TW201144939A - Photosensitive resin composition - Google Patents

Photosensitive resin composition

Info

Publication number
TW201144939A
TW201144939A TW100107740A TW100107740A TW201144939A TW 201144939 A TW201144939 A TW 201144939A TW 100107740 A TW100107740 A TW 100107740A TW 100107740 A TW100107740 A TW 100107740A TW 201144939 A TW201144939 A TW 201144939A
Authority
TW
Taiwan
Prior art keywords
compound
photo
resin composition
mass parts
photosensitive resin
Prior art date
Application number
TW100107740A
Other languages
Chinese (zh)
Other versions
TWI477904B (en
Inventor
Kazuo Takebe
Katsuharu Inoue
Ryuichi Matsuura
Original Assignee
Sumitomo Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co filed Critical Sumitomo Chemical Co
Publication of TW201144939A publication Critical patent/TW201144939A/en
Application granted granted Critical
Publication of TWI477904B publication Critical patent/TWI477904B/en

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031Organic compounds not covered by group G03F7/029
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators

Abstract

The photosensitive resin composition of the present invention includes: resin; photo-polymerized compound; photo-polymerization initiator; photo-polymerization initiation auxiliary agent containing thioxanthen compound; and solvent, wherein the photo-polymerization initiator includes <alpha>-amino-ketone compound, biimidazole compound and oxime compound, and the contained quality of hioxanthen compound is more than 80 mass parts and less than 160 mass parts in comparison with the contained quality of <alpha>-amino-ketone compound being 100 mass parts.
TW100107740A 2010-03-26 2011-03-08 Photosensitive resin composition TWI477904B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010071809 2010-03-26

Publications (2)

Publication Number Publication Date
TW201144939A true TW201144939A (en) 2011-12-16
TWI477904B TWI477904B (en) 2015-03-21

Family

ID=44696584

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100107740A TWI477904B (en) 2010-03-26 2011-03-08 Photosensitive resin composition

Country Status (4)

Country Link
JP (1) JP5673243B2 (en)
KR (2) KR102066277B1 (en)
CN (1) CN102207680B (en)
TW (1) TWI477904B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5981167B2 (en) * 2011-03-24 2016-08-31 東京応化工業株式会社 Photosensitive resin composition
WO2013084283A1 (en) 2011-12-05 2013-06-13 日立化成株式会社 Method for forming protective film for touch panel electrodes, photosensitive resin composition, and photosensitive element
KR20170106655A (en) * 2011-12-05 2017-09-21 히타치가세이가부시끼가이샤 Method for forming protective film on electrode for touch panel, photosensitive resin composition and photosensitive element, and method for manufacturing touch panel
WO2013084282A1 (en) 2011-12-05 2013-06-13 日立化成株式会社 Method for forming resin cured film pattern, photosensitive resin composition, and photosensitive element
JP2013160825A (en) * 2012-02-02 2013-08-19 Sumitomo Chemical Co Ltd Photosensitive resin composition
JP2013171278A (en) * 2012-02-23 2013-09-02 Sumitomo Chemical Co Ltd Photosensitive resin composition
WO2014038576A1 (en) * 2012-09-05 2014-03-13 株式会社日本触媒 Photosensitive resin composition for photo spacer, and photo spacer
KR102145934B1 (en) * 2014-05-20 2020-08-19 동우 화인켐 주식회사 Method of forming photo-curable pattern
US10040967B2 (en) 2015-11-06 2018-08-07 Hitachi Chemical Company, Ltd. Photosensitive film, photosensitive element, cured product and touch panel
KR101697336B1 (en) * 2016-03-03 2017-01-17 주식회사 엘지화학 Method for preparing liquid crystal aligning agent
KR101979980B1 (en) * 2016-03-23 2019-05-17 동우 화인켐 주식회사 Photosensitive Resin Composition

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4470089B2 (en) * 2002-01-22 2010-06-02 東洋紡績株式会社 Actinic ray curable resist ink for conductive substrate
CN1573545A (en) * 2003-06-20 2005-02-02 富士胶片株式会社 Light-sensitive sheet, light-sensitive layers, image pattern forming method, and wiring pattern forming method
JP4419736B2 (en) * 2004-07-20 2010-02-24 Jsr株式会社 Photosensitive resin composition, display panel spacer and display panel
KR100658714B1 (en) * 2004-11-30 2006-12-15 삼성에스디아이 주식회사 Photo-sensitive composition, photo-sensitive paste composition for barrier ribs comprising the same, and method for preparing barrier ribs for plasma display panel
JP2006309157A (en) * 2005-04-01 2006-11-09 Jsr Corp Radiation-sensitive resin composition, protrusion and spacer formed of the same, and liquid crystal display element equipped with them
KR101329436B1 (en) * 2005-04-01 2013-11-14 제이에스알 가부시끼가이샤 Radiation sensitive resin composition, protrusion and spacer made therefrom, and liquid crystal display device comprising them
EP1906242B1 (en) * 2005-06-30 2015-07-15 DIC Corporation Photosensitive resin composition
JP4655928B2 (en) * 2005-06-30 2011-03-23 Dic株式会社 Photosensitive resin composition
KR100961818B1 (en) * 2007-02-21 2010-06-08 주식회사 엘지화학 Photo?sensitive resin composition for black matrix, black matrix produced by the composition and liquid crystal display including the black matrix
CN101622577A (en) * 2007-02-27 2010-01-06 Jsr株式会社 Radiation sensitive resin composition, spacer for liquid crystal display element and diaphragm and their formation method
JP4814997B2 (en) * 2007-04-24 2011-11-16 三井化学株式会社 Photosensitive resin composition, dry film and processed product using the same
JP4952918B2 (en) * 2007-05-23 2012-06-13 Jsr株式会社 Radiation-sensitive resin composition, spacer and protective film for liquid crystal display element, and method for forming them
WO2009034780A1 (en) * 2007-09-10 2009-03-19 Fujifilm Corporation Color filter, process for producing the color filter, and liquid crystal display device
JP5589270B2 (en) * 2007-10-23 2014-09-17 Jsr株式会社 Radiation-sensitive composition for blue color filter, color filter and liquid crystal display element
JP2009134078A (en) 2007-11-30 2009-06-18 Sumitomo Chemical Co Ltd Photosensitive resin composition
JP5527965B2 (en) * 2008-02-22 2014-06-25 Jsr株式会社 Radiation-sensitive composition for green pixel formation, color filter, and color liquid crystal display element
KR101482552B1 (en) * 2008-04-30 2015-01-21 주식회사 동진쎄미켐 Negative photosensitive resin composition

Also Published As

Publication number Publication date
JP5673243B2 (en) 2015-02-18
JP2011221508A (en) 2011-11-04
KR102066277B1 (en) 2020-01-14
KR102115077B1 (en) 2020-05-25
CN102207680B (en) 2015-09-02
KR20180021753A (en) 2018-03-05
KR20110108268A (en) 2011-10-05
CN102207680A (en) 2011-10-05
TWI477904B (en) 2015-03-21

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