JP2014503655A5 - - Google Patents
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- Publication number
- JP2014503655A5 JP2014503655A5 JP2013546243A JP2013546243A JP2014503655A5 JP 2014503655 A5 JP2014503655 A5 JP 2014503655A5 JP 2013546243 A JP2013546243 A JP 2013546243A JP 2013546243 A JP2013546243 A JP 2013546243A JP 2014503655 A5 JP2014503655 A5 JP 2014503655A5
- Authority
- JP
- Japan
- Prior art keywords
- sensitive adhesive
- pressure sensitive
- carbon
- diisocyanate
- polymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Claims (3)
- (A)ペンダント炭素−炭素不飽和を有する感圧接着剤ポリマーであって、ポリエチレン骨格および少なくとも1つのペンダントアクリロイルウレタン基を有する前記感圧接着剤ポリマー(A)と、
(B)炭素−炭素不飽和で末端封止された疎水性ポリマーであって、ビニル末端シロキサンポリマーおよび/またはビニル末端フルオロポリマーである前記疎水性ポリマー(B)と、を含む、
感圧接着剤組成物。 - さらに、前記組成物の(A)および(B)ポリマーを部分的に架橋するのに有効な量でポリイソシアネートを含む、請求項1に記載の感圧接着剤組成物。
- 前記ポリイソシアネートが、ジイソホロンジイソシアネート、トルエンジイソシアネート、ジフェニルメタンジイソシアネート、および1,5−ナフタレンジイソシアネートからなる群より選択される、請求項2に記載の感圧接着剤組成物。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201061424860P | 2010-12-20 | 2010-12-20 | |
US61/424,860 | 2010-12-20 | ||
PCT/US2011/065346 WO2012087780A2 (en) | 2010-12-20 | 2011-12-16 | Photocurable dicing die bonding tape |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2014503655A JP2014503655A (ja) | 2014-02-13 |
JP2014503655A5 true JP2014503655A5 (ja) | 2014-09-25 |
JP5865391B2 JP5865391B2 (ja) | 2016-02-17 |
Family
ID=46314774
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013546243A Active JP5865391B2 (ja) | 2010-12-20 | 2011-12-16 | 光硬化性ダイシングダイ接合テープ |
Country Status (7)
Country | Link |
---|---|
US (1) | US8546485B2 (ja) |
EP (1) | EP2655536A4 (ja) |
JP (1) | JP5865391B2 (ja) |
KR (1) | KR101506830B1 (ja) |
CN (1) | CN103492517B (ja) |
TW (1) | TWI461501B (ja) |
WO (1) | WO2012087780A2 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI494410B (zh) * | 2013-04-10 | 2015-08-01 | Hon Hai Prec Ind Co Ltd | 膠帶 |
US10043701B2 (en) | 2013-05-15 | 2018-08-07 | Infineon Technologies Ag | Substrate removal from a carrier |
KR101709689B1 (ko) | 2013-12-19 | 2017-02-23 | 주식회사 엘지화학 | 다이싱 필름 점착층 형성용 조성물 및 다이싱 필름 |
JP6693487B2 (ja) * | 2017-08-24 | 2020-05-13 | 大日本印刷株式会社 | 保護シートおよび保護シート付積層体 |
TWI781299B (zh) * | 2018-03-27 | 2022-10-21 | 日商三菱化學股份有限公司 | 黏著劑組成物、黏著片以及含有乙烯性不飽和基之丙烯酸系樹脂之製造方法 |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2718516A (en) | 1952-11-08 | 1955-09-20 | Rohm & Haas | Isocyanato esters of acrylic, methacrylic, and crotonic acids |
US2821544A (en) | 1954-04-26 | 1958-01-28 | Bayer Ag | Production of alkylisocyanate esters of 2-alkenoic acids |
US3632796A (en) * | 1969-02-11 | 1972-01-04 | Scm Corp | Saturated linear polymers having plural pendant ethylenic unsaturation |
US3694415A (en) * | 1970-07-15 | 1972-09-26 | Kiyoshi Honda | Coating resinous composition |
US4192762A (en) * | 1978-04-20 | 1980-03-11 | Union Carbide Corporation | Radiation curable urethane compositions |
US4271223A (en) * | 1978-11-02 | 1981-06-02 | Minnesota Mining And Manufacturing Company | Plastic film label stock |
US4343919A (en) | 1980-03-10 | 1982-08-10 | The Dow Chemical Company | Addition polymerizable polyethylenic polymers having pendant acryloyl urethane groups |
US4377530A (en) | 1982-03-05 | 1983-03-22 | American Cyanamid Company | Manufacture of isocyanates |
US4439616A (en) | 1982-07-22 | 1984-03-27 | American Cyanamid Company | Tertiary aralkyl urethanes and isocyanates derived therefrom |
US4902727A (en) * | 1985-05-28 | 1990-02-20 | Nippon Paint Co., Ltd. | Compounds having a polymerizable acylurethane structure, and their production and process of using |
US5296277A (en) * | 1992-06-26 | 1994-03-22 | Minnesota Mining And Manufacturing Company | Positionable and repositionable adhesive articles |
WO1995000573A1 (en) | 1993-06-23 | 1995-01-05 | Union Carbide Chemicals & Plastics | Reactive polymers having pendant flexible side chains prepared from ethylenically unsaturated isocyanates |
US5514522A (en) * | 1993-11-01 | 1996-05-07 | Polaroid Corporation | Synthesis of photoreactive polymeric binders |
KR100418843B1 (ko) * | 1995-11-21 | 2005-01-15 | 듀폰 테이진 필름즈 유.에스. 리미티드 파트너쉽 | 이형막 |
US5932352A (en) * | 1995-11-21 | 1999-08-03 | Higgins; David Edward | Release film |
TW496881B (en) * | 1997-05-13 | 2002-08-01 | Teijin Ltd | Release film |
JP3410371B2 (ja) * | 1998-08-18 | 2003-05-26 | リンテック株式会社 | ウエハ裏面研削時の表面保護シートおよびその利用方法 |
BRPI0418131A (pt) * | 2003-12-23 | 2007-04-27 | Ge Bayer Silicones Gmbh & Co | composição de siloxano curável com propriedades de superfìcie modificadas |
JP5010800B2 (ja) * | 2004-03-26 | 2012-08-29 | リンテック株式会社 | 半導体デバイスの製造方法及びダイシング用粘着テープ |
US7807754B2 (en) * | 2006-03-13 | 2010-10-05 | 3M Innovative Properties Company | Dry apply adhesive graphic films |
JP4874011B2 (ja) * | 2006-06-23 | 2012-02-08 | 電気化学工業株式会社 | 粘着剤、粘着剤を用いた粘着シート、粘着シートを用いた多層粘着シート、及び多層粘着シートを用いた電子部品の製造方法。 |
MY147011A (en) * | 2006-08-28 | 2012-10-15 | Cytec Surface Specialties Sa | Polymer compositions |
JP4493643B2 (ja) * | 2006-12-06 | 2010-06-30 | 日東電工株式会社 | 再剥離型粘着剤組成物、及び粘着テープ又はシート |
JP5061308B2 (ja) * | 2007-01-05 | 2012-10-31 | フジコピアン株式会社 | 密着シート |
KR100922684B1 (ko) | 2007-08-31 | 2009-10-19 | 제일모직주식회사 | 점착층용 광경화 조성물 및 이를 포함하는 다이싱 테이프 |
US8389629B2 (en) * | 2007-10-16 | 2013-03-05 | Denki Kagaku Kogyo Kabushiki Kaisha | Adhesive, adhesive sheet, multi-layered adhesive sheet, and production method for electronic part |
JP4717086B2 (ja) | 2008-01-18 | 2011-07-06 | 日東電工株式会社 | ダイシング・ダイボンドフィルム |
US8114759B2 (en) * | 2008-05-29 | 2012-02-14 | Denki Kagaku Kogyo Kabushiki Kaisha | Dicing method using a die attach film on an adhesive sheet |
JP2010163518A (ja) * | 2009-01-14 | 2010-07-29 | Denki Kagaku Kogyo Kk | 粘着剤、粘着剤を用いた粘着シート、粘着シートを用いたガラス部品の製造方法 |
US20130220533A1 (en) * | 2010-09-16 | 2013-08-29 | Toru Tonegawa | Pressure-sensitive adhesive compound, pressure-sensitive adhesive tape, and wafer treatment method |
-
2011
- 2011-12-15 TW TW100146596A patent/TWI461501B/zh not_active IP Right Cessation
- 2011-12-16 WO PCT/US2011/065346 patent/WO2012087780A2/en active Application Filing
- 2011-12-16 CN CN201180061733.0A patent/CN103492517B/zh active Active
- 2011-12-16 KR KR1020137019067A patent/KR101506830B1/ko active IP Right Grant
- 2011-12-16 EP EP11850894.4A patent/EP2655536A4/en not_active Withdrawn
- 2011-12-16 JP JP2013546243A patent/JP5865391B2/ja active Active
-
2013
- 2013-03-05 US US13/785,488 patent/US8546485B2/en active Active
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