JP5822133B2 - 誘導結合形プラズマ処理装置のマスク部材 - Google Patents
誘導結合形プラズマ処理装置のマスク部材 Download PDFInfo
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- JP5822133B2 JP5822133B2 JP2011281886A JP2011281886A JP5822133B2 JP 5822133 B2 JP5822133 B2 JP 5822133B2 JP 2011281886 A JP2011281886 A JP 2011281886A JP 2011281886 A JP2011281886 A JP 2011281886A JP 5822133 B2 JP5822133 B2 JP 5822133B2
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- mask member
- dielectric window
- processing chamber
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- conductive film
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JP2011281886A JP5822133B2 (ja) | 2011-12-22 | 2011-12-22 | 誘導結合形プラズマ処理装置のマスク部材 |
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JP2011281886A JP5822133B2 (ja) | 2011-12-22 | 2011-12-22 | 誘導結合形プラズマ処理装置のマスク部材 |
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JP2013129897A JP2013129897A (ja) | 2013-07-04 |
JP2013129897A5 JP2013129897A5 (enrdf_load_stackoverflow) | 2014-10-16 |
JP5822133B2 true JP5822133B2 (ja) | 2015-11-24 |
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JP2011281886A Active JP5822133B2 (ja) | 2011-12-22 | 2011-12-22 | 誘導結合形プラズマ処理装置のマスク部材 |
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Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN107393790A (zh) * | 2017-07-20 | 2017-11-24 | 中国科学院电子学研究所 | 电真空器件介质窗片的金属化方法 |
JP7469625B2 (ja) * | 2020-04-13 | 2024-04-17 | 日新電機株式会社 | プラズマ源及びプラズマ処理装置 |
CN113223916B (zh) * | 2021-06-09 | 2024-05-28 | 上海邦芯半导体科技有限公司 | 一种电感耦合等离子体装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH01184922A (ja) * | 1988-01-20 | 1989-07-24 | Canon Inc | エッチング、アッシング及び成膜等に有用なプラズマ処理装置 |
JP3364675B2 (ja) * | 1997-09-30 | 2003-01-08 | 東京エレクトロンエイ・ティー株式会社 | プラズマ処理装置 |
JP4119547B2 (ja) * | 1997-10-20 | 2008-07-16 | 東京エレクトロンAt株式会社 | プラズマ処理装置 |
JP4193255B2 (ja) * | 1998-12-01 | 2008-12-10 | 株式会社日立製作所 | プラズマ処理装置及びプラズマ処理方法 |
JP4469054B2 (ja) * | 2000-03-10 | 2010-05-26 | サムコ株式会社 | 誘導結合形プラズマ処理装置 |
JP2008133538A (ja) * | 2006-10-27 | 2008-06-12 | Mitsubishi Materials Corp | ターゲット廃材とインジウムの分離回収方法。 |
JP4888076B2 (ja) * | 2006-11-17 | 2012-02-29 | パナソニック株式会社 | プラズマエッチング装置 |
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