JP5852318B2 - 導電性樹脂組成物及び電子回路基板 - Google Patents
導電性樹脂組成物及び電子回路基板 Download PDFInfo
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- JP5852318B2 JP5852318B2 JP2011078847A JP2011078847A JP5852318B2 JP 5852318 B2 JP5852318 B2 JP 5852318B2 JP 2011078847 A JP2011078847 A JP 2011078847A JP 2011078847 A JP2011078847 A JP 2011078847A JP 5852318 B2 JP5852318 B2 JP 5852318B2
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Description
本実施態様の導電性樹脂組成物は、フレーク径/厚さで表されるアスペクト比が5−25で、かつフレーク径が1−10μmのAlフレーク粉末と、有機バインダーと、を含有するものである。
(2)不飽和カルボン酸と不飽和二重結合を有する化合物の共重合体にエチレン性不飽和基をペンダントとして付加させることによって得られるカルボキシル基含有感光性樹脂。
(3)エポキシ基と不飽和二重結合を有する化合物と不飽和二重結合を有する化合物の共重合体に、不飽和カルボン酸を反応させ、生成した2級の水酸基に多塩基酸無水物を反応させて得られるカルボキシル基含有感光性樹脂。
(4)不飽和二重結合を有する酸無水物と不飽和二重結合を有する化合物の共重合体に、水酸基と不飽和二重結合を有する化合物を反応させて得られるカルボキシル基含有感光性樹脂。
(5)エポキシ化合物と不飽和モノカルボン酸を反応させ、生成した2級の水酸基に多塩基酸無水物を反応させて得られるカルボキシル基含有感光性樹脂。
(6)不飽和二重結合を有する化合物とグリシジル(メタ)アクリレートの共重合体のエポキシ基に、1分子中に1つのカルボキシル基を有し、エチレン性不飽和結合を持たない有機酸を反応させ、生成した2級の水酸基に多塩基酸無水物を反応させて得られるカルボキシル基含有樹脂。
(7)水酸基含有ポリマーに多塩基酸無水物を反応させて得られるカルボキシル基含有樹脂。
(8)水酸基含有ポリマーに多塩基酸無水物を反応させて得られるカルボキシル基含有樹脂に、エポキシ基と不飽和二重結合を有する化合物をさらに反応させて得られるカルボキシル基含有感光性樹脂。
これらのカルボキシル基含有感光性樹脂およびカルボキシル基含有樹脂は、単独で又は混合して用いることができる。
このようにして調製された導電性樹脂組成物を用いて、例えば以下のようにして導電パターンを形成する。
平均粒径が2.1μmの略球状Al粒子100質量部を、分散媒としてミネラルスプリット150質量部、分散剤としてオレイン酸2質量部と混合し、ボールミル粉砕機により、メディア径2〜20mmのZrO2製のボールを用い、回転数10〜100rpmの条件で所定のフレーク径になるまでフレーク化を行い、
各フレーク径のAlフレーク粉末を作製した。
温度計、攪拌機、滴下ロート、及び還流冷却器を備えたフラスコに、溶媒としてジエチ
レングリコールモノエチルエーテルアセテート、触媒としてアゾビスイソブチロニトリル
をいれ窒素雰囲気下、80℃に加熱し、メタクリル酸及びメチルメタアクリレートを、メタクリル酸:0.4mol、メチルメタアクリレート:0.6molのモル比で混合したモノマーを約2時間かけて滴下し、さらに1時間攪拌後、温度を115℃まで上げて失活させ、樹脂溶液を得た。
ガラス粉末としては、Bi2O3:50%、B2O3:16%、ZnO:14%、SiO2:2%、BaO:18%、熱膨張係数α300=86×10−7/℃、ガラス軟化点501℃のものを用いた。このガラス粉末を粗粉砕した後、300メッシュのスクリーンにてフィルタリングを行ない、得られたガラス粉末70質量部と2,2,4−トリメチル−1,3−ペンタンジオールモノブチレートを29.16質量部、それに分散剤として、BYK−410を0.14質量部、BYK−182を0.7質量部加えた。
なお、粒度測定は、堀場レーザー回折/散乱式粒度分布測定装置LA−920を用いて行った。
表1に配合量を示すように、各成分を1200mlのポリ容器にて配合し、ディゾルバーにて500rpm、10分間攪拌を行なった。その後、7インチサイズセラミック製3本ロールにて2回混練してペースト化し、実施例1〜6、及び比較例1〜4の導電性樹脂組成物を得た。
※2:元の平均粒径5.0μm
※3:トリメチロールプロパンEO変性トリアクリレート(M-350 東亜合成製)
※4:アルキルナフタレン系溶剤(ソルベッソ200 エクソンモービル社製)
※5:アクリル系レベリング・消泡剤(ポリフローNo.90 共栄社化学製)
※6: 次亜リン酸
※7: 2-ベンジル-2-ジメチルアミノ-1-(4-モルフォリノフェニル)-ブタノン-1
[導電性評価]
(試験基板の作製)
得られた各導電性樹脂組成物を用いて、それぞれ試験基板を作製した。
実施例1〜6、比較例1〜4の導電性樹脂組成物を、ガラス基板上に、200メッシュのポリエステルスクリーンにより全面印刷し、90℃で30分間乾燥させて、乾燥塗膜を得た。
(抵抗値の測定)
このようにして作製した0.1cm×5cmの導電パターンを有する評価基板について、HIOKI社製:HIOKI3540mΩハイテスタを用い、導電パターンのライン抵抗値を測定した。そして、ライン抵抗値から以下のようにして比抵抗値を算出した。
比抵抗値(Ω・cm)
=ライン抵抗値(Ω)×膜厚(cm)×ライン幅(cm)/ライン長さ(cm)
評価結果を表2に示す。
Claims (5)
- フレーク径/厚さで表されるアスペクト比が5−25で、かつフレーク径が1−10μmのAlフレーク粉末と、
アルカリ可溶性樹脂と、
リン含有化合物を含む保存安定剤(トリフェニルフォスファイトを除く)と、
を含有することを特徴とする導電性樹脂組成物。 - 前記Alフレーク粉末は、前記アルカリ可溶性樹脂100質量部に対し、20〜1000質量部であることを特徴とする請求項1に記載の導電性樹脂組成物。
- さらにガラスフリットを含有することを特徴とする請求項1又は請求項2に記載の導電性樹脂組成物。
- 基材上に、請求項1から請求項3のいずれか1項に記載の導電性樹脂組成物のパターンを形成し、
前記パターンを焼成して、基材上に導電パターンを形成する、
ことを特徴とする電子回路基板の形成方法。 - 請求項1から請求項3のいずれか1項に記載の導電性樹脂組成物の焼成物からなる導電パターンを有することを特徴とする電子回路基板。
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