JP5864585B2 - 可撓性の被覆層を持つｏｌｅｄ - Google Patents

可撓性の被覆層を持つｏｌｅｄ Download PDF

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Publication number
JP5864585B2
JP5864585B2 JP2013529757A JP2013529757A JP5864585B2 JP 5864585 B2 JP5864585 B2 JP 5864585B2 JP 2013529757 A JP2013529757 A JP 2013529757A JP 2013529757 A JP2013529757 A JP 2013529757A JP 5864585 B2 JP5864585 B2 JP 5864585B2
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Japan
Prior art keywords
cover
layer
substrate
sealing material
oled
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JP2013529757A
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English (en)
Japanese (ja)
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JP2013541158A (ja
JP2013541158A5 (enExample
Inventor
ペトルス コルネリス パウルス ボウテン
ペトルス コルネリス パウルス ボウテン
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Koninklijke Philips NV
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Koninklijke Philips NV
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Application filed by Koninklijke Philips NV filed Critical Koninklijke Philips NV
Publication of JP2013541158A publication Critical patent/JP2013541158A/ja
Publication of JP2013541158A5 publication Critical patent/JP2013541158A5/ja
Application granted granted Critical
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8423—Metallic sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
JP2013529757A 2010-09-27 2011-09-23 可撓性の被覆層を持つｏｌｅｄ Active JP5864585B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP10179987 2010-09-27
EP10179987.2 2010-09-27
PCT/IB2011/054199 WO2012042451A1 (en) 2010-09-27 2011-09-23 Oled with flexible cover layer

Publications (3)

Publication Number Publication Date
JP2013541158A JP2013541158A (ja) 2013-11-07
JP2013541158A5 JP2013541158A5 (enExample) 2014-10-30
JP5864585B2 true JP5864585B2 (ja) 2016-02-17

Family

ID=44903303

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013529757A Active JP5864585B2 (ja) 2010-09-27 2011-09-23 可撓性の被覆層を持つｏｌｅｄ

Country Status (6)

Country Link
US (1) US8829792B2 (enExample)
EP (1) EP2622666B1 (enExample)
JP (1) JP5864585B2 (enExample)
CN (1) CN103109389B (enExample)
TW (1) TW201220570A (enExample)
WO (1) WO2012042451A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013106815A1 (de) * 2013-06-28 2014-12-31 Osram Oled Gmbh Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelementes
DE102013110174B4 (de) * 2013-09-16 2025-04-10 Pictiva Displays International Limited Elektronisches Bauelement und Verfahren zur Herstellung eines elektronischen Bauelements
JP2015153581A (ja) * 2014-02-13 2015-08-24 パイオニア株式会社 発光素子
KR102202145B1 (ko) * 2014-03-28 2021-01-13 삼성디스플레이 주식회사 완충패드를 갖는 표시장치
US20150372251A1 (en) * 2014-06-19 2015-12-24 Toshishige Fujii Electric element package
CN105679800B (zh) * 2016-01-27 2019-08-13 京东方科技集团股份有限公司 Oled显示屏及其制备方法、显示设备
US9614187B1 (en) 2016-03-29 2017-04-04 Industrial Technology Research Institute Electronic device package and package method thereof
CN107644944B (zh) * 2017-09-12 2019-12-03 武汉华星光电半导体显示技术有限公司 柔性材料、柔性盖板及其制备方法
KR102453880B1 (ko) * 2020-11-18 2022-10-14 고려대학교 산학협력단 신축 가능한 봉지재

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001118674A (ja) 1999-10-19 2001-04-27 Auto Network Gijutsu Kenkyusho:Kk 有機ｅｌ表示装置
JP4010394B2 (ja) * 2001-12-14 2007-11-21 大日本印刷株式会社 エレクトロルミネッセント素子
JP4089263B2 (ja) * 2002-04-03 2008-05-28 セイコーエプソン株式会社 エレクトロルミネッセンス装置とその製造方法、電子機器
US6787990B2 (en) 2002-05-28 2004-09-07 Eastman Kodak Company OLED area illumination light source having flexible substrate on a support
JP2004095412A (ja) * 2002-08-30 2004-03-25 Hitachi Chem Co Ltd 有機ｅｌ素子の封止方法及び封止材
WO2004086530A1 (en) 2003-03-25 2004-10-07 Koninklijke Philips Electronics N.V. Flexible electroluminescent device
US6998648B2 (en) 2003-08-25 2006-02-14 Universal Display Corporation Protected organic electronic device structures incorporating pressure sensitive adhesive and desiccant
KR100611226B1 (ko) * 2003-11-25 2006-08-09 삼성에스디아이 주식회사 유기 전계 발광 표시 장치
CN100525559C (zh) * 2004-06-11 2009-08-05 三洋电机株式会社 显示面板的制造方法及显示面板
US7659665B2 (en) * 2005-02-16 2010-02-09 Koninklijke Philips Electronics, N.V. OLED device with metal foil
WO2007067533A2 (en) * 2005-12-06 2007-06-14 Corning Incorporated System and method for frit sealing glass packages
US7663312B2 (en) * 2006-07-24 2010-02-16 Munisamy Anandan Flexible OLED light source
WO2008032526A1 (en) 2006-09-15 2008-03-20 Konica Minolta Holdings, Inc. Process for production of flexible sealing film and organic electroluminescent devices made by using the film
KR101458899B1 (ko) * 2007-03-28 2014-11-10 삼성디스플레이 주식회사 표시 장치 및 그 제조 방법
CN101669227A (zh) 2007-04-27 2010-03-10 皇家飞利浦电子股份有限公司 设有包封结构的oled布置
CN201146622Y (zh) * 2007-09-11 2008-11-05 西安海晶光电科技有限公司 一种低成本多用途的有机电致发光显示屏
US8016631B2 (en) 2007-11-16 2011-09-13 Global Oled Technology Llc Desiccant sealing arrangement for OLED devices
US8846169B2 (en) 2007-12-28 2014-09-30 3M Innovative Properties Company Flexible encapsulating film systems
WO2009139291A1 (ja) * 2008-05-12 2009-11-19 財団法人山形県産業技術振興機構 有機ｅｌ発光パネルの製造方法および製造装置
US8445899B2 (en) * 2009-03-16 2013-05-21 Konica Minolta Holdings, Inc. Organic electronic panel and method for manufacturing organic electronic panel
KR101097349B1 (ko) * 2010-03-11 2011-12-23 삼성모바일디스플레이주식회사 유기 발광 디스플레이 장치 및 그 제조 방법
CN102947969B (zh) 2010-06-22 2017-02-22 皇家飞利浦电子股份有限公司 具有分隔箔的有机电致发光设备

Also Published As

Publication number Publication date
EP2622666A1 (en) 2013-08-07
CN103109389B (zh) 2016-01-20
JP2013541158A (ja) 2013-11-07
CN103109389A (zh) 2013-05-15
US8829792B2 (en) 2014-09-09
TW201220570A (en) 2012-05-16
WO2012042451A1 (en) 2012-04-05
US20130207541A1 (en) 2013-08-15
EP2622666B1 (en) 2020-08-05

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