JP5831232B2 - ワーク分割装置及びワーク分割方法 - Google Patents

ワーク分割装置及びワーク分割方法 Download PDF

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Publication number
JP5831232B2
JP5831232B2 JP2012000143A JP2012000143A JP5831232B2 JP 5831232 B2 JP5831232 B2 JP 5831232B2 JP 2012000143 A JP2012000143 A JP 2012000143A JP 2012000143 A JP2012000143 A JP 2012000143A JP 5831232 B2 JP5831232 B2 JP 5831232B2
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workpiece
dicing tape
die attach
attach film
dividing
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JP2012186447A5 (enExample
JP2012186447A (ja
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翼 清水
翼 清水
藤田　隆
隆 藤田
恒郎 小島
恒郎 小島
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Tokyo Seimitsu Co Ltd
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Tokyo Seimitsu Co Ltd
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Priority to KR1020120013858A priority patent/KR101831453B1/ko
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JP2012000143A 2011-02-16 2012-01-04 ワーク分割装置及びワーク分割方法 Active JP5831232B2 (ja)

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JP2012000143A JP5831232B2 (ja) 2011-02-16 2012-01-04 ワーク分割装置及びワーク分割方法
KR1020120013858A KR101831453B1 (ko) 2011-02-16 2012-02-10 워크 분할장치 및 워크 분할방법

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JP2011031293 2011-02-16
JP2011031293 2011-02-16
JP2012000143A JP5831232B2 (ja) 2011-02-16 2012-01-04 ワーク分割装置及びワーク分割方法

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JP2012186447A JP2012186447A (ja) 2012-09-27
JP2012186447A5 JP2012186447A5 (enExample) 2015-03-19
JP5831232B2 true JP5831232B2 (ja) 2015-12-09

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Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6052304B2 (ja) * 2012-12-26 2016-12-27 日立化成株式会社 エキスパンド方法、半導体装置の製造方法、及び半導体装置
JP6096024B2 (ja) * 2013-03-26 2017-03-15 リンテック株式会社 シート剥離装置及びシート剥離方法
JP6266429B2 (ja) * 2014-05-08 2018-01-24 株式会社ディスコ チップ間隔維持装置及びチップ間隔維持方法
JP6371735B2 (ja) 2015-04-20 2018-08-08 東芝メモリ株式会社 半導体装置の製造方法
KR101827286B1 (ko) * 2016-07-14 2018-03-22 정상국 칩 간격 확장장치 및 확장방법
JP6829806B2 (ja) * 2016-12-28 2021-02-17 株式会社東京精密 ワーク分割装置及びワーク分割方法
JP6826288B2 (ja) * 2017-01-13 2021-02-03 株式会社東京精密 ワーク分割装置及びワーク分割方法
JP7030006B2 (ja) * 2018-04-12 2022-03-04 株式会社ディスコ 拡張方法及び拡張装置
JP7630873B2 (ja) * 2020-09-15 2025-02-18 株式会社ディスコ エキスパンド装置
JP7170208B2 (ja) * 2021-01-19 2022-11-14 株式会社東京精密 ワーク分割装置及びワーク分割方法
JP7008935B2 (ja) * 2021-01-19 2022-01-25 株式会社東京精密 ワーク分割装置及びワーク分割方法
JP7674139B2 (ja) * 2021-04-22 2025-05-09 株式会社ディスコ チップ間隔形成方法
JP7749350B2 (ja) * 2021-06-17 2025-10-06 株式会社ディスコ ウェーハの加工方法及び拡張装置
JP2023170802A (ja) * 2022-05-20 2023-12-01 株式会社ディスコ エキスパンド装置、及び、エキスパンド方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006049591A (ja) * 2004-08-05 2006-02-16 Disco Abrasive Syst Ltd ウエーハに貼着された接着フィルムの破断方法および破断装置
JP2009054803A (ja) * 2007-08-27 2009-03-12 Seiko Epson Corp エキスパンド治具、エキスパンド方法及び単位素子の製造方法
JP5170880B2 (ja) * 2008-03-24 2013-03-27 古河電気工業株式会社 ウエハ加工用テープ
JP5207455B2 (ja) * 2008-05-09 2013-06-12 株式会社ディスコ フィルム状接着剤の破断装置及び破断方法
JP5243101B2 (ja) * 2008-05-14 2013-07-24 株式会社ディスコ 破断装置
JP5791866B2 (ja) * 2009-03-06 2015-10-07 株式会社ディスコ ワーク分割装置

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