JP5816456B2 - 異方性導電接続材料、フィルム積層体、接続方法及び接続構造体 - Google Patents

異方性導電接続材料、フィルム積層体、接続方法及び接続構造体 Download PDF

Info

Publication number
JP5816456B2
JP5816456B2 JP2011107457A JP2011107457A JP5816456B2 JP 5816456 B2 JP5816456 B2 JP 5816456B2 JP 2011107457 A JP2011107457 A JP 2011107457A JP 2011107457 A JP2011107457 A JP 2011107457A JP 5816456 B2 JP5816456 B2 JP 5816456B2
Authority
JP
Japan
Prior art keywords
anisotropic conductive
adhesive
terminal
film
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011107457A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011204685A (ja
Inventor
恭志 阿久津
恭志 阿久津
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Priority to JP2011107457A priority Critical patent/JP5816456B2/ja
Publication of JP2011204685A publication Critical patent/JP2011204685A/ja
Priority to KR1020137032613A priority patent/KR101973823B1/ko
Priority to CN201280022932.5A priority patent/CN103502379B/zh
Priority to TW101116759A priority patent/TWI539470B/zh
Priority to PCT/JP2012/062194 priority patent/WO2012153849A1/ja
Priority to HK14102534.3A priority patent/HK1189389A1/zh
Application granted granted Critical
Publication of JP5816456B2 publication Critical patent/JP5816456B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)
  • Laminated Bodies (AREA)
  • Conductive Materials (AREA)
  • Wire Bonding (AREA)
JP2011107457A 2011-05-12 2011-05-12 異方性導電接続材料、フィルム積層体、接続方法及び接続構造体 Active JP5816456B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2011107457A JP5816456B2 (ja) 2011-05-12 2011-05-12 異方性導電接続材料、フィルム積層体、接続方法及び接続構造体
KR1020137032613A KR101973823B1 (ko) 2011-05-12 2012-05-11 이방성 도전 접속 재료, 필름 적층체, 접속 방법 및 접속 구조체
CN201280022932.5A CN103502379B (zh) 2011-05-12 2012-05-11 各向异性导电连接材料、膜层叠体、连接方法及连接结构体
TW101116759A TWI539470B (zh) 2011-05-12 2012-05-11 An anisotropic conductive connecting material, a film laminate, a connecting method, and a connecting structure
PCT/JP2012/062194 WO2012153849A1 (ja) 2011-05-12 2012-05-11 異方性導電接続材料、フィルム積層体、接続方法及び接続構造体
HK14102534.3A HK1189389A1 (zh) 2011-05-12 2014-03-13 各向異性導電連接材料、膜層叠體、連接方法及連接結構體

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011107457A JP5816456B2 (ja) 2011-05-12 2011-05-12 異方性導電接続材料、フィルム積層体、接続方法及び接続構造体

Publications (2)

Publication Number Publication Date
JP2011204685A JP2011204685A (ja) 2011-10-13
JP5816456B2 true JP5816456B2 (ja) 2015-11-18

Family

ID=44881092

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011107457A Active JP5816456B2 (ja) 2011-05-12 2011-05-12 異方性導電接続材料、フィルム積層体、接続方法及び接続構造体

Country Status (6)

Country Link
JP (1) JP5816456B2 (ko)
KR (1) KR101973823B1 (ko)
CN (1) CN103502379B (ko)
HK (1) HK1189389A1 (ko)
TW (1) TWI539470B (ko)
WO (1) WO2012153849A1 (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102413690B1 (ko) * 2014-02-04 2022-06-27 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름 및 그의 제조 방법
JP6608147B2 (ja) * 2015-02-23 2019-11-20 デクセリアルズ株式会社 多層接着フィルム、および接続構造体
JP7305957B2 (ja) * 2016-10-03 2023-07-11 株式会社レゾナック 導電性フィルム、巻回体、接続構造体、及び接続構造体の製造方法
CN106371250A (zh) * 2016-10-21 2017-02-01 芜湖赋兴光电有限公司 一种acf胶热压工艺

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4736280B2 (ja) * 2001-08-30 2011-07-27 日立化成工業株式会社 回路接続用接着剤及びそれを用いた回路接続構造体
JP2003313533A (ja) * 2002-04-23 2003-11-06 Sumitomo Bakelite Co Ltd 異方導電性接着剤
KR101039978B1 (ko) * 2004-06-09 2011-06-13 히다치 가세고교 가부시끼가이샤 접착제 조성물, 회로접속재료, 회로부재의 접속구조 및 반도체 장치
JP4381967B2 (ja) * 2004-12-07 2009-12-09 電気化学工業株式会社 接着剤組成物とそれを用いた接合体、接着剤組成物の製造方法
KR101035810B1 (ko) * 2005-10-18 2011-05-20 히다치 가세고교 가부시끼가이샤 접착제 조성물, 회로 접속 재료, 회로 접속 부재의 접속구조 및 반도체 장치
JP5000695B2 (ja) 2009-09-01 2012-08-15 日立化成工業株式会社 回路板装置の製造法

Also Published As

Publication number Publication date
JP2011204685A (ja) 2011-10-13
KR101973823B1 (ko) 2019-04-29
CN103502379A (zh) 2014-01-08
CN103502379B (zh) 2016-02-10
KR20140035391A (ko) 2014-03-21
WO2012153849A1 (ja) 2012-11-15
TWI539470B (zh) 2016-06-21
TW201301300A (zh) 2013-01-01
HK1189389A1 (zh) 2014-06-06

Similar Documents

Publication Publication Date Title
JP5690648B2 (ja) 異方性導電フィルム、接続方法及び接続構造体
JP5685473B2 (ja) 異方性導電フィルム、接合体の製造方法、及び接合体
JP7347576B2 (ja) 接着剤フィルム
JP5509542B2 (ja) 配線部材の接続構造体及び配線部材の接続方法
JP6209313B2 (ja) 異方性導電フィルム、接続構造体、接続構造体の製造方法及び接続方法
US20150047878A1 (en) Electroconductive particle, circuit connecting material, mounting body, and method for manufacturing mounting body
JP2014096531A (ja) 接続構造体の製造方法及び接続方法
CN111512502B (zh) 连接结构体及其制造方法
JP5816456B2 (ja) 異方性導電接続材料、フィルム積層体、接続方法及び接続構造体
WO2011152421A1 (ja) 異方性導電膜及びその製造方法
JP5844588B2 (ja) 回路接続材料及びそれを用いた接続方法並びに接続構造体
KR101872562B1 (ko) 회로 접속 재료 및 그것을 사용한 접속 방법 및 접속 구조체
JP4513147B2 (ja) 回路接続方法
JP2023029350A (ja) 接着剤フィルム
CN112543795B (zh) 连接结构体的制备方法及连接膜
JP2018133331A (ja) 異方性導電接続構造体、異方性導電接続構造体の製造方法、異方性導電フィルム、及び異方性導電ペースト
TWI837173B (zh) 連接構造體之製造方法及連接膜
TWI842669B (zh) 接著劑膜
JP2008291161A (ja) 接着剤の製造方法、電気部品の接続方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140307

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150519

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150721

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150811

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150825

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20150915

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20150928

R150 Certificate of patent or registration of utility model

Ref document number: 5816456

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250