JP5810625B2 - 蓋材又はリブ材 - Google Patents

蓋材又はリブ材 Download PDF

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Publication number
JP5810625B2
JP5810625B2 JP2011113267A JP2011113267A JP5810625B2 JP 5810625 B2 JP5810625 B2 JP 5810625B2 JP 2011113267 A JP2011113267 A JP 2011113267A JP 2011113267 A JP2011113267 A JP 2011113267A JP 5810625 B2 JP5810625 B2 JP 5810625B2
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Japan
Prior art keywords
photosensitive resin
hollow structure
resin composition
film
lid
Prior art date
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JP2011113267A
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English (en)
Japanese (ja)
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JP2012068615A (ja
JP2012068615A5 (enrdf_load_stackoverflow
Inventor
禎明 加藤
禎明 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Priority to JP2011113267A priority Critical patent/JP5810625B2/ja
Publication of JP2012068615A publication Critical patent/JP2012068615A/ja
Publication of JP2012068615A5 publication Critical patent/JP2012068615A5/ja
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Publication of JP5810625B2 publication Critical patent/JP5810625B2/ja
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  • Materials For Photolithography (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
JP2011113267A 2010-05-20 2011-05-20 蓋材又はリブ材 Active JP5810625B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011113267A JP5810625B2 (ja) 2010-05-20 2011-05-20 蓋材又はリブ材

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2010116234 2010-05-20
JP2010116234 2010-05-20
JP2010187658 2010-08-24
JP2010187658 2010-08-24
JP2011113267A JP5810625B2 (ja) 2010-05-20 2011-05-20 蓋材又はリブ材

Publications (3)

Publication Number Publication Date
JP2012068615A JP2012068615A (ja) 2012-04-05
JP2012068615A5 JP2012068615A5 (enrdf_load_stackoverflow) 2015-01-29
JP5810625B2 true JP5810625B2 (ja) 2015-11-11

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ID=46165928

Family Applications (1)

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JP2011113267A Active JP5810625B2 (ja) 2010-05-20 2011-05-20 蓋材又はリブ材

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JP (1) JP5810625B2 (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6233236B2 (ja) * 2014-08-08 2017-11-22 三菱電機株式会社 半導体装置の製造方法
JP7514058B2 (ja) * 2018-03-30 2024-07-10 太陽ホールディングス株式会社 感光性フィルム積層体およびその硬化物、並びに電子部品

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001013678A (ja) * 1999-07-02 2001-01-19 Taiyo Ink Mfg Ltd 磁性フィラーを含有する感光性樹脂組成物及び感光性フィルム並びにそれらを用いたパターン形成方法
JP4174275B2 (ja) * 2002-09-09 2008-10-29 住友ベークライト株式会社 感光性有機無機複合材料およびそれを用いた半導体装置
JP4595353B2 (ja) * 2004-03-05 2010-12-08 東洋インキ製造株式会社 導電性インキ、及びそれを用いた非接触型メディア
KR101681126B1 (ko) * 2008-10-10 2016-11-30 제이에스알 가부시끼가이샤 감광성 페이스트 조성물 및 패턴 형성 방법
JP5287397B2 (ja) * 2009-03-18 2013-09-11 Jsr株式会社 アルミニウム含有感光性樹脂組成物およびパターン形成方法
JP5852318B2 (ja) * 2011-03-31 2016-02-03 太陽ホールディングス株式会社 導電性樹脂組成物及び電子回路基板

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