JP2007031695A5 - - Google Patents
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- JP2007031695A5 JP2007031695A5 JP2006162466A JP2006162466A JP2007031695A5 JP 2007031695 A5 JP2007031695 A5 JP 2007031695A5 JP 2006162466 A JP2006162466 A JP 2006162466A JP 2006162466 A JP2006162466 A JP 2006162466A JP 2007031695 A5 JP2007031695 A5 JP 2007031695A5
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- JP
- Japan
- Prior art keywords
- epoxy equivalent
- react
- molding
- add
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
エポキシ当量が４００以上であるとアクリル系共重合体と反応させるために、グリシジル基を有する化合物を多く添加する必要があるので、得られた成形体の要求性能が十分果たせない場合があり、またこれとは逆にエポキシ当量が８０以下であると、反応速度が速すぎて成形が困難となる場合がある。
When the epoxy equivalent is 400 or more , in order to react with the acrylic copolymer, it is necessary to add a large amount of a compound having a glycidyl group, so that the required performance of the obtained molded product may not be sufficiently achieved. On the other hand, if the epoxy equivalent is 80 or less , the reaction rate may be too high and molding may be difficult.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006162466A JP5048974B2 (en) | 2005-06-20 | 2006-06-12 | Acrylic resin composition and resin sheet having electromagnetic wave absorption and thermal conductivity |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005179781 | 2005-06-20 | ||
| JP2005179781 | 2005-06-20 | ||
| JP2006162466A JP5048974B2 (en) | 2005-06-20 | 2006-06-12 | Acrylic resin composition and resin sheet having electromagnetic wave absorption and thermal conductivity |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007031695A JP2007031695A (en) | 2007-02-08 |
| JP2007031695A5 true JP2007031695A5 (en) | 2007-03-22 |
| JP5048974B2 JP5048974B2 (en) | 2012-10-17 |
Family
ID=37791319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006162466A Expired - Fee Related JP5048974B2 (en) | 2005-06-20 | 2006-06-12 | Acrylic resin composition and resin sheet having electromagnetic wave absorption and thermal conductivity |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5048974B2 (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2008123362A1 (en) * | 2007-03-27 | 2010-07-15 | 日本ゼオン株式会社 | Polymerizable composition and molded body |
| JP5137629B2 (en) * | 2008-03-11 | 2013-02-06 | 古河電気工業株式会社 | Electromagnetic interference countermeasure sheet |
| JP5879026B2 (en) * | 2010-07-23 | 2016-03-08 | Ｎｅｃトーキン株式会社 | Flame retardant noise suppression sheet |
| KR101223485B1 (en) | 2010-11-12 | 2013-01-17 | 한국과학기술연구원 | Multifuctional thermal spreading particles and array thereof, and the fabrication method thereof |
| CN102888079A (en) * | 2011-07-22 | 2013-01-23 | 台达电子工业股份有限公司 | Method for manufacturing magneto caloric device |
| JP2013042026A (en) * | 2011-08-18 | 2013-02-28 | Dexerials Corp | Electromagnetic wave-absorbing thermally conductive sheet and electronic device |
| JP6297281B2 (en) * | 2013-05-27 | 2018-03-20 | 日東電工株式会社 | Soft magnetic resin composition, soft magnetic adhesive film, soft magnetic film laminated circuit board, and position detection device |
| JP6879690B2 (en) | 2016-08-05 | 2021-06-02 | スリーエム イノベイティブ プロパティズ カンパニー | Resin composition for heat dissipation, its cured product, and how to use them |
| JP7009782B2 (en) * | 2017-05-30 | 2022-01-26 | 昭和電工マテリアルズ株式会社 | Seat |
| CN109957247A (en) * | 2017-12-25 | 2019-07-02 | 洛阳尖端技术研究院 | A kind of wave absorbing patch and its preparation method and application |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006073949A (en) * | 2004-09-06 | 2006-03-16 | Showa Denko Kk | Electromagnetic wave absorber |
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2006
- 2006-06-12 JP JP2006162466A patent/JP5048974B2/en not_active Expired - Fee Related
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