JP5862155B2 - 振動デバイス及び電子機器 - Google Patents
振動デバイス及び電子機器 Download PDFInfo
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- JP5862155B2 JP5862155B2 JP2011208665A JP2011208665A JP5862155B2 JP 5862155 B2 JP5862155 B2 JP 5862155B2 JP 2011208665 A JP2011208665 A JP 2011208665A JP 2011208665 A JP2011208665 A JP 2011208665A JP 5862155 B2 JP5862155 B2 JP 5862155B2
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- electrode
- thermistor
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- lid
- vibration device
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- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 230000010355 oscillation Effects 0.000 claims description 9
- 238000003860 storage Methods 0.000 claims description 9
- 239000013078 crystal Substances 0.000 description 68
- 230000004048 modification Effects 0.000 description 13
- 238000012986 modification Methods 0.000 description 13
- 239000010453 quartz Substances 0.000 description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 13
- 230000005284 excitation Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 238000005304 joining Methods 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
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- 230000007423 decrease Effects 0.000 description 4
- 238000000605 extraction Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000001413 cellular effect Effects 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910013641 LiNbO 3 Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- PSHMSSXLYVAENJ-UHFFFAOYSA-N dilithium;[oxido(oxoboranyloxy)boranyl]oxy-oxoboranyloxyborinate Chemical compound [Li+].[Li+].O=BOB([O-])OB([O-])OB=O PSHMSSXLYVAENJ-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
Images
Landscapes
- Oscillators With Electromechanical Resonators (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011208665A JP5862155B2 (ja) | 2011-09-26 | 2011-09-26 | 振動デバイス及び電子機器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011208665A JP5862155B2 (ja) | 2011-09-26 | 2011-09-26 | 振動デバイス及び電子機器 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015183802A Division JP6137255B2 (ja) | 2015-09-17 | 2015-09-17 | 振動デバイス及び電子機器 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013070312A JP2013070312A (ja) | 2013-04-18 |
| JP2013070312A5 JP2013070312A5 (enrdf_load_stackoverflow) | 2014-10-16 |
| JP5862155B2 true JP5862155B2 (ja) | 2016-02-16 |
Family
ID=48475473
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011208665A Active JP5862155B2 (ja) | 2011-09-26 | 2011-09-26 | 振動デバイス及び電子機器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5862155B2 (enrdf_load_stackoverflow) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6618675B2 (ja) | 2014-07-30 | 2019-12-11 | セイコーエプソン株式会社 | 振動デバイス、電子機器及び移動体 |
| JP6565671B2 (ja) * | 2015-03-11 | 2019-08-28 | 株式会社大真空 | 圧電デバイス |
| CN105977373B (zh) * | 2015-03-11 | 2020-06-05 | 株式会社大真空 | 压电器件 |
| WO2017077756A1 (ja) * | 2015-11-05 | 2017-05-11 | 株式会社村田製作所 | 圧電発振器及び圧電発振デバイス |
| CN107621896B (zh) * | 2016-07-15 | 2020-10-16 | 宏碁股份有限公司 | 触控装置 |
| US11637544B2 (en) * | 2016-11-24 | 2023-04-25 | Daishinku Corporation | Piezoelectric resonator device and system-in-package module including the same |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3285847B2 (ja) * | 1998-08-31 | 2002-05-27 | 京セラ株式会社 | 表面実装型水晶発振器 |
| JP2002100931A (ja) * | 2000-09-22 | 2002-04-05 | Kyocera Corp | 圧電発振器及びその製造方法 |
| JP2002271142A (ja) * | 2001-03-13 | 2002-09-20 | Nippon Dempa Kogyo Co Ltd | 表面実装型の水晶発振器及びその製造方法 |
| JP2004120481A (ja) * | 2002-09-27 | 2004-04-15 | Toyo Commun Equip Co Ltd | 圧電デバイスとそのパッケージ構造 |
| JP2005217782A (ja) * | 2004-01-29 | 2005-08-11 | Kyocera Corp | 圧電発振器 |
| JP2007043338A (ja) * | 2005-08-01 | 2007-02-15 | Epson Toyocom Corp | 温度補償水晶振動子、水晶発振器、及び温度補償水晶振動子の製造方法 |
| JP2008085742A (ja) * | 2006-09-28 | 2008-04-10 | Nippon Dempa Kogyo Co Ltd | 水晶発振器およびその製造方法 |
| JP5339681B2 (ja) * | 2007-02-21 | 2013-11-13 | 日本電波工業株式会社 | 表面実装用の水晶振動子 |
-
2011
- 2011-09-26 JP JP2011208665A patent/JP5862155B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013070312A (ja) | 2013-04-18 |
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