JP5871904B2 - アブレシブエッチングおよびカッティングのためのフォトレジスト膜および方法 - Google Patents

アブレシブエッチングおよびカッティングのためのフォトレジスト膜および方法 Download PDF

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Publication number
JP5871904B2
JP5871904B2 JP2013505060A JP2013505060A JP5871904B2 JP 5871904 B2 JP5871904 B2 JP 5871904B2 JP 2013505060 A JP2013505060 A JP 2013505060A JP 2013505060 A JP2013505060 A JP 2013505060A JP 5871904 B2 JP5871904 B2 JP 5871904B2
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Japan
Prior art keywords
substrate
film
photoresist
less
photopolymer
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JP2013505060A
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English (en)
Japanese (ja)
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JP2013523477A5 (enExample
JP2013523477A (ja
Inventor
ダニエル・ビー・メノー
ビンセント・イー・リベリ
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Ikonics Corp
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Ikonics Corp
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Publication of JP2013523477A5 publication Critical patent/JP2013523477A5/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
    • B24C1/04—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for treating only selected parts of a surface, e.g. for carving stone or glass
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/12—Production of screen printing forms or similar printing forms, e.g. stencils
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G03F7/405—Treatment with inorganic or organometallic reagents after imagewise removal
    • H10P76/204—

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
JP2013505060A 2010-04-12 2011-04-12 アブレシブエッチングおよびカッティングのためのフォトレジスト膜および方法 Active JP5871904B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US32319210P 2010-04-12 2010-04-12
US61/323,192 2010-04-12
PCT/US2011/032154 WO2011130300A1 (en) 2010-04-12 2011-04-12 Photoresist film and methods for abrasive etching and cutting

Publications (3)

Publication Number Publication Date
JP2013523477A JP2013523477A (ja) 2013-06-17
JP2013523477A5 JP2013523477A5 (enExample) 2014-05-29
JP5871904B2 true JP5871904B2 (ja) 2016-03-01

Family

ID=44224319

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013505060A Active JP5871904B2 (ja) 2010-04-12 2011-04-12 アブレシブエッチングおよびカッティングのためのフォトレジスト膜および方法

Country Status (5)

Country Link
EP (1) EP2558908B1 (enExample)
JP (1) JP5871904B2 (enExample)
KR (1) KR101846588B1 (enExample)
SG (1) SG184460A1 (enExample)
WO (1) WO2011130300A1 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2684211B1 (en) 2011-03-07 2017-01-18 Entegris, Inc. Chemical mechanical planarization pad conditioner
WO2015143278A1 (en) 2014-03-21 2015-09-24 Entegris, Inc. Chemical mechanical planarization pad conditioner with elongated cutting edges
US11342256B2 (en) 2019-01-24 2022-05-24 Applied Materials, Inc. Method of fine redistribution interconnect formation for advanced packaging applications
IT201900006740A1 (it) * 2019-05-10 2020-11-10 Applied Materials Inc Procedimenti di strutturazione di substrati
IT201900006736A1 (it) 2019-05-10 2020-11-10 Applied Materials Inc Procedimenti di fabbricazione di package
US11931855B2 (en) 2019-06-17 2024-03-19 Applied Materials, Inc. Planarization methods for packaging substrates
US11862546B2 (en) 2019-11-27 2024-01-02 Applied Materials, Inc. Package core assembly and fabrication methods
US11257790B2 (en) 2020-03-10 2022-02-22 Applied Materials, Inc. High connectivity device stacking
US11454884B2 (en) 2020-04-15 2022-09-27 Applied Materials, Inc. Fluoropolymer stamp fabrication method
US11400545B2 (en) 2020-05-11 2022-08-02 Applied Materials, Inc. Laser ablation for package fabrication
US11232951B1 (en) 2020-07-14 2022-01-25 Applied Materials, Inc. Method and apparatus for laser drilling blind vias
US11676832B2 (en) 2020-07-24 2023-06-13 Applied Materials, Inc. Laser ablation system for package fabrication
US11521937B2 (en) 2020-11-16 2022-12-06 Applied Materials, Inc. Package structures with built-in EMI shielding
US11404318B2 (en) 2020-11-20 2022-08-02 Applied Materials, Inc. Methods of forming through-silicon vias in substrates for advanced packaging
US11705365B2 (en) 2021-05-18 2023-07-18 Applied Materials, Inc. Methods of micro-via formation for advanced packaging
US12183684B2 (en) 2021-10-26 2024-12-31 Applied Materials, Inc. Semiconductor device packaging methods

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2510511B2 (ja) * 1986-04-24 1996-06-26 工業技術院長 スクリ−ン印刷版用感光性樹脂組成物
JP2631495B2 (ja) * 1988-03-10 1997-07-16 工業技術院長 スクリーン印刷版の製造法
ES2149754T3 (es) * 1990-10-22 2000-11-16 Aicello Chemical Company Ltd Metodo de grabado con mascara portadora de imagen y pelicula estratificada fotosensible para dicha mascara portadora de imagen.
US5989689A (en) * 1991-12-11 1999-11-23 The Chromaline Corporation Sandblast mask laminate with blastable pressure sensitive adhesive
US5415971A (en) * 1993-04-02 1995-05-16 The Chromaline Corporation Photoresist laminate including photoimageable adhesive layer
US6140006A (en) * 1998-06-15 2000-10-31 The Chromaline Corporation Integral membrane layer formed from a photosensitive layer in an imageable photoresist laminate

Also Published As

Publication number Publication date
EP2558908A1 (en) 2013-02-20
WO2011130300A1 (en) 2011-10-20
KR20130103316A (ko) 2013-09-23
EP2558908B1 (en) 2015-06-03
SG184460A1 (en) 2012-11-29
JP2013523477A (ja) 2013-06-17
KR101846588B1 (ko) 2018-04-06

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