JP5818381B2 - 構造的用途の複合材料 - Google Patents
構造的用途の複合材料 Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/08—Impregnating
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
- C08G59/184—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with amines
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4042—Imines; Imides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5033—Amines aromatic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/243—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using carbon fibres
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/254—Polymeric or resinous material
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- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Description
本発明による好適な例示的な樹脂配合物を、表1に示す。エポキシ成分を室温でポリエーテルスルホンと混合して樹脂ブレンドを形成し、それを60分間にわたって130℃まで加熱して、ポリエーテルスルホンに完全に溶解させることによってマトリックス樹脂を調製した。混合物を80℃まで冷却し、成分の残り(ポリアミドイミド粒子、ポリウレタン粒子、ポリアミド粒子及び硬化剤)を添加し、完全に混入させた。
比較プリプレグC1、C2及びC3を作製し、上記の好適な例示的プリプレグと同様にして試験した。ポリウレタン粒子の量を10重量パーセントに変更し、ポリアミド粒子の量を0重量パーセントに変更したこと以外は、C1は例1と同じであった。ポリウレタン粒子の量を0重量パーセントに変更し、ポリアミド粒子の量を10重量パーセントに変更したこと以外は、C2も例1と同じであった。ポリウレタン粒子の量を5重量パーセントに変更し、ポリアミド粒子の量を5重量パーセントに変更したこと以外は、C3も例1と同じであった。試験の結果を表2に整理する。ここでは、ポリウレタン粒子とポリアミド粒子の相対量が括弧で示されている。弾性粒子(ポリウレタン)と硬質粒子(ポリアミドイミド及びポリアミド)との相対重量は、例1では7/13であり、比較例1では10/10であり、比較例2では0/20であり、比較例3では5/15である。
本発明に包含されうる諸態様は、以下のように要約される。
[1].構造的用途に使用される未硬化複合材料であって、
繊維状補強体と、
エポキシ樹脂成分、
可溶性の熱可塑性成分、
硬質粒子及び弾性粒子を含む不溶性の粒子成分、及び
硬化剤
を含む未硬化樹脂マトリックスと
を含む、上記未硬化複合材料。
[2].前記エポキシ樹脂成分が、三官能性エポキシ樹脂及び四官能性エポキシ樹脂を含む、上記[1]項に記載の構造用途に使用される未硬化複合材料。
[3].前記三官能性エポキシ樹脂が三官能性メタ−グリシジルアミンである、上記[1]項に記載の構造用途に使用される未硬化複合材料。
[4].前記可溶性の熱可塑性成分がポリエーテルスルホンを含む、上記[1]項に記載の構造用途に使用される未硬化複合材料。
[5].前記弾性粒子がポリウレタン粒子である、上記[1]項に記載の構造用途に使用される未硬化複合材料。
[6].前記硬質粒子が、ポリアミド粒子及びポリアミドイミド粒子からなる群から選択される、上記[1]項に記載の構造用途に使用される未硬化複合材料。
[7].弾性粒子対硬質粒子の重量比が、1:1.3から1:2.5である、上記[1]項に記載の構造用途に使用される未硬化複合材料。
[8].前記弾性粒子がポリウレタン粒子を含み、前記硬質粒子がポリアミドイミド粒子及びポリアミド粒子を含む、上記[7]項に記載の構造用途に使用される未硬化複合材料。
[9].前記未硬化樹脂マトリックスが硬化された、上記[1]項に記載の構造用途に使用される複合材料。
[10].前記複合材料が一次航空機構造物の少なくとも一部を形成する上記[9]項に記載の複合材料。
[11].構造的用途に使用されるプリプレグを製造するための方法であって、
エポキシ樹脂成分と、
可溶性の熱可塑性成分と、
硬質粒子及び弾性粒子を含む粒子のブレンドを含む不溶性粒子成分と、
硬化剤とを含む未硬化樹脂を用意する工程、及び
前記未硬化樹脂と繊維状補強体とを混合して前記プリプレグを提供する工程
を含む、上記方法。
[12].前記エポキシ樹脂が、三官能性エポキシ樹脂及び四官能性エポキシ樹脂を含む、上記[11]項に記載の方法。
[13].前記三官能性エポキシ樹脂が三官能性メタ−グリシジルアミンである、上記[11]項に記載の方法。
[14].前記可溶性の熱可塑性成分がポリエーテルスルホンを含む、上記[11]項に記載の方法。
[15].前記弾性粒子がポリウレタン粒子である、上記[11]項に記載の方法。
[16].前記硬質粒子が、ポリアミドイミド粒子及びポリアミド粒子からなる群から選択される、上記[11]項に記載の方法。
[17].弾性粒子対硬質粒子の重量比が、1:1.3から1:2.5である、上記[11]項に記載の方法。
[18].前記弾性粒子がポリウレタン粒子を含み、前記硬質粒子がポリアミドイミド粒子及びポリアミド粒子を含む、上記[17]項に記載の方法。
[19].前記未硬化樹脂を硬化させて硬化複合部品を形成するさらなる工程を含む、上記[11]項に記載の方法。
[20].前記硬化複合部品が航空機の一次構造物の少なくとも一部を形成する、上記[19]項に記載の方法。
Claims (12)
- 構造的用途に使用される未硬化複合材料であって、
繊維状補強体と、
エポキシ樹脂成分、
可溶性の熱可塑性成分、
硬質粒子及び弾性粒子を含む不溶性の粒子成分であって、この弾性粒子対この硬質粒子の重量比が1:1.3から1:2.5であり、弾性粒子がポリウレタン粒子を含み、硬質粒子がポリアミドイミド粒子及びポリアミド粒子を含む、不溶性の粒子成分、及び
硬化剤
を含む未硬化樹脂マトリックスと
を含む、上記未硬化複合材料。 - 前記エポキシ樹脂成分が、三官能性エポキシ樹脂及び四官能性エポキシ樹脂を含む、請求項1に記載の構造用途に使用される未硬化複合材料。
- 前記三官能性エポキシ樹脂が三官能性メタ−グリシジルアミンである、請求項1に記載の構造用途に使用される未硬化複合材料。
- 前記可溶性の熱可塑性成分がポリエーテルスルホンを含む、請求項1に記載の構造用途に使用される未硬化複合材料。
- 請求項1に記載の前記未硬化複合材料が硬化された、構造用途に使用される複合材料。
- 前記複合材料が一次航空機構造物の少なくとも一部を形成する請求項5に記載の複合材料。
- 構造的用途に使用されるプリプレグを製造するための方法であって、
エポキシ樹脂成分と、
可溶性の熱可塑性成分と、
硬質粒子及び弾性粒子を含む粒子のブレンドを含む不溶性粒子成分であって、この弾性粒子対この硬質粒子の重量比が1:1.3から1:2.5であり、弾性粒子がポリウレタン粒子を含み、硬質粒子がポリアミドイミド粒子及びポリアミド粒子を含む、不溶性粒子成分と、
硬化剤とを含む未硬化樹脂を用意する工程、及び
前記未硬化樹脂と繊維状補強体とを混合して前記プリプレグを提供する工程
を含む、上記方法。 - 前記エポキシ樹脂が、三官能性エポキシ樹脂及び四官能性エポキシ樹脂を含む、請求項7に記載の方法。
- 前記三官能性エポキシ樹脂が三官能性メタ−グリシジルアミンである、請求項7に記載の方法。
- 前記可溶性の熱可塑性成分がポリエーテルスルホンを含む、請求項7に記載の方法。
- 硬化複合部品を製造する方法であって、
請求項7に記載の方法によって前記プリプレグを提供する工程、及び前記未硬化樹脂を硬化させて前記硬化複合部品を形成する工程を含む、方法。 - 前記硬化複合部品が航空機の一次構造物の少なくとも一部を形成する、請求項11に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/764,636 | 2010-04-21 | ||
US12/764,636 US8470923B2 (en) | 2010-04-21 | 2010-04-21 | Composite material for structural applications |
PCT/US2011/032008 WO2011133353A1 (en) | 2010-04-21 | 2011-04-12 | Composite material for structural applications |
Publications (2)
Publication Number | Publication Date |
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JP2013525542A JP2013525542A (ja) | 2013-06-20 |
JP5818381B2 true JP5818381B2 (ja) | 2015-11-18 |
Family
ID=44009834
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Application Number | Title | Priority Date | Filing Date |
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JP2013506172A Expired - Fee Related JP5818381B2 (ja) | 2010-04-21 | 2011-04-12 | 構造的用途の複合材料 |
Country Status (9)
Country | Link |
---|---|
US (2) | US8470923B2 (ja) |
EP (1) | EP2560816B1 (ja) |
JP (1) | JP5818381B2 (ja) |
CN (1) | CN102869507B (ja) |
BR (1) | BR112012026877A2 (ja) |
CA (1) | CA2794293C (ja) |
ES (1) | ES2484765T3 (ja) |
RU (1) | RU2567625C2 (ja) |
WO (1) | WO2011133353A1 (ja) |
Families Citing this family (39)
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US9447227B2 (en) | 2013-10-03 | 2016-09-20 | Sabic Global Technologies B.V. | Flexible polyurethane foam and associated method and article |
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WO2015105439A1 (en) * | 2014-01-13 | 2015-07-16 | Kjell Lindskog | Method and arrangement for manufacture of a product or completion of a product |
US20150355111A1 (en) | 2014-06-09 | 2015-12-10 | Hexcel Corporation | Tracers for use in compression molding of unidirectional discontinuous fiber composite molding compound |
CN104194260A (zh) * | 2014-08-11 | 2014-12-10 | 青岛申达高新技术开发有限公司 | 一种用于管道连接的复合材料连接件 |
US9821530B2 (en) | 2014-11-25 | 2017-11-21 | The Boeing Company | Composite laminate including interlayers with through-plane regions fused to fiber beds |
US10688766B2 (en) | 2014-11-25 | 2020-06-23 | The Boeing Company | Fabrication of composite laminates having thin interlayers |
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EP2560816B1 (en) | 2014-05-14 |
CN102869507A (zh) | 2013-01-09 |
JP2013525542A (ja) | 2013-06-20 |
CA2794293C (en) | 2017-12-12 |
CA2794293A1 (en) | 2011-10-27 |
CN102869507B (zh) | 2015-05-13 |
US20130260022A1 (en) | 2013-10-03 |
EP2560816A1 (en) | 2013-02-27 |
US20110259514A1 (en) | 2011-10-27 |
RU2012149445A (ru) | 2014-05-27 |
BR112012026877A2 (pt) | 2017-10-10 |
US8470923B2 (en) | 2013-06-25 |
ES2484765T3 (es) | 2014-08-12 |
WO2011133353A1 (en) | 2011-10-27 |
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