JP5800258B2 - 素子製造方法および素子製造装置 - Google Patents

素子製造方法および素子製造装置 Download PDF

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Publication number
JP5800258B2
JP5800258B2 JP2014156551A JP2014156551A JP5800258B2 JP 5800258 B2 JP5800258 B2 JP 5800258B2 JP 2014156551 A JP2014156551 A JP 2014156551A JP 2014156551 A JP2014156551 A JP 2014156551A JP 5800258 B2 JP5800258 B2 JP 5800258B2
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lid member
intermediate product
pair
film
lid
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JP2014156551A
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English (en)
Japanese (ja)
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JP2015062171A (ja
JP2015062171A5 (enExample
Inventor
隆 佳 二連木
隆 佳 二連木
田 利 彦 武
田 利 彦 武
島 宏 佳 中
島 宏 佳 中
村 祐 行 西
村 祐 行 西
幡 勝 也 小
幡 勝 也 小
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Dai Nippon Printing Co Ltd
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Dai Nippon Printing Co Ltd
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Priority to JP2014156551A priority Critical patent/JP5800258B2/ja
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Publication of JP2015062171A5 publication Critical patent/JP2015062171A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/009—Working by laser beam, e.g. welding, cutting or boring using a non-absorbing, e.g. transparent, reflective or refractive, layer on the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0093—Working by laser beam, e.g. welding, cutting or boring combined with mechanical machining or metal-working covered by other subclasses than B23K
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/206—Laser sealing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/18—Deposition of organic active material using non-liquid printing techniques, e.g. thermal transfer printing from a donor sheet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/81—Anodes
    • H10K50/814—Anodes combined with auxiliary electrodes, e.g. ITO layer combined with metal lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8051—Anodes
    • H10K59/80516—Anodes combined with auxiliary electrodes, e.g. ITO layer combined with metal lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • H10K71/211—Changing the shape of the active layer in the devices, e.g. patterning by selective transformation of an existing layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K99/00—Subject matter not provided for in other groups of this subclass

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP2014156551A 2013-08-20 2014-07-31 素子製造方法および素子製造装置 Expired - Fee Related JP5800258B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014156551A JP5800258B2 (ja) 2013-08-20 2014-07-31 素子製造方法および素子製造装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013170723 2013-08-20
JP2013170723 2013-08-20
JP2014156551A JP5800258B2 (ja) 2013-08-20 2014-07-31 素子製造方法および素子製造装置

Related Child Applications (1)

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JP2015170580A Division JP2016027571A (ja) 2013-08-20 2015-08-31 素子製造方法および素子製造装置

Publications (3)

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JP2015062171A JP2015062171A (ja) 2015-04-02
JP2015062171A5 JP2015062171A5 (enExample) 2015-05-14
JP5800258B2 true JP5800258B2 (ja) 2015-10-28

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JP2014156551A Expired - Fee Related JP5800258B2 (ja) 2013-08-20 2014-07-31 素子製造方法および素子製造装置
JP2015170580A Pending JP2016027571A (ja) 2013-08-20 2015-08-31 素子製造方法および素子製造装置

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JP2015170580A Pending JP2016027571A (ja) 2013-08-20 2015-08-31 素子製造方法および素子製造装置

Country Status (5)

Country Link
US (1) US9592572B2 (enExample)
JP (2) JP5800258B2 (enExample)
KR (1) KR20160044463A (enExample)
CN (1) CN105409329B (enExample)
WO (1) WO2015025692A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012210484B4 (de) * 2012-06-21 2017-02-02 Osram Oled Gmbh Verfahren für ein schlüssiges Verbinden eines organischen optoelektronischen Bauelementes mit einem Verbindungsstück, Verbindungsstruktur für ein kraftschlüssiges Verbinden und optoelektronische Bauelementevorrichtung
TWI634685B (zh) * 2017-05-25 2018-09-01 機光科技股份有限公司 有機發光裝置
FR3073324B1 (fr) * 2017-11-08 2019-10-25 Commissariat A L'energie Atomique Et Aux Energies Alternatives Procede utilisant un laser pour le soudage entre deux materiaux metalliques ou pour le frittage de poudre(s), application a la realisation de plaques bipolaires pour piles pemfc
JP7520486B2 (ja) * 2019-04-25 2024-07-23 大日本印刷株式会社 有機エレクトロルミネッセンス表示装置及びその製造方法
CN110571361B (zh) * 2019-09-17 2022-09-30 合肥鑫晟光电科技有限公司 有机发光显示面板及制作方法、显示装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004079325A (ja) * 2002-08-16 2004-03-11 Fuji Photo Film Co Ltd 有機電界発光素子の製造方法及び転写材料
JP4151421B2 (ja) * 2003-01-23 2008-09-17 セイコーエプソン株式会社 デバイスの製造方法
KR100635579B1 (ko) * 2004-12-20 2006-10-17 삼성에스디아이 주식회사 레이저 열 전사장치, 상기 장치를 사용하는 레이저 열전사법 및 상기 장치를 사용하는 유기전계발광표시장치제조방법
JP4340982B2 (ja) 2007-05-18 2009-10-07 ソニー株式会社 表示装置の製造方法
CN101803008B (zh) * 2007-09-07 2012-11-28 株式会社半导体能源研究所 半导体装置及其制造方法
JP2009087996A (ja) 2007-09-27 2009-04-23 Dainippon Printing Co Ltd 有機半導体素子、有機半導体素子の製造方法、有機トランジスタアレイ、およびディスプレイ
JP2011009498A (ja) 2009-06-26 2011-01-13 Dainippon Printing Co Ltd 有機エレクトロルミネッセンス素子
JP2011113936A (ja) * 2009-11-30 2011-06-09 Fujifilm Corp 光熱変換シート及び有機電界発光装置の製造方法
JP2011151195A (ja) 2010-01-21 2011-08-04 Dainippon Printing Co Ltd 有機薄膜太陽電池およびその製造方法
TWI587555B (zh) * 2013-03-29 2017-06-11 Dainippon Printing Co Ltd Component manufacturing method and component manufacturing apparatus
CN105144844B (zh) * 2013-03-29 2017-05-31 大日本印刷株式会社 元件制造方法以及元件制造装置

Also Published As

Publication number Publication date
JP2016027571A (ja) 2016-02-18
CN105409329A (zh) 2016-03-16
US20160207146A1 (en) 2016-07-21
JP2015062171A (ja) 2015-04-02
WO2015025692A1 (ja) 2015-02-26
CN105409329B (zh) 2017-10-24
KR20160044463A (ko) 2016-04-25
US9592572B2 (en) 2017-03-14

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