TW201220570A - OLED with flexible cover layer - Google Patents
OLED with flexible cover layer Download PDFInfo
- Publication number
- TW201220570A TW201220570A TW100134648A TW100134648A TW201220570A TW 201220570 A TW201220570 A TW 201220570A TW 100134648 A TW100134648 A TW 100134648A TW 100134648 A TW100134648 A TW 100134648A TW 201220570 A TW201220570 A TW 201220570A
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- cladding
- organic electroluminescent
- substrate
- electroluminescent device
- Prior art date
Links
- 125000006850 spacer group Chemical group 0.000 claims abstract description 49
- 239000000463 material Substances 0.000 claims abstract description 48
- 239000003566 sealing material Substances 0.000 claims abstract description 45
- 239000000758 substrate Substances 0.000 claims abstract description 40
- 238000005401 electroluminescence Methods 0.000 claims abstract 2
- 238000005253 cladding Methods 0.000 claims description 104
- 238000000034 method Methods 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 238000007789 sealing Methods 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 230000035515 penetration Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 160
- 239000011521 glass Substances 0.000 description 8
- 238000001723 curing Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 230000035699 permeability Effects 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- -1 polyethylene Polymers 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- IBPADELTPKRSCQ-UHFFFAOYSA-N 9h-fluoren-1-yl prop-2-enoate Chemical compound C1C2=CC=CC=C2C2=C1C(OC(=O)C=C)=CC=C2 IBPADELTPKRSCQ-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 238000001883 metal evaporation Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8423—Metallic sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP10179987 | 2010-09-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201220570A true TW201220570A (en) | 2012-05-16 |
Family
ID=44903303
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100134648A TW201220570A (en) | 2010-09-27 | 2011-09-26 | OLED with flexible cover layer |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8829792B2 (enExample) |
| EP (1) | EP2622666B1 (enExample) |
| JP (1) | JP5864585B2 (enExample) |
| CN (1) | CN103109389B (enExample) |
| TW (1) | TW201220570A (enExample) |
| WO (1) | WO2012042451A1 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102013106815A1 (de) * | 2013-06-28 | 2014-12-31 | Osram Oled Gmbh | Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelementes |
| DE102013110174B4 (de) * | 2013-09-16 | 2025-04-10 | Pictiva Displays International Limited | Elektronisches Bauelement und Verfahren zur Herstellung eines elektronischen Bauelements |
| JP2015153581A (ja) * | 2014-02-13 | 2015-08-24 | パイオニア株式会社 | 発光素子 |
| KR102202145B1 (ko) * | 2014-03-28 | 2021-01-13 | 삼성디스플레이 주식회사 | 완충패드를 갖는 표시장치 |
| US20150372251A1 (en) * | 2014-06-19 | 2015-12-24 | Toshishige Fujii | Electric element package |
| CN105679800B (zh) * | 2016-01-27 | 2019-08-13 | 京东方科技集团股份有限公司 | Oled显示屏及其制备方法、显示设备 |
| US9614187B1 (en) | 2016-03-29 | 2017-04-04 | Industrial Technology Research Institute | Electronic device package and package method thereof |
| CN107644944B (zh) * | 2017-09-12 | 2019-12-03 | 武汉华星光电半导体显示技术有限公司 | 柔性材料、柔性盖板及其制备方法 |
| KR102453880B1 (ko) * | 2020-11-18 | 2022-10-14 | 고려대학교 산학협력단 | 신축 가능한 봉지재 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001118674A (ja) | 1999-10-19 | 2001-04-27 | Auto Network Gijutsu Kenkyusho:Kk | 有機ｅｌ表示装置 |
| JP4010394B2 (ja) * | 2001-12-14 | 2007-11-21 | 大日本印刷株式会社 | エレクトロルミネッセント素子 |
| JP4089263B2 (ja) * | 2002-04-03 | 2008-05-28 | セイコーエプソン株式会社 | エレクトロルミネッセンス装置とその製造方法、電子機器 |
| US6787990B2 (en) | 2002-05-28 | 2004-09-07 | Eastman Kodak Company | OLED area illumination light source having flexible substrate on a support |
| JP2004095412A (ja) * | 2002-08-30 | 2004-03-25 | Hitachi Chem Co Ltd | 有機ｅｌ素子の封止方法及び封止材 |
| WO2004086530A1 (en) | 2003-03-25 | 2004-10-07 | Koninklijke Philips Electronics N.V. | Flexible electroluminescent device |
| US6998648B2 (en) | 2003-08-25 | 2006-02-14 | Universal Display Corporation | Protected organic electronic device structures incorporating pressure sensitive adhesive and desiccant |
| KR100611226B1 (ko) * | 2003-11-25 | 2006-08-09 | 삼성에스디아이 주식회사 | 유기 전계 발광 표시 장치 |
| CN100525559C (zh) * | 2004-06-11 | 2009-08-05 | 三洋电机株式会社 | 显示面板的制造方法及显示面板 |
| US7659665B2 (en) * | 2005-02-16 | 2010-02-09 | Koninklijke Philips Electronics, N.V. | OLED device with metal foil |
| WO2007067533A2 (en) * | 2005-12-06 | 2007-06-14 | Corning Incorporated | System and method for frit sealing glass packages |
| US7663312B2 (en) * | 2006-07-24 | 2010-02-16 | Munisamy Anandan | Flexible OLED light source |
| WO2008032526A1 (en) | 2006-09-15 | 2008-03-20 | Konica Minolta Holdings, Inc. | Process for production of flexible sealing film and organic electroluminescent devices made by using the film |
| KR101458899B1 (ko) * | 2007-03-28 | 2014-11-10 | 삼성디스플레이 주식회사 | 표시 장치 및 그 제조 방법 |
| CN101669227A (zh) | 2007-04-27 | 2010-03-10 | 皇家飞利浦电子股份有限公司 | 设有包封结构的oled布置 |
| CN201146622Y (zh) * | 2007-09-11 | 2008-11-05 | 西安海晶光电科技有限公司 | 一种低成本多用途的有机电致发光显示屏 |
| US8016631B2 (en) | 2007-11-16 | 2011-09-13 | Global Oled Technology Llc | Desiccant sealing arrangement for OLED devices |
| US8846169B2 (en) | 2007-12-28 | 2014-09-30 | 3M Innovative Properties Company | Flexible encapsulating film systems |
| WO2009139291A1 (ja) * | 2008-05-12 | 2009-11-19 | 財団法人山形県産業技術振興機構 | 有機ｅｌ発光パネルの製造方法および製造装置 |
| US8445899B2 (en) * | 2009-03-16 | 2013-05-21 | Konica Minolta Holdings, Inc. | Organic electronic panel and method for manufacturing organic electronic panel |
| KR101097349B1 (ko) * | 2010-03-11 | 2011-12-23 | 삼성모바일디스플레이주식회사 | 유기 발광 디스플레이 장치 및 그 제조 방법 |
| CN102947969B (zh) | 2010-06-22 | 2017-02-22 | 皇家飞利浦电子股份有限公司 | 具有分隔箔的有机电致发光设备 |
-
2011
- 2011-09-23 CN CN201180046603.XA patent/CN103109389B/zh active Active
- 2011-09-23 US US13/825,332 patent/US8829792B2/en active Active
- 2011-09-23 EP EP11773551.4A patent/EP2622666B1/en active Active
- 2011-09-23 WO PCT/IB2011/054199 patent/WO2012042451A1/en not_active Ceased
- 2011-09-23 JP JP2013529757A patent/JP5864585B2/ja active Active
- 2011-09-26 TW TW100134648A patent/TW201220570A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP5864585B2 (ja) | 2016-02-17 |
| EP2622666A1 (en) | 2013-08-07 |
| CN103109389B (zh) | 2016-01-20 |
| JP2013541158A (ja) | 2013-11-07 |
| CN103109389A (zh) | 2013-05-15 |
| US8829792B2 (en) | 2014-09-09 |
| WO2012042451A1 (en) | 2012-04-05 |
| US20130207541A1 (en) | 2013-08-15 |
| EP2622666B1 (en) | 2020-08-05 |
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