GB2383683A - Sealed housing for a display device comprising two sealing layers - Google Patents
Sealed housing for a display device comprising two sealing layers Download PDFInfo
- Publication number
- GB2383683A GB2383683A GB0212730A GB0212730A GB2383683A GB 2383683 A GB2383683 A GB 2383683A GB 0212730 A GB0212730 A GB 0212730A GB 0212730 A GB0212730 A GB 0212730A GB 2383683 A GB2383683 A GB 2383683A
- Authority
- GB
- United Kingdom
- Prior art keywords
- housing structure
- rib
- structure according
- sealing
- sealing layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007789 sealing Methods 0.000 title claims abstract description 119
- 239000000758 substrate Substances 0.000 claims abstract description 30
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 17
- 239000001301 oxygen Substances 0.000 claims abstract description 17
- 230000001681 protective effect Effects 0.000 claims abstract 2
- 239000010410 layer Substances 0.000 claims description 95
- 239000011521 glass Substances 0.000 claims description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- 239000000919 ceramic Substances 0.000 claims description 11
- 229920000642 polymer Polymers 0.000 claims description 10
- 239000002131 composite material Substances 0.000 claims description 9
- 239000011241 protective layer Substances 0.000 claims description 8
- 238000003475 lamination Methods 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 5
- 229920000620 organic polymer Polymers 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- 239000007789 gas Substances 0.000 claims 5
- 239000004973 liquid crystal related substance Substances 0.000 claims 2
- 239000011358 absorbing material Substances 0.000 abstract 1
- 238000005401 electroluminescence Methods 0.000 description 44
- 238000010586 diagram Methods 0.000 description 22
- 238000000034 method Methods 0.000 description 20
- 238000001723 curing Methods 0.000 description 15
- 239000003795 chemical substances by application Substances 0.000 description 6
- 230000009977 dual effect Effects 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 238000011282 treatment Methods 0.000 description 6
- POIUWJQBRNEFGX-XAMSXPGMSA-N cathelicidin Chemical compound C([C@@H](C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CO)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CCC(O)=O)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H]([C@@H](C)CC)C(=O)NCC(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CCC(O)=O)C(=O)N[C@@H](CC=1C=CC=CC=1)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H]([C@@H](C)CC)C(=O)N[C@@H](C(C)C)C(=O)N[C@@H](CCC(N)=O)C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H]([C@@H](C)CC)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CC(O)=O)C(=O)N[C@@H](CC=1C=CC=CC=1)C(=O)N[C@@H](CC(C)C)C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H](CC(N)=O)C(=O)N[C@@H](CC(C)C)C(=O)N[C@@H](C(C)C)C(=O)N1[C@@H](CCC1)C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H]([C@@H](C)O)C(=O)N[C@@H](CCC(O)=O)C(=O)N[C@@H](CO)C(O)=O)NC(=O)[C@H](CC=1C=CC=CC=1)NC(=O)[C@H](CC(O)=O)NC(=O)CNC(=O)[C@H](CC(C)C)NC(=O)[C@@H](N)CC(C)C)C1=CC=CC=C1 POIUWJQBRNEFGX-XAMSXPGMSA-N 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 229910052925 anhydrite Inorganic materials 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- RICKKZXCGCSLIU-UHFFFAOYSA-N 2-[2-[carboxymethyl-[[3-hydroxy-5-(hydroxymethyl)-2-methylpyridin-4-yl]methyl]amino]ethyl-[[3-hydroxy-5-(hydroxymethyl)-2-methylpyridin-4-yl]methyl]amino]acetic acid Chemical compound CC1=NC=C(CO)C(CN(CCN(CC(O)=O)CC=2C(=C(C)N=CC=2CO)O)CC(O)=O)=C1O RICKKZXCGCSLIU-UHFFFAOYSA-N 0.000 description 1
- -1 BaO Chemical class 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 229910001512 metal fluoride Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052976 metal sulfide Inorganic materials 0.000 description 1
- 238000010943 off-gassing Methods 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/163—Connection portion, e.g. seal
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
A housing structure for a display device, such as an OLED, LCD or other luminescent display, comprising a sealing structure comprised of a first sealing layer 46I and a second sealing layer 46II which seals the transparent substrate 42 to the bonding rim of sealing cap 48. The display device has a laminate structure 44 comprising an anode layer 41, organic luminescent layer 43 and a cathode 45. The first sealing layer 46I and second sealing layer 46II may be mixed with moisture or oxygen absorbing materials and cured at an elevated temperature or using UV light. Furthermore a gaseous protective body 62, such as rubber, may be provided disposed between the first and second sealing layers. Alternatively a first rib structure 52I and second rib structure 52II may be disposed between the first and second sealing layers.
Description
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TITLE
HOUSING STRUCTURE WITH MULTIPLE SEALING LAYERS
BACKGROUND OF THE INVENTION
Field of the Invention
The present invention relates to a housing structure and a housing process for a display device and, more particularly, to a housing structure with multiple sealing layers for an organic EL element device.
Description of the Related Art
In an electro-luminescence (EL) element used for a display device, electric current applied to specific fluorescence or phosphorus can transform electricity into luminosity.
According to the different materials used in the luminescent layer, EL elements are classified as organic and inorganic, wherein the organic EL element device employs laminated organic layers and has the advantages of thin profile, light weight, high luminescent efficiency, and low driving voltage. However, since the active lifetime and reliability is highly concerned with the housing structure, it is importance to develop an improved housing process for the organic EL element device.
Presently, the organic EL element uses active metal of low work function to form a metallic cathode, thus the active lifetime of the organic EL element is highly concerned with moisture and oxygen present in the organic EL element. As the duration of use increases, the likelihood of moisture and oxygen permeating the organic EL element also increases,
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causing detachment between the organic luminescent layer and the cathode, cracking of the organic materials, and oxidation of the electrodes. As a result, a so-called'dark spot', to which electricity is not supplied, is generated, decreasing luminescence and luminescent uniformity. In order to prolong the active lifetime, various technologies of reducing the interior humidity, to solve the problem of the dark spot, have been developed, such as forming photo-hardened resin on the glass substrate, plating metal oxide, fluoride or sulfide on the glass substrate, forming a water-resistant film on the glass substrate, and using an airtight case to package the organic EL element. Nevertheless, other problems, such as leakage current, crosstalk and oxide dissolution, remain to be solved.
Fig. 1 is a sectional diagram showing a first housing structure for an organic EL element 10 according to the prior art. An organic EL element 10 comprises a glass substrate 12, a lamination body 14 formed by an anode layer 11, an organic luminescent material layer 13 and a cathode layer 15, and a sealing agent 16 covering the lamination body 14. In housing process, a sealing cap 18 is fixed over the glass substrate 12, and then the sealing cap 18 is pressed on the sealing agent 16 by a uniform pressure and the sealing agent 16 is cured by heating. However, the thermal curing must proceed in a specific atmosphere in which moisture and oxygen are severely controlled and requires a long heating time, therefore this housing process cannot satisfy the demands of mass production.
Fig. 2 is a sectional diagram showing a second housing
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structure for an organic EL element 20 according to the prior art. The second housing structure provides a sealing agent
24 on the rim of the glass substrate 12 to bond the sealing cap 18 and the glass substrate 12, resulting in an airtight space 22. The sealing agent 24 is UV-cured resin that can be cured by UV irradiation to reduce the housing process time.
Nevertheless, the UV-cured resin is epoxy resin containing a large amount of moisture and presenting outgassing, therefore the single-layered sealing agent 24 cannot provide good water/oxygen-resistance for the organic EL element 20.
Fig. 3A is a top view showing a metallic cap of a third housing structure for an organic EL element 30 according to the prior art, and Fig. 3B is a sectional diagram showing a third housing structure for an organic EL element 30 according to the prior art. The third housing structure provides a stamping-form metallic cap 32 which has a concavity facing the lamination body 14, a water-absorbentable layer 34 disposed in the cavity and an unidirectional penetrating film 36 covering the water-absorbentable layer 34. Preferably, the water-absorbentable layer 34 is of solid-state compounds, such as BaO, CaO, CaS04 andCaCIs for absorbing moisture and maintaining a solid state. Also, the moisture absorbed by the layer 34 can stay in the cavity without flowing from the unidirectional penetrating film 36. This housing structure could pass the strict circumstance test, but the metallic cap 32 without a planar surface decreases the efficacy of water/oxygen-resistance ability, and causes difficulties in manufacturing a larger-size organic EL element device. In addition, since the thickness of the metallic cap 32 is greater
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than that of the glass substrate 12, the organic EL device element 30 cannot achieve the aims of light weight, thin thickness, short measure and small size for planar display market.
SUMMARY OF THE INVENTION
The present invention provides a housing structure and a housing process to solve the problems found in the prior art.
A transparent substrate is provided with a completed luminescent device. The rim of the transparent substrate is bonded to the rim of a sealing cap to form an airtight space.
A sealing structure with a first sealing layer and a second sealing layer is provided on the bonding rim between the sealing cap and the transparent substrate. The materials used to form the first sealing layer and the second sealing layer are different.
Accordingly, it is a principal object of the invention to provide a housing structure to prolong active lifetime of display device.
It is another object of the invention to provide a housing structure to improve resistance to moisture and oxygen.
Yet another object of the invention is to provide a housing structure to improve adhesion.
These and other objects of the present invention will become readily apparent upon further review of the following specification and drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
Fig. 1 is a sectional diagram showing a first housing structure for an organic EL element according to the prior
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art.
Fig. 2 is a sectional diagram showing a second housing structure for an organic EL element according to the prior art.
Fig. 3A is a top view showing a metallic cap of a third housing structure for an organic EL element 30 according to the prior art.
Fig. 3B is a sectional diagram showing a third housing structure for an organic EL element according to the prior art.
Fig. 4A is a sectional diagram showing a first housing structure according to the first embodiment of the present invention.
Fig. 4B is a sectional diagram showing a second housing structure according to the first embodiment of the present invention.
Fig. 5A is a sectional diagram showing a first housing structure according to the second embodiment of the present invention.
Fig. 5B is a sectional diagram showing a second housing structure according to the second embodiment of the present invention.
Fig. 5C is a sectional diagram showing a third housing structure according to the second embodiment of the present invention.
Fig. 6A is a sectional diagram showing a first housing structure according to the third embodiment of the present invention.
Fig. 6B is a sectional diagram showing a second housing structure according to the third embodiment of the present
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invention.
Figs. 7A and 7B are sectional diagrams showing housing structures according to the fourth embodiment.
Similar reference characters denote corresponding features consistently throughout the attached drawings.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
The present invention provides a housing structure with multiple sealing layers for organic/inorganic EL element device, such as OLED, PLED, LCD, PDP, and other light diode.
In the housing structure, at least two sealing layers are selectively coated in the interior space or on the rim of the EL element, or seal the EL element. Also, the housing structure provides rib structures, gaseous protective layers, and water-resistant films to further prolong the active lifetime of the EL element device.
[First Embodiment
The first embodiment provides a housing structure with dual sealing layers of two different materials to achieve repulsion of water, resistance to water, great absorption of moisture/oxygen and high adhesive strength at the same time.
Compared with the single sealing layer in the prior art, the combined characteristics provided by the dual sealing layer ensure luminescent performance and active lifetime of the organic EL element device. In addition, according to process requirements, more than two sealing layers can be formed to enhance the resistance to moisture and oxygen.
Fig. 4A is a sectional diagram showing a first housing
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structure according to the first embodiment of the present invention. For an organic EL element 40A, on a transparent substrate 42 of glass, transparent plastic or polymer, an anode layer 41, an organic luminescent layer 43 and a cathode layer 45 form a lamination body 44. In housing process, a first sealing layer 461 and a second sealing layer 4611 are coated on the rim of a sealing cap 48 to serve as dual loops.
Preferably, the sealing cap 48 is of glass, metal or ceramic material. Then, the sealing cap 48 is fixed over the transparent substrate 42 and uniformly pressed on the sealing layers 461 and 4611. Finally, the first sealing layer 461 and the second sealing layer 4611 are respectively cured by appropriate curing treatments, thus the rim of the sealing cap 48 is bonded to the rim of the transparent substrate 42 to form an airtight space 49.
The first sealing layer 461 and the second sealing layer 4611 are formed by different materials, such as ceramic, polymer, metal or composite, in which water/oxygen-absorbable substances of solid, liquid or gaseous body can be selectively mixed to stop water/oxygen permeation and provide adequate adhesion. As well, depending on selected curing processes, the material used to form the first sealing layer 461 or the second sealing layer 4611 can be a room-temperature curing type, a heating curing type, a UV curing type or a visible-light curing type. Thus, during curing process, the curing source is selected from illuminant irradiation or thermal heating to reduce housing process time. For example, if the first sealing layer 461 is light-cured and the second sealing layer 4611 is heat-cured, an UV illuminant or other appropriate
<Desc/Clms Page number 8>
light source is first used to rapidly cure the first sealing layer 4611, and then a heating process is used in an ordinary-level clean circumstance to cure the second sealing layer 4611.
Fig. 4B is a sectional diagram showing a second housing structure according to the first embodiment of the present invention. For an organic EL element 40B, the first sealing layer 461 of large size is coated on the sealing cap 48 in position corresponding to the luminescent area, and the second sealing layer 4611 is coated on the rim of the sealing cap 48. Then, the above-described steps of orientation, uniform pressure, and curing treatment complete the housing process.
The material, curing type and curing process used for the first sealing layer 461 and the second sealing layer 4611 are the same as the forecited conditions.
Compared with the first housing structure shown in Fig.
4A, the second housing structure uses the first sealing layer 461 to wrap the luminescent area to increase the housing area between the sealing cap 48 and the transparent substrate 42, resulting in a greater mechanical strength of the organic EL element 40B. Also, the increased housing area provides a longer distance for moisture/oxygen permeation to further increase the active lifetime of the organic EL element 40B.
Furthermore, in another method of forming the first sealing layer 461, immersion, evaporation, chemical vapor deposition or sputtering is used to wrap the luminescent area on the transparent substrate 42. Then, the second sealing layer 4611 is coated on the rim of the transparent substrate 42 or the
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sealing cap 48. Thereafter, the above-described steps of orientation, uniform pressure, and curing treatment complete the housing process.
[Second Embodiment
The second embodiment provides the organic EL element 40B (shown in Fig. 4B) with a rib structure around the luminescent area to prevent moisture/oxygen permeation and decrease moisture/oxygen permeable area. Thus, combining the dense nature of the rib structure and the moisture/oxygen resistance of the dual sealing layers can further improve the active lifetime of the organic EL element device.
Fig. 5A is a sectional diagram showing a first housing structure according to the second embodiment of the present invention. For an organic EL element 50A, a rib structure with single loop or dual loops is formed on the rim of the sealing cap 48. Preferably, a rib structure with dual loops is shown as a first rib 521 and a second rib 5211 formed by glass, ceramic, metal, organic polymer or composite. Then, the first sealing layer 461 is coated on the sealing cap 48 in position corresponding to the luminescent area. Next, the second sealing layer 4611 is coated in a space between the first rib 521 and the second rib 5211. Thereafter, steps of orientation, uniform press and curing treatment are used to complete the housing process. The first rib 521 and the second rib 5211 provide a fixed space between the transparent substrate 42 and the sealing cap 48, thus the first sealing layer 461 and the second sealing layer 4611 are uniformly distributed within
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the fixed space to prevent local damage from curing process.
Fig. 5B is a sectional diagram showing a second housing structure according to the second embodiment of the present invention. Unlike the first housing structure, in an organic EL element 50B, the second sealing layer 4611 is coated outside the second rib 5211 and a water-absorbentable layer 54 is coated in the space between the first rib 521 and the second rib 5211. The water-absorbent layer 54 comprises BaO, CaO, CaS04'and CaC12 that form solid state, liquid state or a film for absorbing moisture. Since the water-absorbentable layer 54 has a high activation nature the same as moisture, the water-absorbentable layer 54 can chemically react with outer moisture to stop the outer moisture permeating the housing structure.
Fig. 5C is a sectional diagram showing a third housing structure according to the second embodiment of the present invention. Unlike the first housing structure, in an organic EL element 50C, a third rib 56 is formed on the rim of the transparent substrate 42 and disposed between the first rib 521 and the second rib 5211. Therefore, the second sealing layer 4611 is coated in a space between the first rib 521 and the third rib 56, and in a space between the second rib 5211 and the third rib 56.
[Third Embodiment
The third embodiment provides the organic EL element 40A (shown in Fig. 4A) with a gaseous protective layer to increase
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elasticity and strength which prevents the sealing layers from being squeezed caused by the appearance of increased pressure generated by pressurization or heating. This ensures the practicability of the sealing layers.
Fig. 6A is a sectional diagram showing a first housing structure according to the third embodiment of the present invention. Compared with the organic EL element 40A shown in Fig. 4A, in an organic EL element 60A of the third embodiment, the first sealing layer 461 is replaced by a gaseous protective layer 62 of rubber, silica gel or other elastic materials.
In housing process, the gaseous protective layer 62 is formed on the rim of the sealing cap 48, and then the second sealing layer 4611 is formed outside the gaseous protective layer 62 on the sealing cap 48. Thereafter, steps of orientation, uniform pressure and curing treatment are used to complete the housing process.
Fig. 6B is a sectional diagram showing a second housing structure according to the third embodiment of the present invention. Compared with the organic EL element 40A shown in Fig. 4A, in an organic EL element 60B of the third embodiment, the gaseous protective layer 62 is formed on the rim of the sealing cap 48, and then the first sealing layer 461 and the second sealing layer 4611 are sequentially formed outside the gaseous protective layer 62 on the sealing cap 48. Thereafter, steps of orientation, uniform press and curing treatment are used to complete the housing process.
[Fourth Embodiment
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The fourth embodiment provides a water-resistant film on the exterior surface of the completed housing structure described in the first, second and third embodiments. The water-resistant film has hydrophobic nature to decrease the moisture/oxygen permeation.
Figs. 7A and 7B are sectional diagrams showing housing structures according to the fourth embodiment. As shown in Fig. 7A, in an organic EL element 70A, a transparent water-resistant film 72 is formed using immersion, evaporation, chemical vapor deposition or sputtering to wrap the completed housing structure shown in Fig. 4A. As shown in Fig. 7B, in an organic EL element 70B, a transparent water-resistant film 72 is formed using immersion, evaporation, chemical vapor deposition or sputtering to wrap the completed housing structure shown in Fig. 4B.
It is to be understood that the present invention is not limited to the embodiments described above, but encompasses any and all embodiments within the scope of the following claims.
Claims (3)
1 13. The housing structure according to claim 12, wherein
2 the display device is an organic display device or inorganic
3 EL element device, liquid crystal display, plasma display
4 panel or other luminescent display.
1 15. The housing structure according to claim 12, wherein
2 the transparent substrate is glass, transparent plastic or
3 polymer.
1 16. The housing structure according to claim 12, wherein
<Desc/Clms Page number 16>
2 the sealing cap is glass, metal or ceramic.
1 17. The housing structure according to claim 12, wherein
2 the luminescent device is a lamination body comprising an
3 anode layer, an organic luminescent layer and a cathode layer.
1 18. The housing structure according to claim 12, wherein
2 the material used to form the first sealing layer is ceramic,
3 polymer, metal or composite, is mixed with substance for 4 absorbing moisture, oxygen and other gas, and is 5 room-temperature-cured, heat-cured, UV-cured, or 6 visible-light-cured.
1 19. The housing structure according to claim 12, wherein 2 the material used to form the second sealing layer is ceramic, 3 polymer, metal or composite, mixed with substance for 4 absorbing moisture, oxygen and other gas, and is 5 room-temperature-cured, heat-cured, UV-cured, or 6 visible-light-cured.
1 20. The housing structure according to claim 12, further 2 comprising a transparent water-resistant film coated on the 3 exterior surface of the housing structure.
1 21. The housing structure according to claim 12, further 2 comprising: 3 a first rib formed between the first sealing layer and the 4 second sealing layer; 5 a second rib surrounding the second sealing layer and 6 disposed on the bonding rim between the sealing cap and the
<Desc/Clms Page number 17>
7 transparent substrate.
1 22. The housing structure according to claim 21, wherein 2 the first rib and the second rib are glass, ceramic, metal, 3 organic polymer or composite.
1 23. The housing structure according to claim 12, further 2 comprising: 3 a first rib formed between the first sealing layer and the 4 second sealing layer; 5 a second rib formed between the first rib and the second 6 sealing layer; and 7 a water absorbing layer formed between the first rib and 8 the second rib.
1 24. The housing structure according to claim 23, wherein 2 the first rib and the second rib are glass, ceramic, metal, 3 organic polymer or composite.
1 25. The housing structure according to claim 23, wherein 2 the water absorbing layer is solid, liquid or gas.
1 26. The housing structure according to claim 12, further 2 comprising: 3 a first rib formed between the first sealing layer and the 4 second sealing layer; 5 a second rib surrounding the second sealing layer; and 6 a third rib formed between the first rib and the second 7 rib, wherein the second sealing layer fills the space between 8 the first rib and the third rib and the space between the second
<Desc/Clms Page number 18>
9 rib and the third rib.
1 27. The housing structure according to claim 26, wherein 2 the first rib, the second rib and the third rib are glass, 3 ceramic, metal, organic polymer or composite.
1 28. The housing structure according to claim 26, wherein 2 the first rib and the second rib are formed on the sealing 3 cap, and the third rib is formed on the transparent substrate.
1 29. A housing structure, substantially as
o 2 hereinbefore described with reference to or as shown 3 in, Figures 4A, 4B, 5A-C, 6A, 6B, 7A and 7B of the 4'd' accompanying drawings.
3 display device.
1 14. The housing structure according to claim 12, wherein
2 the display device is an organic EL element device, polymer
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW090133032A TW526608B (en) | 2001-01-24 | 2001-12-28 | Integrated circuits protected against reverse engineering and method for fabricating the same using an apparent metal contact line terminating on field oxide |
Publications (4)
| Publication Number | Publication Date |
|---|---|
| GB0212730D0 GB0212730D0 (en) | 2002-07-10 |
| GB2383683A true GB2383683A (en) | 2003-07-02 |
| GB2383683A8 GB2383683A8 (en) | 2003-07-22 |
| GB2383683B GB2383683B (en) | 2004-04-07 |
Family
ID=21680101
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB0212730A Expired - Fee Related GB2383683B (en) | 2001-12-28 | 2002-05-31 | Housing structure with multiple sealing layers |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB2383683B (en) |
Cited By (8)
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| WO2004021464A1 (en) * | 2002-08-23 | 2004-03-11 | Siemens Aktiengesellschaft | Organic light emitting diode (oled) and/or display, method for the sealing and use thereof |
| CN1324361C (en) * | 2003-10-29 | 2007-07-04 | 铼宝科技股份有限公司 | Double-faced display device |
| CN101422078B (en) * | 2006-04-12 | 2011-01-26 | Lg化学株式会社 | Organic light emitting diode unit and method for manufacturing the same |
| EP2009715A3 (en) * | 2007-06-28 | 2011-03-09 | Samsung Mobile Display Co., Ltd. | Light emitting display and method of manufacturing the same |
| US8258696B2 (en) | 2007-06-28 | 2012-09-04 | Samsung Mobile Display Co., Ltd. | Light emitting display and method of manufacturing the same |
| US8288861B2 (en) | 2004-04-22 | 2012-10-16 | Osram Opto Semiconductors Gmbh | Encapsulation for an organic electronic component, its production process and its use |
| US8330339B2 (en) | 2007-06-28 | 2012-12-11 | Samsung Display Co., Ltd. | Light emitting display and method of manufacturing the same |
| EP3664176A4 (en) * | 2017-08-01 | 2021-05-12 | BOE Technology Group Co., Ltd. | Screen printing plate, packaging method, display panel and display device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104900681B (en) | 2015-06-09 | 2019-02-05 | 上海天马有机发光显示技术有限公司 | Organic light emitting display panel and forming method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004021464A1 (en) * | 2002-08-23 | 2004-03-11 | Siemens Aktiengesellschaft | Organic light emitting diode (oled) and/or display, method for the sealing and use thereof |
| CN1324361C (en) * | 2003-10-29 | 2007-07-04 | 铼宝科技股份有限公司 | Double-faced display device |
| US8288861B2 (en) | 2004-04-22 | 2012-10-16 | Osram Opto Semiconductors Gmbh | Encapsulation for an organic electronic component, its production process and its use |
| DE112005000839B4 (en) * | 2004-04-22 | 2019-01-17 | Osram Oled Gmbh | Encapsulation for an organic electronic component and use |
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| EP2009715A3 (en) * | 2007-06-28 | 2011-03-09 | Samsung Mobile Display Co., Ltd. | Light emitting display and method of manufacturing the same |
| US8258696B2 (en) | 2007-06-28 | 2012-09-04 | Samsung Mobile Display Co., Ltd. | Light emitting display and method of manufacturing the same |
| US8330339B2 (en) | 2007-06-28 | 2012-12-11 | Samsung Display Co., Ltd. | Light emitting display and method of manufacturing the same |
| US8721381B2 (en) | 2007-06-28 | 2014-05-13 | Samsung Display Co., Ltd. | Light emitting display and method of manufacturing the same |
| US8784150B2 (en) | 2007-06-28 | 2014-07-22 | Samsung Display Co., Ltd. | Light emitting display and method of manufacturing the same |
| EP3664176A4 (en) * | 2017-08-01 | 2021-05-12 | BOE Technology Group Co., Ltd. | Screen printing plate, packaging method, display panel and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| GB0212730D0 (en) | 2002-07-10 |
| GB2383683B (en) | 2004-04-07 |
| GB2383683A8 (en) | 2003-07-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 732E | Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977) | ||
| PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20100531 |