JP2014503655A5 - - Google Patents

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Publication number
JP2014503655A5
JP2014503655A5 JP2013546243A JP2013546243A JP2014503655A5 JP 2014503655 A5 JP2014503655 A5 JP 2014503655A5 JP 2013546243 A JP2013546243 A JP 2013546243A JP 2013546243 A JP2013546243 A JP 2013546243A JP 2014503655 A5 JP2014503655 A5 JP 2014503655A5
Authority
JP
Japan
Prior art keywords
sensitive adhesive
pressure sensitive
carbon
diisocyanate
polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013546243A
Other languages
English (en)
Japanese (ja)
Other versions
JP5865391B2 (ja
JP2014503655A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2011/065346 external-priority patent/WO2012087780A2/en
Publication of JP2014503655A publication Critical patent/JP2014503655A/ja
Publication of JP2014503655A5 publication Critical patent/JP2014503655A5/ja
Application granted granted Critical
Publication of JP5865391B2 publication Critical patent/JP5865391B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2013546243A 2010-12-20 2011-12-16 光硬化性ダイシングダイ接合テープ Expired - Fee Related JP5865391B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201061424860P 2010-12-20 2010-12-20
US61/424,860 2010-12-20
PCT/US2011/065346 WO2012087780A2 (en) 2010-12-20 2011-12-16 Photocurable dicing die bonding tape

Publications (3)

Publication Number Publication Date
JP2014503655A JP2014503655A (ja) 2014-02-13
JP2014503655A5 true JP2014503655A5 (enExample) 2014-09-25
JP5865391B2 JP5865391B2 (ja) 2016-02-17

Family

ID=46314774

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013546243A Expired - Fee Related JP5865391B2 (ja) 2010-12-20 2011-12-16 光硬化性ダイシングダイ接合テープ

Country Status (7)

Country Link
US (1) US8546485B2 (enExample)
EP (1) EP2655536A4 (enExample)
JP (1) JP5865391B2 (enExample)
KR (1) KR101506830B1 (enExample)
CN (1) CN103492517B (enExample)
TW (1) TWI461501B (enExample)
WO (1) WO2012087780A2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI494410B (zh) * 2013-04-10 2015-08-01 Hon Hai Prec Ind Co Ltd 膠帶
US10043701B2 (en) * 2013-05-15 2018-08-07 Infineon Technologies Ag Substrate removal from a carrier
KR101709689B1 (ko) 2013-12-19 2017-02-23 주식회사 엘지화학 다이싱 필름 점착층 형성용 조성물 및 다이싱 필름
JP6693487B2 (ja) * 2017-08-24 2020-05-13 大日本印刷株式会社 保護シートおよび保護シート付積層体
TWI781299B (zh) * 2018-03-27 2022-10-21 日商三菱化學股份有限公司 黏著劑組成物、黏著片以及含有乙烯性不飽和基之丙烯酸系樹脂之製造方法
EP3715432A1 (en) * 2019-03-27 2020-09-30 3M Innovative Properties Company Pressure-sensitive adhesive composition with transparency characteristics

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2718516A (en) 1952-11-08 1955-09-20 Rohm & Haas Isocyanato esters of acrylic, methacrylic, and crotonic acids
US2821544A (en) 1954-04-26 1958-01-28 Bayer Ag Production of alkylisocyanate esters of 2-alkenoic acids
US3632796A (en) * 1969-02-11 1972-01-04 Scm Corp Saturated linear polymers having plural pendant ethylenic unsaturation
US3694415A (en) * 1970-07-15 1972-09-26 Kiyoshi Honda Coating resinous composition
US4192762A (en) * 1978-04-20 1980-03-11 Union Carbide Corporation Radiation curable urethane compositions
US4271223A (en) * 1978-11-02 1981-06-02 Minnesota Mining And Manufacturing Company Plastic film label stock
US4343919A (en) 1980-03-10 1982-08-10 The Dow Chemical Company Addition polymerizable polyethylenic polymers having pendant acryloyl urethane groups
US4377530A (en) 1982-03-05 1983-03-22 American Cyanamid Company Manufacture of isocyanates
US4439616A (en) 1982-07-22 1984-03-27 American Cyanamid Company Tertiary aralkyl urethanes and isocyanates derived therefrom
US4902727A (en) * 1985-05-28 1990-02-20 Nippon Paint Co., Ltd. Compounds having a polymerizable acylurethane structure, and their production and process of using
US5296277A (en) * 1992-06-26 1994-03-22 Minnesota Mining And Manufacturing Company Positionable and repositionable adhesive articles
AU7315194A (en) 1993-06-23 1995-01-17 Union Carbide Chemicals & Plastics Technology Corporation Reactive polymers having pendant flexible side chains prepared from ethylenically unsaturated isocyanates
US5514522A (en) * 1993-11-01 1996-05-07 Polaroid Corporation Synthesis of photoreactive polymeric binders
KR100418843B1 (ko) * 1995-11-21 2005-01-15 듀폰 테이진 필름즈 유.에스. 리미티드 파트너쉽 이형막
US5932352A (en) * 1995-11-21 1999-08-03 Higgins; David Edward Release film
TW496881B (en) * 1997-05-13 2002-08-01 Teijin Ltd Release film
JP3410371B2 (ja) * 1998-08-18 2003-05-26 リンテック株式会社 ウエハ裏面研削時の表面保護シートおよびその利用方法
WO2005063890A2 (en) * 2003-12-23 2005-07-14 Ge Bayer Silicones Gmbh & Co. Kg Curable siloxane composition with modified surface properties
JP5010800B2 (ja) * 2004-03-26 2012-08-29 リンテック株式会社 半導体デバイスの製造方法及びダイシング用粘着テープ
US7807754B2 (en) * 2006-03-13 2010-10-05 3M Innovative Properties Company Dry apply adhesive graphic films
JP4874011B2 (ja) * 2006-06-23 2012-02-08 電気化学工業株式会社 粘着剤、粘着剤を用いた粘着シート、粘着シートを用いた多層粘着シート、及び多層粘着シートを用いた電子部品の製造方法。
MY147011A (en) * 2006-08-28 2012-10-15 Cytec Surface Specialties Sa Polymer compositions
JP4493643B2 (ja) * 2006-12-06 2010-06-30 日東電工株式会社 再剥離型粘着剤組成物、及び粘着テープ又はシート
JP5061308B2 (ja) * 2007-01-05 2012-10-31 フジコピアン株式会社 密着シート
KR100922684B1 (ko) 2007-08-31 2009-10-19 제일모직주식회사 점착층용 광경화 조성물 및 이를 포함하는 다이싱 테이프
CN101842455A (zh) * 2007-10-16 2010-09-22 电气化学工业株式会社 粘合剂、粘合片、多层粘合片以及生产电子部件的方法
JP4717086B2 (ja) 2008-01-18 2011-07-06 日東電工株式会社 ダイシング・ダイボンドフィルム
MY155357A (en) * 2008-05-29 2015-10-15 Denki Kagaku Kogyo Kk Dicing method using a die attach film on an adhesive sheet
JP2010163518A (ja) * 2009-01-14 2010-07-29 Denki Kagaku Kogyo Kk 粘着剤、粘着剤を用いた粘着シート、粘着シートを用いたガラス部品の製造方法
US20130220533A1 (en) * 2010-09-16 2013-08-29 Toru Tonegawa Pressure-sensitive adhesive compound, pressure-sensitive adhesive tape, and wafer treatment method

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