JP2012068615A5 - - Google Patents
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- Publication number
- JP2012068615A5 JP2012068615A5 JP2011113267A JP2011113267A JP2012068615A5 JP 2012068615 A5 JP2012068615 A5 JP 2012068615A5 JP 2011113267 A JP2011113267 A JP 2011113267A JP 2011113267 A JP2011113267 A JP 2011113267A JP 2012068615 A5 JP2012068615 A5 JP 2012068615A5
- Authority
- JP
- Japan
- Prior art keywords
- hollow structure
- electronic component
- forming
- lid
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims 12
- 239000011342 resin composition Substances 0.000 claims 5
- -1 acrylate compound Chemical class 0.000 claims 4
- 239000011256 inorganic filler Substances 0.000 claims 4
- 229910003475 inorganic filler Inorganic materials 0.000 claims 4
- 150000001875 compounds Chemical class 0.000 claims 2
- 125000003368 amide group Chemical group 0.000 claims 1
- 239000003999 initiator Substances 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 239000002023 wood Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011113267A JP5810625B2 (ja) | 2010-05-20 | 2011-05-20 | 蓋材又はリブ材 |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010116234 | 2010-05-20 | ||
| JP2010116234 | 2010-05-20 | ||
| JP2010187658 | 2010-08-24 | ||
| JP2010187658 | 2010-08-24 | ||
| JP2011113267A JP5810625B2 (ja) | 2010-05-20 | 2011-05-20 | 蓋材又はリブ材 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012068615A JP2012068615A (ja) | 2012-04-05 |
| JP2012068615A5 true JP2012068615A5 (enrdf_load_stackoverflow) | 2015-01-29 |
| JP5810625B2 JP5810625B2 (ja) | 2015-11-11 |
Family
ID=46165928
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011113267A Active JP5810625B2 (ja) | 2010-05-20 | 2011-05-20 | 蓋材又はリブ材 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5810625B2 (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6233236B2 (ja) * | 2014-08-08 | 2017-11-22 | 三菱電機株式会社 | 半導体装置の製造方法 |
| JP7514058B2 (ja) * | 2018-03-30 | 2024-07-10 | 太陽ホールディングス株式会社 | 感光性フィルム積層体およびその硬化物、並びに電子部品 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001013678A (ja) * | 1999-07-02 | 2001-01-19 | Taiyo Ink Mfg Ltd | 磁性フィラーを含有する感光性樹脂組成物及び感光性フィルム並びにそれらを用いたパターン形成方法 |
| JP4174275B2 (ja) * | 2002-09-09 | 2008-10-29 | 住友ベークライト株式会社 | 感光性有機無機複合材料およびそれを用いた半導体装置 |
| JP4595353B2 (ja) * | 2004-03-05 | 2010-12-08 | 東洋インキ製造株式会社 | 導電性インキ、及びそれを用いた非接触型メディア |
| KR101681126B1 (ko) * | 2008-10-10 | 2016-11-30 | 제이에스알 가부시끼가이샤 | 감광성 페이스트 조성물 및 패턴 형성 방법 |
| JP5287397B2 (ja) * | 2009-03-18 | 2013-09-11 | Ｊｓｒ株式会社 | アルミニウム含有感光性樹脂組成物およびパターン形成方法 |
| JP5852318B2 (ja) * | 2011-03-31 | 2016-02-03 | 太陽ホールディングス株式会社 | 導電性樹脂組成物及び電子回路基板 |
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2011
- 2011-05-20 JP JP2011113267A patent/JP5810625B2/ja active Active