |
JP6233560B2 (ja) * | 2013-04-04 | 2017-11-22 | 東芝ライテック株式会社 | 車両用照明装置、および車両用灯具 |
JP6303715B2 (ja) | 2013-04-18 | 2018-04-04 | 日亜化学工業株式会社 | 発光装置用パッケージ及び発光装置 |
JP6583764B2 (ja) * | 2014-09-12 | 2019-10-02 | パナソニックIpマネジメント株式会社 | 発光装置、及び照明装置 |
JP6428106B2 (ja) * | 2014-09-29 | 2018-11-28 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005311136A (ja) * | 2004-04-22 | 2005-11-04 | Matsushita Electric Works Ltd | 発光装置 |
WO2007080555A1 (en) * | 2006-01-16 | 2007-07-19 | Koninklijke Philips Electronics N.V. | Phosphor converted light emitting device |
JP4973011B2 (ja) * | 2006-05-31 | 2012-07-11 | 豊田合成株式会社 | Led装置 |
JP4962270B2 (ja) * | 2007-10-31 | 2012-06-27 | 日亜化学工業株式会社 | 発光装置及びこれの製造方法 |
JP2009231440A (ja) * | 2008-03-21 | 2009-10-08 | Nippon Carbide Ind Co Inc | 発光素子搭載用配線基板及び発光装置 |
-
2011
- 2011-09-30 JP JP2011216979A patent/JP5875816B2/ja not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10270014B2 (en) | 2016-11-11 | 2019-04-23 | Samsung Electronics Co., Ltd. | Light-emitting device package |
Also Published As
Publication number | Publication date |
---|---|
JP2013038373A (ja) | 2013-02-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6107510B2 (ja) | 発光装置及びその製造方法 | |
US7847307B2 (en) | Light-emitting module | |
JP5875816B2 (ja) | Ledモジュール | |
KR100978028B1 (ko) | 발광장치 | |
JP2007242856A (ja) | チップ型半導体発光素子 | |
WO2011099384A1 (ja) | 発光装置および発光装置の製造方法 | |
US20120068204A1 (en) | Led module for modified lamps and modified led lamp | |
WO2011021402A1 (ja) | 発光装置 | |
WO2012050110A1 (ja) | Ledモジュール | |
JPWO2012002580A1 (ja) | Led光源装置及びその製造方法 | |
JP2009501431A (ja) | 発光モジュール及びこれに用いる実装基板 | |
US20120091489A1 (en) | Substrate for mounting light-emitting elements, light-emitting device, and method for manufacturing same | |
JP2009130237A (ja) | 発光装置 | |
JP2006332269A (ja) | 発光装置 | |
TW201635599A (zh) | 發光裝置 | |
JP2001298216A (ja) | 表面実装型の半導体発光装置 | |
WO2014141691A1 (ja) | 発光モジュール | |
EP2704541A2 (en) | Wiring board, light-emitting device, and method of manufacturing the wiring board | |
WO2011126135A1 (ja) | Ledモジュール | |
JP2006013324A (ja) | 発光装置 | |
JP5406691B2 (ja) | 半導体発光装置 | |
TWI548124B (zh) | 覆晶式發光二極體元件及其封裝結構 | |
TWI784361B (zh) | Led發光裝置及其製造方法 | |
JP2014072520A (ja) | 発光装置 | |
JP6332503B2 (ja) | 発光装置及びその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20140926 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20150728 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20150825 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20151026 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20151222 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20160120 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5875816 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
LAPS | Cancellation because of no payment of annual fees |