JP5836879B2 - Inverter device - Google Patents

Description

  The present invention relates to an inverter device provided with an inverter circuit, and more particularly to an in-vehicle inverter device mounted on an electric vehicle and a hybrid vehicle.

  In an electric vehicle or a hybrid vehicle, a motor is mounted as a power source of the vehicle, and an inverter device is generally provided to control electric power supplied to the motor. The inverter device supplies a power module including a power semiconductor element such as an IGBT, a drive circuit that drives the power module, a control circuit that controls them, a DC bus bar that is a wiring of power supplied from the battery, and a motor. An AC bus bar as power wiring and a current smoothing capacitor are provided.

  By the way, the power semiconductor element generates a large amount of heat, and generally, a cooling device is provided so that the element temperature is kept below the operation guarantee temperature (for example, see Patent Document 1). In the invention described in Patent Document 1, a power component provided with a power semiconductor element is mounted on a cooling device through which a refrigerant flows, and a positive bus bar and a negative bus bar are individually embedded in a block portion made of an insulating resin. Yes. By doing so, the semiconductor element, the positive electrode bus bar, and the negative electrode bus bar are cooled.

JP 2011-18847 A

  However, in the conventional inverter device described above, the power components are mounted in a planar manner, and the positive electrode bus bar and the negative electrode bus bar are individually provided in different regions of the block portion. there were.

  An inverter device according to a first aspect of the present invention includes a first power module provided with a semiconductor element constituting a first phase of an inverter circuit that converts DC power into three-phase AC power, and a second power source of the inverter circuit. A second power module provided with a semiconductor element constituting the phase, a third power module provided with a semiconductor element constituting the third phase of the inverter circuit, and the first, second and third powers AC current of each phase is connected to each of a plate-like stacked DC bus bar in which a positive electrode bus bar and a negative electrode bus bar for supplying DC current to the module are stacked, and the first, second and third power modules. First, second and third AC bus bars, first, second and third power modules, stacked DC bus bars, first, second and third AC bus bars. And a first cooling block that cools the first power module by forming a coolant channel, a second cooling block that cools the second power module by forming a coolant channel, and a coolant channel is formed And a cooling housing having a third cooling block for cooling the third power module, wherein the second cooling block and the third cooling block are juxtaposed in the cooling housing, and the first cooling block is juxtaposed. The stacked DC bus bar is disposed with a gap with respect to the second and third cooling blocks, and one surface of the DC bus bar is in thermal contact with the first cooling block and the other surface is the second. And it is arrange | positioned in the clearance gap so that it may contact a 3rd cooling block thermally.

  According to the present invention, the DC bus bar is effectively cooled, and the inverter device can be downsized.

It is a figure which shows the control block of the electric vehicle by which the inverter apparatus of this Embodiment is mounted. FIG. 3 is a diagram showing an electric circuit configuration of an inverter circuit 42. It is the external appearance perspective view which looked at the inverter apparatus 40 from the front side. It is the external appearance perspective view which looked at the inverter apparatus 40 from the back side. It is the figure which removed the lid | cover 117 from the inverter apparatus 40 shown in FIG. It is a figure which shows the state which removed the control board 120 in FIG. It is a disassembled perspective view of the structure shown in FIG. It is AA sectional drawing of FIG. It is BB sectional drawing of FIG. 2 is an external perspective view of a power module 500. FIG. It is a perspective view which shows the direct current | flow bus bar 900 with which the capacitor | condenser 90 was mounted. It is a figure which shows an electromechanical integrated rotary electric machine. It is a perspective view of the inverter apparatus 40 in 2nd Embodiment. It is a figure which shows arrangement | positioning of the control board 120 in 2nd Embodiment. It is a figure which shows the case of the single-sided cooling type power modules 600a-600c with which the cooling blocks 110a and 110b of the housing body 110 were mounted | worn. It is a figure which shows the other example of the power module 600a-600c of a single-sided cooling type. It is sectional drawing of the inverter apparatus provided with three cooling blocks 110a, 110g, and 110h.

Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.
-First embodiment-
FIG. 1 is a diagram showing a control block of an electric vehicle (hereinafter referred to as “EV”) on which the inverter device of the present embodiment is mounted. The motor generator 20 not only generates a running torque for the vehicle, but also has a function of converting mechanical energy applied from the outside to the motor generator 20 into electric power. The motor generator 20 is, for example, a permanent magnet synchronous motor, and operates as a motor or a generator depending on the operation method.

  The rotational torque generated by the motor generator 20 is transmitted to the wheels 12 via the transmission 18 and the differential gear 16. On the other hand, at the time of regenerative braking operation, rotational torque is transmitted from the wheels 12 to the motor generator 20, and AC power corresponding to the supplied rotational torque is generated. The generated AC power is converted into DC power by the inverter device 40, charges the high-voltage battery 30, and the charged power is used again as travel energy.

  The inverter device 40 is electrically connected to the battery 30 via the DC cable 32, and power is exchanged between the battery 30 and the inverter circuit 42. When the motor generator 20 is operated as a motor, the inverter device 40 generates AC power based on the DC power supplied from the battery 30 via the DC cable 32 and supplies the AC power to the motor generator 20 via the AC cable 34. .

  Next, the configuration of the electric circuit of the inverter circuit 42 will be described with reference to FIG. In the following description, an insulated gate bipolar transistor is used as a semiconductor element, and hereinafter abbreviated as IGBT. An IGBT 52 and a diode 56 that operate as an upper arm, and an IGBT 62 and a diode 66 that operate as a lower arm constitute a series circuit 50 of upper and lower arms. The inverter circuit 42 includes the series circuit 50 corresponding to three phases of the U phase, the V phase, and the W phase of the AC power to be output.

  These three phases correspond to the three-phase windings of the armature winding of the motor generator 20 in this embodiment. The three-phase series circuit 50 of the upper and lower arms outputs an alternating current from the intermediate electrode 69 of the series circuit. The intermediate electrode 69 is connected to an AC bus bar 86 via an AC terminal 59 and further electrically connected to each phase winding of the motor generator 20 via an AC connector 88.

  The collector electrode of the IGBT 52 of the upper arm is electrically connected to the positive electrode conductor plate 92 via the positive electrode terminal 57, and the emitter electrode of the IGBT 62 of the lower arm is electrically connected to the negative electrode conductor plate 94 via the negative electrode terminal 58. . The positive electrode conductor plate 92 and the negative electrode conductor plate 94 are electrically connected to the capacitor 90, and are further electrically connected to the battery 30 via the DC connector 38. The control circuit 72 receives a control command from a host control device (not shown), and generates a control pulse for controlling the IGBTs 52 and 62 of the upper and lower arms constituting each series circuit 50 of the inverter circuit 42 based on the control command. , And supplies it to the driver circuit 74 as a control signal.

  The driver circuit 74 supplies a drive pulse for controlling the IGBTs 52 and 62 of each phase to the IGBT 52 via the signal emitter terminal 55 and the gate terminal 54 based on the control pulse, and the signal emitter terminal 65 and the gate. It is supplied to the IGBT 62 through the terminal 64. The IGBTs 52 and 62 of each phase perform conduction or cutoff operation based on the drive pulse from the driver circuit 74, convert the DC power supplied from the battery 30 into three-phase AC power, and supply it to the motor generator 20.

  The control circuit 72 includes a microcomputer (hereinafter referred to as “microcomputer”) for performing arithmetic processing on the switching timing of the IGBTs 52 and 62. Information input to the microcomputer includes a target torque value required for the motor generator 20, a current value supplied from the series circuit 50 to the motor generator 20, and a magnetic pole position of the rotor of the motor generator 20. The target torque value is based on a command signal output from a host controller (not shown). The current value is detected based on a detection signal from the current sensor 80. The magnetic pole position is detected based on a detection signal output from a rotating magnetic pole sensor (not shown) such as a resolver provided in the motor generator 20.

  The microcomputer in the control circuit 72 calculates current command values for the d-axis and q-axis of the motor generator 20 based on the target torque value, and the calculated d-axis and q-axis current command values and the detected d-axis. The voltage command values for the d-axis and the q-axis are calculated based on the difference between the current values of the axes and the q-axis, and the calculated voltage command values for the d-axis and the q-axis are calculated based on the detected magnetic pole position. Convert to phase, V-phase, and W-phase voltage command values. Then, the microcomputer generates a pulse-like modulated wave based on a comparison between the fundamental wave (sine wave) and the carrier wave (triangular wave) based on the voltage command values of the U phase, V phase, and W phase, and the generated modulation wave The wave is output to the driver circuit 74 as a PWM (pulse width modulation) signal.

  When driving the lower arm, the driver circuit 74 outputs a drive signal obtained by amplifying the PWM signal to the gate electrode of the corresponding IGBT 62 of the lower arm. Further, when driving the upper arm, the driver circuit 74 amplifies the PWM signal after shifting the level of the reference potential of the PWM signal to the level of the reference potential of the upper arm, and uses this as a drive signal as a corresponding upper arm. Are output to the gate electrodes of the IGBTs 52 respectively.

Next, the configuration of the inverter device 40 will be described with reference to FIGS. 3 and 4 are external perspective views of the inverter device 40. FIG. FIG. 5 is a diagram in which the lid 117 is removed from the inverter device 40 shown in FIG. 3. FIG. 6 is a diagram showing a state in which the control board 120 is removed from FIG. FIG. 7 is an exploded perspective view of FIG. 8 is a cross-sectional view taken along line AA in FIG.
9 is a cross-sectional view taken along line BB in FIG. FIG. 10 is an external perspective view of the power module 500. FIG. 11 is a perspective view showing a DC bus bar 900 on which a capacitor 90 is mounted.

  FIG. 3 is an external perspective view of the inverter device 40 viewed from the front side. On the other hand, FIG. 4 is an external perspective view of the inverter device 40 viewed from the back side. Electronic components constituting the inverter device 40 are accommodated in a casing formed by the casing main body 110 and the lid 117. The casing main body 110 is formed with a refrigerant flow path 114 to be described later. As shown in FIG. 4, a refrigerant inlet 112 for taking in the refrigerant into the refrigerant flow path 114 and a refrigerant outlet for discharging the refrigerant. 113 is provided. A DC connector 38 is provided on the back side of the housing body 110.

  On the other hand, an AC connector 88 is provided on the front side of the lid 117, and a signal connector 76 is provided on the upper surface side of the lid 117. The signal connector 76 is provided for exchanging signals between the above-described control circuit 72 and the host control device, and is connected to a control board 120 described later.

  As shown in FIG. 5, power bus modules 900 b and 500 c, a DC bus bar 900 on which a capacitor 90 is mounted, a power module 500 a, and a control board 120 are disposed in the housing body 110 in order from the bottom of the housing. AC bus bars 86a to 86c are arranged on the front side of the housing with respect to the power modules 500a to 500c.

  FIG. 10 is an external perspective view of the power module 500. Note that the power modules 500a to 500c have the same structure, and are denoted by reference numeral 500 in FIG. The power modules 500a to 500c include power semiconductor elements (IGBT52, IGBT62, diode 56, diode 66) constituting the series circuit 50 of the upper and lower arms shown in FIG. 1 in a metallic module case 501 having heat radiation portions 502a and 502b. Is sealed. The power module 500a incorporates a series circuit 50 of U-phase upper and lower arms, the power module 500b incorporates a series circuit 50 of V-phase upper and lower arms, and the power module 500c includes a series circuit 50 of W-phase upper and lower arms. Is built-in.

  An opening is formed in the flange portion 501a of the module case 501, and the positive terminal 57, the negative terminal 58, the AC terminal 59, and the control signal connection terminal 70 protrude outside from the opening. The control signal connection terminal 70 is connected to the upper arm gate terminal 54, the upper arm emitter terminal 55, the lower arm gate terminal 64, and the lower arm emitter terminal 65 shown in FIG.

  As shown in FIGS. 7 to 9, the housing body 110 is integrally formed with cooling blocks 110 a and 110 b in which a coolant channel 114 is formed. The cooling blocks 110a and 110b are arranged side by side with an interval in the vertical direction. One opening is formed in the coolant channel 114 of the upper cooling block 110a, and the power module 500a is attached to the opening. On the other hand, in the cooling block 110b provided on the lower side, two openings of the refrigerant flow path 114 are formed in the horizontal direction in the figure. The power module 500b is attached to the left opening, and the power module 500c is attached to the right opening.

  When the power modules 500a to 500c are inserted into the refrigerant flow paths 114 of the cooling blocks 110a and 110b, the power modules 500b and 500c are arranged such that the AC terminal 59 is located at the center of the cooling block 110b in FIGS. Inserted. By doing so, the AC terminals 59 are arranged close to each other, and the AC bus bars 86a to 86c connected to them can be arranged in one place.

  In addition, in the example shown in FIG. 9, it was set as the structure which arrange | positions two refrigerant | coolant flow paths 114 in the illustration left-right direction in one cooling block 110b. However, as shown in FIG. 17, the cooling block 110b may be divided into two cooling blocks 110g and 110h in which the refrigerant flow path 114 is formed.

  When the flange portions 501a of the power modules 500a to 500c are fixed to the openings of the cooling blocks 110a and 110b, the portions of the module case 501 where the heat radiating portions 502a and 502b are provided are located in the refrigerant flow path 114 as shown in FIG. And the opening of the coolant channel 114 is sealed by the flange portion 501a. Although not shown, the flange portion 501a is fixed to the cooling blocks 110a and 110b with bolts or the like.

  As shown in FIG. 4, the refrigerant that has flowed in from the refrigerant inlet 112 flows through the refrigerant flow path 114 as indicated by an arrow, and is discharged from the refrigerant outlet 113. That is, the refrigerant flowing in from the refrigerant inlet 112 flows into the refrigerant flow path 114 in which the power module 500b of the cooling block 110b is accommodated via the water channel connecting portion 115a. Thereafter, the refrigerant flows into the refrigerant flow path 114 in which the power module 500a of the cooling block 110a is accommodated via the water channel connecting portion 115b. Thereafter, the refrigerant flows into the refrigerant flow path 114 in which the power module 500c of the cooling block 110b is accommodated via the water channel connecting portion 115c. And the refrigerant | coolant is discharged | emitted from the refrigerant | coolant outflow port 113 through the water channel connection part 115c.

  The heat generated in the power semiconductor element is dissipated mainly from the heat radiation surfaces 502 a and 502 b of the power module 500 to the refrigerant flowing through the refrigerant flow path 114. In addition, in order to increase the contact area with the refrigerant, heat radiation surfaces 502a and 502b may be formed with columnar or plate-shaped heat radiation fins.

  In a gap space 110c (see FIG. 9) formed between the cooling block 110a and the cooling block 110b, a DC bus bar 900 on which a plurality of capacitors 90 are mounted is disposed. The DC bus bar 900 is a laminated bus bar in which a positive electrode conductor plate 92 and a negative electrode conductor plate 94 are laminated via a sheet-like insulating member 93 (insulating paper or resin). As shown in FIG. 11, the positive electrode conductor plate 92 and the negative electrode conductor plate 94 are made of wide plate-like conductors. Thus, by making the positive electrode conductor plate 92 and the negative electrode conductor plate 94 having a large area into a laminated structure, the resistance value and inductance of the DC bus bar 900 can be reduced. Since the capacitors 90 are distributed and arranged at positions symmetrical to the center of the DC bus bar 900, the balance of electrical characteristics (wiring inductance) is good.

  The positive electrode conductor plate 92 is formed with a positive terminal portion 920 that is connected to the positive terminals 57 of the power modules 500a to 500c. A negative electrode terminal portion 940 that is connected to the negative electrode terminal 58 of the power modules 500 a to 500 c is formed on the negative electrode conductor plate 94. Three sets of the positive electrode terminal portion 920 and the negative electrode terminal portion 940 are formed corresponding to the three power modules 500a to 500c.

  Each capacitor 90 is disposed on the positive electrode conductor plate 92 side of the DC bus bar 900, and the positive electrode terminal 91 a of each capacitor 90 is connected to the positive electrode conductor plate 92. On the other hand, the negative electrode terminal 91 b of each capacitor 90 passes through a through hole 921 formed in the positive electrode conductor plate 92 and is connected to the negative electrode conductor plate 94 on the opposite side. As shown in FIG. 11, the positive electrode terminal 91 a connected to the positive electrode conductor plate 92 can be seen from the through hole 941 formed in the negative electrode conductor plate 94 of the DC bus bar 900.

  The positive electrode conductor plate 92 of the DC bus bar 900 disposed in the gap space 110c is in close contact with the wall surface of the cooling block 110a via the insulating sheet 130. Similarly, the negative electrode conductor plate 94 of the DC bus bar 900 is in close contact with the wall surface of the cooling block 110b via the insulating sheet 130. That is, the DC bus bar 900 is in thermal contact with the wall surfaces of the cooling blocks 110a and 110b through which the refrigerant flows, and Joule heat generated in the DC bus bar 900 dissipates heat to the refrigerant flowing through the refrigerant flow path 114 via the cooling block wall surfaces. Is done. As a result, the DC bus bar 900 can be efficiently cooled.

  FIG. 6 shows power modules 500 a to 500 c, a DC bus bar 900, and a plurality of capacitors 90 arranged in the housing body 110. The plurality of capacitors 90 mounted on the DC bus bar 900 are arranged at both ends in the longitudinal direction of the DC bus bar 900. For this reason, when the DC bus bar 900 is inserted into the gap space 110c, the capacitors 90 arranged in the gap space 110c are arranged in empty spaces on both sides of the cooling block 110a.

  As described above, the DC bus bar 900 on which the capacitor 90 is mounted has a structure that is in thermal contact with the wall surfaces of the cooling blocks 110a and 110b, and is adjacent to the wall surfaces of the cooling blocks 110a and 110b through which the refrigerant flows. By arranging this, the temperature rise of the capacitor 90 can be suppressed. Further, by arranging the cooling block 110a so as to sandwich the cooling block 110a, the space between the cooling block 110a and the side wall of the casing body 110 can be used effectively, and the casing body 110 can be downsized.

  6 are connected portions between the power modules 500a to 500c and the DC bus bar 900. Reference numerals C1 to C3 in FIG. In each of the connection portions C1 to C3, the positive terminal portion 920 formed on the positive conductor plate 92 is connected to the positive terminal 57 of the power modules 500a to 500c, and the negative terminal portion 940 formed on the negative conductor plate 94 is the power module. It is connected to the negative terminal 58 of 500a-500c.

  After the assembly in the state of FIG. 6, the corresponding AC bus bars 86a to 86c are connected to the AC terminals 59 of the power modules 500a to 500c by welding or the like. In addition, the control board 120 is disposed above the cooling block 110 a and the capacitor 90, and the control signal connection terminals 70 of the power modules 500 a to 500 c are connected to the control board 120. Electronic components constituting the control circuit 72 and the driver circuit 74 are mounted on the control board 120. The control signal connection terminal 70 is pulled out from the module case 501 in the front direction of the housing, and then bent upward to the housing where the control board 120 is disposed. 6 and 10, the portion bent upward of the control signal connection terminal 70 is omitted.

-Second Embodiment-
12-13 is a figure explaining 2nd Embodiment of the inverter apparatus by this invention. As shown in FIG. 12, the inverter device of the present embodiment is applied to a mechanical / electrical integrated rotating electrical machine. In the electromechanically integrated rotating electrical machine shown in FIG. 12, the casing main body 110 of the inverter device 40 is directly attached to the upper portion of the motor housing 200 provided with the motor stator 205 and the motor rotor 206.

  FIG. 13 is a perspective view of the inverter device 40 and corresponds to FIG. 5 of the first embodiment. The difference between the present embodiment and the first embodiment described above is the shape of the AC bus bars 86a to 86c, and the other configurations are the same as those of the first embodiment. An opening 110 e is formed on the bottom surface of the housing body 110. The AC bus bars 86a to 86c extend from the connection portions with the power modules 500a to 500c in the direction of the bottom of the casing, project through the opening 110e, and project outside the casing.

  Through holes for passing the AC bus bars 86a to 86c are also formed in the upper part of the motor housing 200. When the inverter device 40 is fixed to the upper part of the motor housing 200, the AC bus bars 86a to 86c pass through the through holes. It is introduced into the housing. AC bus bar 86a is connected to connection terminal 210a of the U-phase armature winding. Similarly, AC bus bar 86b is connected to connection terminal 210b of the V-phase armature winding, and AC bus bar 86c is connected to connection terminal 210c of the W-phase armature winding.

  FIG. 14 is a diagram showing the arrangement of the control board 120. In the present embodiment, the AC bus bars 86a to 86c are configured to be drawn out of the housing from the bottom surface of the housing, so that the control board 120 can be disposed between the power modules 500a to 500c and the front side of the lid 117. With such an arrangement, the wiring for electrically connecting the control signal connection terminal 70 and the control board 120 of each module can be shortened and the noise of the control signal can be suppressed. Can be prevented.

  In the present embodiment, as shown in FIG. 12, the AC bus bars 86a to 86c are taken out from the bottom surface of the housing fixed to the motor housing, thereby shortening the AC bus bar and the three-phase armature windings of the motor generator. It is possible to connect at a distance, and it is possible to reduce Joule loss generated in the connection cable.

  In the first and second embodiments described above, the power semiconductor elements (IGBT 52, IGBT 62, diode 56, diode 66) constituting the series circuit 50 of the upper and lower arms are made of a metal module having the heat radiation portions 502a and 502b. The module 501 is sealed in the case 501 and the module case 501 is arranged in the refrigerant flow path 114. However, the present invention can be applied not only to such a double-sided cooling type power module but also to single-sided cooling type power modules 600a to 600c as shown in FIGS.

  FIG. 15 is a diagram showing a case of single-sided cooling type power modules 600 a to 600 c mounted on the cooling blocks 110 a and 110 b of the housing body 110. In the case of the housing body 110 shown in FIG. 15, a storage space 110f is also formed below the cooling block 110b. In the single-sided cooling type power modules 600 a to 600 c, an insulating substrate 602 having a wiring pattern formed on a metal base 601 is provided, and the semiconductor power element described above is mounted on the insulating substrate 602. The power modules 600a to 600c are fixed so as to be in close contact with the outer wall surfaces of the cooling blocks 110a and 110b, respectively.

  FIG. 16 is a modification of the inverter device shown in FIG. FIG. 16 is an enlarged view of the power module 600a attached to the cooling block 110a. A plurality of heat radiation fins 603 are formed on the bottom surface side of the metal base 601. An opening 111 is formed on the mounting surface (upper surface in the drawing) of the cooling block 110a. The power module 600 a is attached to the cooling block 110 a so that the opening 111 is closed by the metal base 601. As a result, the heat radiation fin 603 is inserted into the refrigerant flow path 114. Thus, by directly cooling the metal base 601 with the refrigerant, the heat radiation effect can be improved as compared with the structure shown in FIG.

The inverter device of the above-described embodiment can achieve the following operational effects.
(1) In the inverter device shown in FIG. 17, the positive electrode conductor plate 92 and the negative electrode conductor plate 94 for supplying a direct current to the three power modules 500 a to 500 c form a plate-shaped laminated DC bus bar 900. . The casing body 110 that functions as a cooling casing is provided with cooling blocks 110g and 110h in which a refrigerant flow path 114 is formed. Further, the cooling blocks 110g and 110h are juxtaposed in the left-right direction in the figure inside the housing body 110, and the cooling block 110a is arranged with a gap with respect to the juxtaposed cooling blocks 110g and 110h. In the laminated DC bus bar 900, one surface (the surface of the positive electrode conductor plate 92) is in thermal contact with the cooling block 110a, and the other surface (the surface of the negative electrode conductor plate 94) is thermally connected to the cooling blocks 110g and 110h. Is arranged in a gap space 110c (see FIG. 9) between the cooling block 110a and the cooling blocks 110g and 110h.

  Thus, since the DC bus bar 900 is brought into thermal contact with the cooling blocks 110a, 110g, 110h through which the refrigerant flows, the DC bus bar 900 can be cooled from both sides, and Joule heat generated in the DC bus bar 900 can be reduced. It is possible to efficiently dissipate heat to the refrigerant. Further, by laminating the positive electrode conductor plate 92 and the negative electrode conductor plate 94 constituting the DC bus bar 900, the wiring inductance can be reduced. Furthermore, by arranging the cooling blocks 110a, 110g, and 110h on the front and back sides of the plate-shaped stacked DC bus bar 900, the housing body 110 can be downsized.

  In FIG. 17, the cooling block disposed on the negative electrode conductor plate 94 side is provided for each of the power modules 500b and 500c. However, as shown in FIG. 8, the two cooling blocks 110g and 110h are integrated into the integrated cooling block 110b. You can put it together. That is, the cooling block 110b corresponds to the second and third cooling blocks. Further, as shown in FIGS. 15 and 16, the present invention can be similarly applied to a single-sided cooling type power module in which a power semiconductor element is provided on a metal base 601, and similar operational effects can be achieved.

(2) As shown in FIG. 7, the power modules 500b and 500c are disposed in the refrigerant flow path 114 of the cooling block 110b that constitutes the second and third cooling blocks, and in the refrigerant flow path 114 of the cooling block 110a. The power module 500a is arranged, and the cooling block 110a is arranged in parallel so as to face the middle of the cooling block 110b. Thereby, by providing the AC bus bar 86a so as to be positioned between the AC bus bars 86b and 86c, the length of the AC bus bar can be shortened as much as possible. As a result, Joule loss can be reduced.

(3) As shown in FIG. 8, a plurality of capacitors 90 in which the positive electrode terminal 91 a is connected to the positive electrode conductor plate 92 and the negative electrode terminal 91 b is connected to the negative electrode conductor plate 94 are connected to the positive electrode conductor plate 92 side of the laminated DC bus bar 900. Further, by arranging the cooling block 110a so as to sandwich the cooling block 110a, the space between the cooling block 110a and the side wall of the casing body 110 can be used effectively, and the casing body 110 can be downsized.

(4) Further, as shown in FIGS. 8 and 9, when the laminated DC bus bar 900 is disposed in the gap space 110c, an insulating resin (eg, polyethylene terephthalate) is provided between the DC bus bar 900 and the cooling block. By providing the insulating sheet formed by the above, the adhesion between the laminated DC bus bar 900 and the block wall surface is improved. Although the sheet-like resin is used here, the insulating resin may be poured into the gap after the DC bus bar 900 is inserted into the gap space 110c.

(5) As shown in FIG. 7, the power modules 500a to 500b are inserted in parallel to the bottom surface of the casing with respect to the refrigerant flow paths 114 of the cooling blocks 110a and 110b, so that each AC terminal 59 is in front of the casing. Align to the side. Therefore, as illustrated in FIG. 12, when the inverter device 40 is used as an inverter device of an electromechanical integrated rotating machine in which the bottom surface of the housing body 110 is integrally fixed to the motor housing 200, the AC bus bars 86 a to 86 c are It becomes possible to easily connect to the connection terminals 210a to 210c of the armature winding through the opening 110e formed on the bottom surface of the housing. Moreover, by setting it as such a structure, the length of AC bus-bar 86a-86c can be shortened.

(6) As shown in FIG. 17, the refrigerant flowing in from the refrigerant inlet 112 flows into the cooling block 110g, the cooling block 110a, and the cooling block 110h arranged in this order from the refrigerant inlet 112 along the refrigerant outlet 113. Then, the refrigerant is discharged from the refrigerant outlet 113. Therefore, the length of the refrigerant flow path is shortened, the pressure loss can be suppressed, and effective cooling can be performed. Various refrigerants including cooling water can be used as the refrigerant.

  In the embodiments described above, a system in which a drive motor and an inverter for an electric vehicle are integrated is mentioned. However, application to a hybrid vehicle and a system in which a motor and an inverter are separately configured are also possible. There is no limitation to the configuration of the above embodiment. Moreover, you may use each embodiment mentioned above individually or in combination. This is because the effects of the respective embodiments can be achieved independently or synergistically.

  20: motor generator, 30: battery, 40: inverter device, 42: inverter circuit, 50: series circuit, 52, 62: IGBT, 56, 66: diode, 86, 86a to 86c: AC bus bar, 90: capacitor, 92 : Positive electrode conductor plate, 93: Insulating member, 94: Negative electrode conductor plate, 110: Housing body, 110a to 110c, 110g, 110h: Cooling block, 110e, 111: Opening, 112: Refrigerant inlet, 113: Refrigerant outlet , 120: control board, 130: insulating sheet, 200: motor housing, 210a to 210c: connection terminal, 500, 500a to 500c, 600, 600a to 600c: power module, 900: DC bus bar

Claims (6)

A first power module provided with a semiconductor element constituting a first phase of an inverter circuit for converting DC power into three-phase AC power;
A second power module provided with a semiconductor element constituting the second phase of the inverter circuit;
A third power module provided with a semiconductor element constituting the third phase of the inverter circuit;
A plate-like laminated DC bus bar in which a positive electrode bus bar and a negative electrode bus bar for supplying a direct current to the first, second and third power modules are laminated;
First, second, and third AC bus bars connected to the first, second, and third power modules, respectively, for outputting an AC current of each phase;
The first, second, and third power modules, the stacked DC bus bar, the first, second, and third AC bus bars are housed, and a refrigerant flow path is formed to form the first power module. Cooling having a first cooling block for cooling, a second cooling block for cooling the second power module formed with a coolant channel, and a third cooling block for cooling the third power module formed with a coolant channel. A housing,
The second cooling block and the third cooling block are juxtaposed in the cooling housing,
The first cooling block is disposed via a gap with respect to the second and third cooling blocks arranged side by side,
The stacked DC bus bar has the gap so that one surface of the DC bus bar is in thermal contact with the first cooling block and the other surface is in thermal contact with the second and third cooling blocks. An inverter device characterized in that the inverter device is disposed. The inverter device according to claim 1,
The first, second and third power modules are respectively disposed in the refrigerant flow paths of the first, second and third cooling blocks corresponding thereto,
The first cooling block arranged in parallel with the second and third cooling blocks through a gap is arranged in parallel so as to face between the second cooling block and the third cooling block,
The inverter device, wherein the first AC bus bar is located between the second and third AC bus bars. In the inverter device according to claim 2,
A plurality of capacitors having a positive electrode terminal connected to the positive electrode bus bar and a negative electrode terminal connected to the negative electrode bus bar are arranged on the one surface side of the stacked DC bus bar so as to sandwich the first cooling block. A featured inverter device. In the inverter apparatus as described in any one of Claims 1 thru | or 3,
The inverter device, wherein the positive electrode bus bar and the negative electrode bus bar are in thermal contact with the cooling block via an insulating resin. In the inverter device according to claim 2 or 3,
The cooling housing has an opening on the bottom surface of the housing fixed to the housing of the rotating electrical machine driven by the inverter circuit,
The first, second, and third power modules disposed in the refrigerant flow path are inserted in parallel to the bottom surface of the housing,
The first, second, and third AC bus bars are drawn out of the housing from the opening and connected to armature winding terminals provided in the housing. apparatus. In the inverter device according to claim 2 or 3,
The cooling housing has a refrigerant inflow portion and a refrigerant discharge portion,
The refrigerant that has flowed in from the refrigerant inflow portion flows in the order of the second cooling block, the first cooling block, and the third cooling block, and is then discharged from the refrigerant discharge portion.

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