JP5842068B2 - ボンディングワイヤ及びその製造方法 - Google Patents
ボンディングワイヤ及びその製造方法 Download PDFInfo
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- JP5842068B2 JP5842068B2 JP2015017274A JP2015017274A JP5842068B2 JP 5842068 B2 JP5842068 B2 JP 5842068B2 JP 2015017274 A JP2015017274 A JP 2015017274A JP 2015017274 A JP2015017274 A JP 2015017274A JP 5842068 B2 JP5842068 B2 JP 5842068B2
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- core material
- bonding wire
- discoloration
- outer peripheral
- peripheral surface
- Prior art date
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Description
本発明における変色防止層は、光を吸収することがほとんどなく、Agを含有する芯材の光反射率を低下させることがない。
ここで、Ca、Y、Sm、La、Ce、Be、B及びGeの中では、極微量の添加でワイヤの耐熱性・強度向上に効果がある点でYが好ましく、また、添加元素とAgが化合物を作ることによってマトリックスであるAg中に化合物が分散しワイヤの高強度化に寄与する点でLa、Ceも好ましい。しかし、入手の容易さの点でCa、Be、B及びGeの添加が好ましく、使い勝手や効果の観点からCaの添加が最も好ましい。
さらに、高強度化が必要な場合、Ca、Y、Sm、La、Ce、Be、B及びGeの添加に加えて、Cu、Niの添加が効果的である。Cu、Niは、Ca、Y、Sm、La、Ce、Be、B及びGeと反応せずにマトリックスのAgと容易に合金化するため、Ca、Y、Sm、La、Ce、Be、B及びGeの添加効果を損なうことなく、マトリックスの高強度化に寄与する。なお、高強度化が必要な場合、上記のようにCa、Y、Sm、La、Ce、Be、B及びGeと併せてCuやNiを添加してもよいが、Ca、Y、Sm、La、Ce、Be、B及びGeに換えてCuやNiを添加してもワイヤの強度を向上させることができる。
まず、純度99.9質量%以上のAgにAu及びPdを合計量で1.0〜10.0質量%添加し、更に必要に応じて、Ca、Y、Sm、La、Ce、Be、B及びGeを合計量で5〜500質量ppm添加し、Cu及びNiを合計量で100〜10000質量ppm添加したAg合金を鋳造した後、連続鋳造法にて所定の径の棒状インゴットを作製する。
このようにして芯材12の外周面に変色防止層14を備えたボンディングワイヤ10が製造され、製造されたボンディングワイヤ10は、スプール20に巻き取られる。
比較例4は、伸線加工した芯材に対して調質熱処理の前に実施例1〜20と同一の水溶液を塗布した後、調質熱処理を行った。
比較例5は、伸線加工した芯材に対して調質熱処理を行った後、芯材の外周面に変色防止層を設けていない。
密閉した18リットル容器中に0.05%硫酸アンモニウム水溶液100mlと100mmのボンディングワイヤを挿入し、硫化水素ガス中で30分間暴露試験した。
ボンディング装置でボンディングワイヤの直径の2倍の直径のFABを作製し、側面からFABのビッカース硬さを測定した。ビッカース硬度計の荷重を2gf、加圧時間を10秒間とした。ビッカース硬さが4N(99.99%)Auワイヤ(HV44)の1.5倍(HV66)までは1st接合時のチップクラックやパッドめくれなどの不具合がでないと考えて「A」、1.5倍を超えれば用途が限定されるため「C」とした。
ボンディング装置でボンディングワイヤの直径の2倍の直径を有するFABをそれぞれ100個ずつ作製し、FABのワイヤ平行方向と垂直方向の直径を測定した。平行方向と垂直方向の直径の差がすべて線径の±10%以下であれば真球に近いと考えて「A」、線径の±10%以下が90個以上で線径の±10%を超えて±20%以下が1個以上10個以下であればほぼ問題がないと考えて「B」、±20%を超えるものが一つでもあれば、真球度が低いので用途が限定されるため、「C」とした。
4端子法を用いて室温での電気抵抗を測定し、各ワイヤの固有抵抗を求めた。固有抵抗が3.0μΩ・cm以下であれば、金ボンディングワイヤの固有抵抗と同等以下となるため、ワイヤに流れる信号の伝達速度を落とさず、半導体パッケージの性能を落とさないため、置き換えが容易であると考えて「A」、3.0μΩ・cmを超え、5.0μΩ・cm以下であれば、金ボンディングワイヤからの置き換えに実用上問題がないため「B」、5.0μΩ・cmを超えれば金ボンディングワイヤからの置き換えには不適であるため「D」とした。
ワイヤ長:2mmでボンディングした試料を市販のエポキシ樹脂で封止した後、X線非破壊観察装置で最大ワイヤフロー量の測定を行った。最大ワイヤフロー量をワイヤ長2mmで除した割合が2%未満なら「A」、2%以上では使用上の問題があると考えて評価を「D」とした。
12…芯材
14…変色防止層
20…スプール
22…水溶液槽
Claims (8)
- Agを75質量%以上含有する芯材、および、
前記芯材の外周面上に形成され、少なくとも1種の変色防止剤と少なくとも1種の界面活性剤とを含有する変色防止層、を有し、
前記変色防止剤が、少なくとも1個のチオール基を有する、炭素数8〜18の脂肪族有機化合物である、ボンディングワイヤ。 - 前記界面活性剤が非イオン界面活性剤及び陽イオン界面活性剤からなる群から選択された1種又は2種である、請求項1に記載のボンディングワイヤ。
- 前記芯材が、Au及びPdのうちの少なくとも一方を含有する、請求項1又は2に記載のボンディングワイヤ。
- 前記芯材が、Ca、Y、Sm、La、Ce、Be、B及びGeからなる群から選択された1種又は2種以上の元素を含有する、請求項3に記載のボンディングワイヤ。
- 前記芯材が、Cu及びNiのうちの少なくとも一方を含有する、請求項3又は4に記載のボンディングワイヤ。
- Agを75質量%以上含有する伸線加工された芯材に対して少なくとも1回熱処理を行うこと、および、
全ての熱処理の終了後に、少なくとも1種の変色防止剤を含有する水溶液を前記芯材の外周面に塗布することにより、前記芯材の外周面上に変色防止層を形成することを含み、
前記変色防止剤は、少なくとも1個のチオール基を有する、炭素数8〜18の脂肪族有機化合物であり、かつ、
前記水溶液は、さらに、少なくとも1種の界面活性剤を含有する、ボンディングワイヤの製造方法。 - 前記全ての熱処理の終了後の前記芯材をスプールに巻き取る前に、前記水溶液を前記芯材の外周面に塗布する、請求項6に記載のボンディングワイヤの製造方法。
- 前記全ての熱処理の終了後、かつ、前記水溶液を前記芯材の外周面に塗布する前に、前記芯材を洗浄することを含む請求項6に記載のボンディングワイヤの製造方法。
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JP6969869B2 (ja) * | 2016-12-19 | 2021-11-24 | 株式会社大和化成研究所 | 気化性変色防止剤 |
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