JP5865391B2 - 光硬化性ダイシングダイ接合テープ - Google Patents

光硬化性ダイシングダイ接合テープ Download PDF

Info

Publication number
JP5865391B2
JP5865391B2 JP2013546243A JP2013546243A JP5865391B2 JP 5865391 B2 JP5865391 B2 JP 5865391B2 JP 2013546243 A JP2013546243 A JP 2013546243A JP 2013546243 A JP2013546243 A JP 2013546243A JP 5865391 B2 JP5865391 B2 JP 5865391B2
Authority
JP
Japan
Prior art keywords
sensitive adhesive
pressure
polymer
adhesive composition
die bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2013546243A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014503655A5 (enExample
JP2014503655A (ja
Inventor
ビョンチュル リー、
ビョンチュル リー、
ポーリーン チアン、
ポーリーン チアン、
ケビン ハリス ベッカー、
ケビン ハリス ベッカー、
Original Assignee
ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング
ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング, ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング filed Critical ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング
Publication of JP2014503655A publication Critical patent/JP2014503655A/ja
Publication of JP2014503655A5 publication Critical patent/JP2014503655A5/ja
Application granted granted Critical
Publication of JP5865391B2 publication Critical patent/JP5865391B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/62—Polymers of compounds having carbon-to-carbon double bonds
    • C08G18/6216—Polymers of alpha-beta ethylenically unsaturated carboxylic acids or of derivatives thereof
    • C08G18/622—Polymers of esters of alpha-beta ethylenically unsaturated carboxylic acids
    • C08G18/6225—Polymers of esters of acrylic or methacrylic acid
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/75—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic
    • C08G18/751—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring
    • C08G18/752—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group
    • C08G18/753—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group containing one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group having a primary carbon atom next to the isocyanate or isothiocyanate group
    • C08G18/755—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group containing one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group having a primary carbon atom next to the isocyanate or isothiocyanate group and at least one isocyanate or isothiocyanate group linked to a secondary carbon atom of the cycloaliphatic ring, e.g. isophorone diisocyanate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/81—Unsaturated isocyanates or isothiocyanates
    • C08G18/8108—Unsaturated isocyanates or isothiocyanates having only one isocyanate or isothiocyanate group
    • C08G18/8116—Unsaturated isocyanates or isothiocyanates having only one isocyanate or isothiocyanate group esters of acrylic or alkylacrylic acid having only one isocyanate or isothiocyanate group
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/02—Polysilicates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2170/00—Compositions for adhesives
    • C08G2170/40—Compositions for pressure-sensitive adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01331—Manufacture or treatment of die-attach connectors using blanket deposition
    • H10W72/01336—Manufacture or treatment of die-attach connectors using blanket deposition in solid form, e.g. by using a powder or by laminating a foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Adhesive Tapes (AREA)
  • Polyurethanes Or Polyureas (AREA)
JP2013546243A 2010-12-20 2011-12-16 光硬化性ダイシングダイ接合テープ Expired - Fee Related JP5865391B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201061424860P 2010-12-20 2010-12-20
US61/424,860 2010-12-20
PCT/US2011/065346 WO2012087780A2 (en) 2010-12-20 2011-12-16 Photocurable dicing die bonding tape

Publications (3)

Publication Number Publication Date
JP2014503655A JP2014503655A (ja) 2014-02-13
JP2014503655A5 JP2014503655A5 (enExample) 2014-09-25
JP5865391B2 true JP5865391B2 (ja) 2016-02-17

Family

ID=46314774

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013546243A Expired - Fee Related JP5865391B2 (ja) 2010-12-20 2011-12-16 光硬化性ダイシングダイ接合テープ

Country Status (7)

Country Link
US (1) US8546485B2 (enExample)
EP (1) EP2655536A4 (enExample)
JP (1) JP5865391B2 (enExample)
KR (1) KR101506830B1 (enExample)
CN (1) CN103492517B (enExample)
TW (1) TWI461501B (enExample)
WO (1) WO2012087780A2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI494410B (zh) * 2013-04-10 2015-08-01 Hon Hai Prec Ind Co Ltd 膠帶
US10043701B2 (en) * 2013-05-15 2018-08-07 Infineon Technologies Ag Substrate removal from a carrier
KR101709689B1 (ko) 2013-12-19 2017-02-23 주식회사 엘지화학 다이싱 필름 점착층 형성용 조성물 및 다이싱 필름
JP6693487B2 (ja) * 2017-08-24 2020-05-13 大日本印刷株式会社 保護シートおよび保護シート付積層体
CN111630129B (zh) * 2018-03-27 2021-07-06 三菱化学株式会社 粘合剂组合物、粘合片和含烯属不饱和基团的丙烯酸系树脂的制造方法
EP3715432A1 (en) * 2019-03-27 2020-09-30 3M Innovative Properties Company Pressure-sensitive adhesive composition with transparency characteristics

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2718516A (en) 1952-11-08 1955-09-20 Rohm & Haas Isocyanato esters of acrylic, methacrylic, and crotonic acids
US2821544A (en) 1954-04-26 1958-01-28 Bayer Ag Production of alkylisocyanate esters of 2-alkenoic acids
US3632796A (en) * 1969-02-11 1972-01-04 Scm Corp Saturated linear polymers having plural pendant ethylenic unsaturation
US3694415A (en) * 1970-07-15 1972-09-26 Kiyoshi Honda Coating resinous composition
US4192762A (en) * 1978-04-20 1980-03-11 Union Carbide Corporation Radiation curable urethane compositions
US4271223A (en) * 1978-11-02 1981-06-02 Minnesota Mining And Manufacturing Company Plastic film label stock
US4343919A (en) 1980-03-10 1982-08-10 The Dow Chemical Company Addition polymerizable polyethylenic polymers having pendant acryloyl urethane groups
US4377530A (en) 1982-03-05 1983-03-22 American Cyanamid Company Manufacture of isocyanates
US4439616A (en) 1982-07-22 1984-03-27 American Cyanamid Company Tertiary aralkyl urethanes and isocyanates derived therefrom
DE3689963T2 (de) * 1985-05-28 1994-11-03 Nippon Paint Co Ltd Polymerisationsverfahren unter Verwendung von Verbindungen mit polymerisierbaren Acylurethan-Strukturen.
US5296277A (en) * 1992-06-26 1994-03-22 Minnesota Mining And Manufacturing Company Positionable and repositionable adhesive articles
WO1995000573A1 (en) 1993-06-23 1995-01-05 Union Carbide Chemicals & Plastics Reactive polymers having pendant flexible side chains prepared from ethylenically unsaturated isocyanates
US5514522A (en) * 1993-11-01 1996-05-07 Polaroid Corporation Synthesis of photoreactive polymeric binders
US5932352A (en) * 1995-11-21 1999-08-03 Higgins; David Edward Release film
CN1070205C (zh) * 1995-11-21 2001-08-29 美国杜邦泰津胶片合伙人有限公司 隔离膜
TW496881B (en) * 1997-05-13 2002-08-01 Teijin Ltd Release film
JP3410371B2 (ja) * 1998-08-18 2003-05-26 リンテック株式会社 ウエハ裏面研削時の表面保護シートおよびその利用方法
CN1918256B (zh) * 2003-12-23 2011-11-16 Ge拜尔硅股份有限公司 具有改进的表面性质的可固化硅氧烷组合物
JP5010800B2 (ja) * 2004-03-26 2012-08-29 リンテック株式会社 半導体デバイスの製造方法及びダイシング用粘着テープ
US7807754B2 (en) * 2006-03-13 2010-10-05 3M Innovative Properties Company Dry apply adhesive graphic films
JP4874011B2 (ja) * 2006-06-23 2012-02-08 電気化学工業株式会社 粘着剤、粘着剤を用いた粘着シート、粘着シートを用いた多層粘着シート、及び多層粘着シートを用いた電子部品の製造方法。
MY147011A (en) * 2006-08-28 2012-10-15 Cytec Surface Specialties Sa Polymer compositions
JP4493643B2 (ja) * 2006-12-06 2010-06-30 日東電工株式会社 再剥離型粘着剤組成物、及び粘着テープ又はシート
JP5061308B2 (ja) * 2007-01-05 2012-10-31 フジコピアン株式会社 密着シート
KR100922684B1 (ko) 2007-08-31 2009-10-19 제일모직주식회사 점착층용 광경화 조성물 및 이를 포함하는 다이싱 테이프
CN101842455A (zh) * 2007-10-16 2010-09-22 电气化学工业株式会社 粘合剂、粘合片、多层粘合片以及生产电子部件的方法
JP4717086B2 (ja) 2008-01-18 2011-07-06 日東電工株式会社 ダイシング・ダイボンドフィルム
WO2009144985A1 (ja) * 2008-05-29 2009-12-03 電気化学工業株式会社 ダイシング方法
JP2010163518A (ja) * 2009-01-14 2010-07-29 Denki Kagaku Kogyo Kk 粘着剤、粘着剤を用いた粘着シート、粘着シートを用いたガラス部品の製造方法
KR101393922B1 (ko) * 2010-09-16 2014-05-12 세키스이가가쿠 고교가부시키가이샤 점착제 조성물, 점착 테이프, 및 웨이퍼의 처리 방법

Also Published As

Publication number Publication date
EP2655536A4 (en) 2014-07-16
EP2655536A2 (en) 2013-10-30
TW201231588A (en) 2012-08-01
US8546485B2 (en) 2013-10-01
US20130178585A1 (en) 2013-07-11
CN103492517B (zh) 2014-07-30
KR101506830B1 (ko) 2015-03-27
JP2014503655A (ja) 2014-02-13
WO2012087780A3 (en) 2012-11-01
WO2012087780A2 (en) 2012-06-28
CN103492517A (zh) 2014-01-01
KR20130119963A (ko) 2013-11-01
TWI461501B (zh) 2014-11-21

Similar Documents

Publication Publication Date Title
KR100942363B1 (ko) 플루오르를 포함하는 자외선(광)경화형 점착제 조성물 및이를 이용한 점착필름
JP5302951B2 (ja) 粘着シート
JP5513866B2 (ja) 電子部品加工用粘着シート
KR101506830B1 (ko) 광경화성 다이싱 다이 본딩 테이프
TW200838963A (en) Photocurable pressure-sensitive adhesive composition including acrylic binder resin, adhesive tape using the same, and associated methods
JP5503342B2 (ja) ダイシング・ダイボンディングテープ
KR100943609B1 (ko) 아크릴계 공중합체를 포함하는 광경화형 점착 조성물, 이를이용한 점착필름 및 점착테이프
CN102640277A (zh) 粘合片及电子部件
CN107949614A (zh) 粘着剂组合物及其制造方法、以及粘着膜
KR101170529B1 (ko) 액상 실리콘 변성 아크릴레이트 수지를 포함하는 광경화형 점착 조성물 및 이를 이용한 점착테이프
TW201213481A (en) Viscoelastic body and method for manufacturing the same
KR100942355B1 (ko) 액상 폴리이소프렌 고무를 포함하는 광경화형 점착 조성물및 이를 이용한 광경화형 점착 테이프
CN110785469A (zh) 切割管芯接合膜
JP2012054431A (ja) 半導体ウエハ保護用粘着シート
JP3516384B2 (ja) 再剥離型粘着剤組成物
CN111406099B9 (zh) 背面研磨带
KR101229548B1 (ko) 광중합성기 함유 화합물, 이의 제조방법 및 이를 이용한 광중합성 아크릴 점착제 조성물
KR101138796B1 (ko) 아크릴계 점착 수지 조성물 및 이를 포함하는 광경화형 점착 조성물
CN117715995A (zh) 脱模膜和半导体封装体的制造方法
KR20120068453A (ko) 다이싱 다이 본딩 필름
CN117624498B (zh) 侧链含可光固化烯基的聚丙烯酸酯和uv减粘胶组合物
JP4017132B2 (ja) 再剥離型粘着剤組成物
KR102596425B1 (ko) 마이크로 led 디스플레이용 자외선 경화성 조성물 및 이를 이용한 마이크로 led 디스플레이용 점착필름.
KR100922682B1 (ko) 점착제 조성물 및 이를 이용한 점착 테이프
TW202525583A (zh) 晶圓背面研磨用粘結膜

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140806

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140806

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20140806

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20140827

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20140902

A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A711

Effective date: 20141120

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20141201

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20141208

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20141225

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150115

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150407

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150706

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150818

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20151117

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20151208

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20151225

R150 Certificate of patent or registration of utility model

Ref document number: 5865391

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees