JP2013129897A5 - - Google Patents

Download PDF

Info

Publication number
JP2013129897A5
JP2013129897A5 JP2011281886A JP2011281886A JP2013129897A5 JP 2013129897 A5 JP2013129897 A5 JP 2013129897A5 JP 2011281886 A JP2011281886 A JP 2011281886A JP 2011281886 A JP2011281886 A JP 2011281886A JP 2013129897 A5 JP2013129897 A5 JP 2013129897A5
Authority
JP
Japan
Prior art keywords
dielectric window
plasma processing
slits
inductively coupled
coupled plasma
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011281886A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013129897A (ja
JP5822133B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2011281886A priority Critical patent/JP5822133B2/ja
Priority claimed from JP2011281886A external-priority patent/JP5822133B2/ja
Publication of JP2013129897A publication Critical patent/JP2013129897A/ja
Publication of JP2013129897A5 publication Critical patent/JP2013129897A5/ja
Application granted granted Critical
Publication of JP5822133B2 publication Critical patent/JP5822133B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2011281886A 2011-12-22 2011-12-22 誘導結合形プラズマ処理装置のマスク部材 Active JP5822133B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011281886A JP5822133B2 (ja) 2011-12-22 2011-12-22 誘導結合形プラズマ処理装置のマスク部材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011281886A JP5822133B2 (ja) 2011-12-22 2011-12-22 誘導結合形プラズマ処理装置のマスク部材

Publications (3)

Publication Number Publication Date
JP2013129897A JP2013129897A (ja) 2013-07-04
JP2013129897A5 true JP2013129897A5 (enrdf_load_stackoverflow) 2014-10-16
JP5822133B2 JP5822133B2 (ja) 2015-11-24

Family

ID=48907683

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011281886A Active JP5822133B2 (ja) 2011-12-22 2011-12-22 誘導結合形プラズマ処理装置のマスク部材

Country Status (1)

Country Link
JP (1) JP5822133B2 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107393790A (zh) * 2017-07-20 2017-11-24 中国科学院电子学研究所 电真空器件介质窗片的金属化方法
JP7469625B2 (ja) * 2020-04-13 2024-04-17 日新電機株式会社 プラズマ源及びプラズマ処理装置
CN113223916B (zh) * 2021-06-09 2024-05-28 上海邦芯半导体科技有限公司 一种电感耦合等离子体装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01184922A (ja) * 1988-01-20 1989-07-24 Canon Inc エッチング、アッシング及び成膜等に有用なプラズマ処理装置
JP3364675B2 (ja) * 1997-09-30 2003-01-08 東京エレクトロンエイ・ティー株式会社 プラズマ処理装置
JP4119547B2 (ja) * 1997-10-20 2008-07-16 東京エレクトロンＡｔ株式会社 プラズマ処理装置
JP4193255B2 (ja) * 1998-12-01 2008-12-10 株式会社日立製作所 プラズマ処理装置及びプラズマ処理方法
JP4469054B2 (ja) * 2000-03-10 2010-05-26 サムコ株式会社 誘導結合形プラズマ処理装置
JP2008133538A (ja) * 2006-10-27 2008-06-12 Mitsubishi Materials Corp ターゲット廃材とインジウムの分離回収方法。
JP4888076B2 (ja) * 2006-11-17 2012-02-29 パナソニック株式会社 プラズマエッチング装置

Similar Documents

Publication Publication Date Title
JP2013149722A5 (enrdf_load_stackoverflow)
WO2011062755A3 (en) Plasma source design
WO2012058184A3 (en) Plasma processing apparatus with reduced effects of process chamber asymmetry
JP2009027194A5 (enrdf_load_stackoverflow)
WO2012166264A3 (en) Dynamic ion radical sieve and ion radical aperture for an inductively coupled plasma (icp) reactor
TW200741860A (en) Plasma processing apparatus, plasma processing method, focus ring, and focus ring component
WO2012148218A3 (ko) 수평열전 테이프 및 그 제조방법
CL2014002921A1 (es) Sistema de tratamiento de plasma y recubrimiento al vacio y tratamiento de superficies, comprende un mecanismo de plasma, un catado de magnetrón, un ánodos, una descarga de arco remoto, una cubierta de cátodos, una cubierta de ánodos, un sistema magnético, un suministro de energía de cátodo, y un suministro de energía de descarga de arco; método para recubrir un sustrato.
RU2016129486A (ru) Система и способ для лечения плазмой с использованием энергетической системы направленного диэлектрического барьерного разряда
JP2015067856A5 (enrdf_load_stackoverflow)
JP2013129897A5 (enrdf_load_stackoverflow)
JP2017501572A5 (enrdf_load_stackoverflow)
JP2012182447A5 (ja) 半導体膜の作製方法
JP2017028111A5 (enrdf_load_stackoverflow)
JP2012227398A5 (enrdf_load_stackoverflow)
JP2012234930A5 (enrdf_load_stackoverflow)
PH12013502181A1 (en) High power impulse magnetron sputtering method providing enhanced ionization of the sputtered particles and apparatus for its implementation
MX2012001712A (es) Aparato y metodo para remocion de oxidos de superficie por la via de la tecnica sin fundente que involucra la union de electron.
MY170814A (en) Magnetron electrode for plasma processing
JP2012012700A5 (enrdf_load_stackoverflow)
JP2013080643A5 (enrdf_load_stackoverflow)
CN104752138B (zh) 聚焦环和应用聚焦环的溅射反应器
JP5822133B2 (ja) 誘導結合形プラズマ処理装置のマスク部材
MX363412B (es) Fuente de evaporacion por arco.
US20120145325A1 (en) Plasma apparatus