JP2007031695A5 - - Google Patents

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Publication number
JP2007031695A5
JP2007031695A5 JP2006162466A JP2006162466A JP2007031695A5 JP 2007031695 A5 JP2007031695 A5 JP 2007031695A5 JP 2006162466 A JP2006162466 A JP 2006162466A JP 2006162466 A JP2006162466 A JP 2006162466A JP 2007031695 A5 JP2007031695 A5 JP 2007031695A5
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JP
Japan
Prior art keywords
epoxy equivalent
react
molding
add
compound
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JP2006162466A
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English (en)
Japanese (ja)
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JP5048974B2 (ja
JP2007031695A (ja
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Priority to JP2006162466A priority Critical patent/JP5048974B2/ja
Priority claimed from JP2006162466A external-priority patent/JP5048974B2/ja
Publication of JP2007031695A publication Critical patent/JP2007031695A/ja
Publication of JP2007031695A5 publication Critical patent/JP2007031695A5/ja
Application granted granted Critical
Publication of JP5048974B2 publication Critical patent/JP5048974B2/ja
Expired - Fee Related legal-status Critical Current
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JP2006162466A 2005-06-20 2006-06-12 電磁波吸収性と熱伝導性を有するアクリル系樹脂組成物及び樹脂シート Expired - Fee Related JP5048974B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006162466A JP5048974B2 (ja) 2005-06-20 2006-06-12 電磁波吸収性と熱伝導性を有するアクリル系樹脂組成物及び樹脂シート

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005179781 2005-06-20
JP2005179781 2005-06-20
JP2006162466A JP5048974B2 (ja) 2005-06-20 2006-06-12 電磁波吸収性と熱伝導性を有するアクリル系樹脂組成物及び樹脂シート

Publications (3)

Publication Number Publication Date
JP2007031695A JP2007031695A (ja) 2007-02-08
JP2007031695A5 true JP2007031695A5 (enrdf_load_stackoverflow) 2007-03-22
JP5048974B2 JP5048974B2 (ja) 2012-10-17

Family

ID=37791319

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006162466A Expired - Fee Related JP5048974B2 (ja) 2005-06-20 2006-06-12 電磁波吸収性と熱伝導性を有するアクリル系樹脂組成物及び樹脂シート

Country Status (1)

Country Link
JP (1) JP5048974B2 (enrdf_load_stackoverflow)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2008123362A1 (ja) * 2007-03-27 2010-07-15 日本ゼオン株式会社 重合性組成物及び成形体
JP5137629B2 (ja) * 2008-03-11 2013-02-06 古河電気工業株式会社 電磁波障害対策シ−ト
JP5879026B2 (ja) * 2010-07-23 2016-03-08 Ｎｅｃトーキン株式会社 難燃性ノイズ抑制シート
KR101223485B1 (ko) 2010-11-12 2013-01-17 한국과학기술연구원 복합 기능성 방열 입자와 이를 포함하는 구조체 및 필름, 및 그 제조방법
CN102888079A (zh) * 2011-07-22 2013-01-23 台达电子工业股份有限公司 磁热装置的制造方法
JP2013042026A (ja) * 2011-08-18 2013-02-28 Dexerials Corp 電磁波吸収性熱伝導シート、及び、電子機器
JP6297281B2 (ja) * 2013-05-27 2018-03-20 日東電工株式会社 軟磁性樹脂組成物、軟磁性接着フィルム、軟磁性フィルム積層回路基板、および、位置検出装置
JP6879690B2 (ja) * 2016-08-05 2021-06-02 スリーエム イノベイティブ プロパティズ カンパニー 放熱用樹脂組成物、その硬化物、及びこれらの使用方法
JP7009782B2 (ja) * 2017-05-30 2022-01-26 昭和電工マテリアルズ株式会社 シート
CN109957247A (zh) * 2017-12-25 2019-07-02 洛阳尖端技术研究院 一种吸波贴片及其制备方法和应用

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006073949A (ja) * 2004-09-06 2006-03-16 Showa Denko Kk 電磁波吸収体

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