GB0212730D0 - Housing structure with multiple sealing layers - Google Patents
Housing structure with multiple sealing layersInfo
- Publication number
- GB0212730D0 GB0212730D0 GBGB0212730.6A GB0212730A GB0212730D0 GB 0212730 D0 GB0212730 D0 GB 0212730D0 GB 0212730 A GB0212730 A GB 0212730A GB 0212730 D0 GB0212730 D0 GB 0212730D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- housing structure
- sealing layers
- multiple sealing
- layers
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007789 sealing Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/163—Connection portion, e.g. seal
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW090133032A TW526608B (en) | 2001-01-24 | 2001-12-28 | Integrated circuits protected against reverse engineering and method for fabricating the same using an apparent metal contact line terminating on field oxide |
Publications (4)
Publication Number | Publication Date |
---|---|
GB0212730D0 true GB0212730D0 (en) | 2002-07-10 |
GB2383683A GB2383683A (en) | 2003-07-02 |
GB2383683A8 GB2383683A8 (en) | 2003-07-22 |
GB2383683B GB2383683B (en) | 2004-04-07 |
Family
ID=21680101
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0212730A Expired - Fee Related GB2383683B (en) | 2001-12-28 | 2002-05-31 | Housing structure with multiple sealing layers |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2383683B (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10238799A1 (en) * | 2002-08-23 | 2004-03-11 | Siemens Ag | Organic light emitting diode (OLED) and / or display, sealing process and use thereof |
CN1324361C (en) * | 2003-10-29 | 2007-07-04 | 铼宝科技股份有限公司 | Double-faced display device |
KR20070015590A (en) * | 2004-04-22 | 2007-02-05 | 오스람 옵토 세미컨덕터스 게엠베하 | Encapsulation for an organic electronic component, its production process and its use |
JP4990967B2 (en) | 2006-04-12 | 2012-08-01 | エルジー・ケム・リミテッド | Organic light emitting device unit and method for manufacturing the same |
US8330339B2 (en) | 2007-06-28 | 2012-12-11 | Samsung Display Co., Ltd. | Light emitting display and method of manufacturing the same |
KR100879864B1 (en) * | 2007-06-28 | 2009-01-22 | 삼성모바일디스플레이주식회사 | Light emitting display device and method of manufacturing the same |
US8258696B2 (en) | 2007-06-28 | 2012-09-04 | Samsung Mobile Display Co., Ltd. | Light emitting display and method of manufacturing the same |
CN104900681B (en) | 2015-06-09 | 2019-02-05 | 上海天马有机发光显示技术有限公司 | Organic light emitting display panel and forming method thereof |
CN107507923B (en) * | 2017-08-01 | 2019-12-03 | 京东方科技集团股份有限公司 | A kind of screen mesh printing plate, packaging method, display panel and display device |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5652067A (en) * | 1992-09-10 | 1997-07-29 | Toppan Printing Co., Ltd. | Organic electroluminescent device |
US5874804A (en) * | 1997-03-03 | 1999-02-23 | Motorola, Inc. | Organic electroluminescent device hermetic encapsulation package and method of fabrication |
JP3290375B2 (en) * | 1997-05-12 | 2002-06-10 | 松下電器産業株式会社 | Organic electroluminescent device |
WO1999035681A1 (en) * | 1998-01-07 | 1999-07-15 | Fed Corporation | Assembly for and method of packaging integrated display devices |
JP2000208252A (en) * | 1999-01-14 | 2000-07-28 | Tdk Corp | Organic electroluminescent element |
JP2001338755A (en) * | 2000-03-21 | 2001-12-07 | Seiko Epson Corp | Organic el element and its manufacturing method |
-
2002
- 2002-05-31 GB GB0212730A patent/GB2383683B/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
GB2383683A8 (en) | 2003-07-22 |
GB2383683A (en) | 2003-07-02 |
GB2383683B (en) | 2004-04-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
732E | Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977) | ||
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20100531 |