JP5790112B2 - Package for board holding frame and thin board - Google Patents

Description

In the present invention, a rigid rectangular substrate (rectangular shape) is placed one by one on a substrate support provided on the inner periphery of a rectangular substrate holding frame, and the substrate is placed on the substrate. The present invention relates to a storage / conveying device for use in which holding frames are stacked and stored and transported in multiple stages, and more particularly to a substrate holding frame and a package of thin plate substrates using the same.
It is necessary to prevent the stacked thin plate substrates from coming into contact with each other and to accumulate them at a high density. Furthermore, it is necessary to protect the substrate from breakage and cracking during transportation or storage, and to prevent dust contamination and contamination.
An example of the substrate is a thin glass substrate, and in particular, color filters for plasma and liquid crystal display, intermediate products thereof, and other various substrates can be exemplified.

In such a storage / transfer apparatus, the substrate holding frame, the substrate holding member that is inserted into the tip of the substrate support portion and directly placing the substrate, and the lower surface of the entire substrate holding frame stacked in multiple stages are provided. An inner pallet to be received and an anti-vibration pallet to be used at the bottom are required, and further, an upper lid and a cover for protecting the upper surface and the periphery of the substrate holding frame are required.
In particular, the present invention relates to a substrate holding frame and a thin substrate packaging body using the substrate holding frame.

Plates with functional layers on the surface of thin glass substrates, such as liquid crystal display panels, plasma display panels, and their color filters, are transported and stored without damaging or contaminating the functional layers on the surface. It is important to. When conveying such a plate-shaped object, in order to protect the functional layer on the surface of the plate-shaped object, it is necessary to store in parallel at a predetermined interval so that the front surfaces or the front surface and the back surface do not contact each other.
However, the color filter and its intermediate products, which are these thin substrates, are large in size because the display device itself is large, and even small-sized products are manufactured in a multi-faceted state. When the size is about a size, even if a glass substrate with a thickness of 0.7 mm supports two or four sides facing each other, it is inevitable that the intermediate portion is curved downward (in the direction of gravity) by about 100 mm or more. . Substrates are required to have a size of 2 square meters or more, and it is necessary to store and handle such substrates with high density and safety due to problems of storage space and handling equipment.

There exists patent document 1 which tries to convey a thin plate-shaped board | substrate, using a frame, preventing the damage | wound by an impact, etc. However, the thing of the literature is an idea of trying to prevent a vibration and an impact using a shock absorbing material between the upper and lower surfaces of the frame for glass conveyance. Foamed resin, rubber, or the like is used as the cushioning material (paragraph [0023]). When such a material is used, the cushioning material itself is considered to be a source of dust and dust. In addition, it is essential to use the contact material 6 that holds the glass substrate, and the same material is used. Another problem is that the mounting part 3 and the engaging part 4 of Patent Document 1 are on the same surface, so that when the frame bodies 1 on which the glass substrates are stacked are stacked, the frame bodies are slightly displaced when the positions of the frame bodies are shifted. There is a problem that the mounting portion 3 and the engaging portion 4 are deformed or damaged due to the weight of 1, and the glass substrate is damaged due to a stacking fault or vibration during transportation.

Patent Document 2 discloses a technique in which thin plate-like substrates are stacked and conveyed in a curved state using a frame. However, this also requires the use of the cushioning material 7 and the contact material 6, and since foamed resin, rubber or the like is used for this (paragraph [0020]), generation of dust or the like is inevitable.
In addition, since the alignment between the upper and lower frames is performed by the engaging convex portion 9a and the engaging concave portion 9b, dust easily collects in such a portion, and it is considered that there is a problem in cleaning this portion. . Also in patent document 2, since the structure of the mounting part 3 and the engagement convex part 9a exists in the same surface similarly to patent document 1, there exists a problem of a deformation | transformation or damage of an engagement part.

Patent Document 3 and Patent Document 4 also outline examples of various forms of trays for holding plate-like objects. However, the structure of the frame is different from that of the present application.
Note that Patent Document 5 and Patent Document 6 are examples of a plate-like object conveying method, a conveying device, and the like.

JP 2006-168748 A JP 2006-168749 A JP 2008-30818 A JP 2008-68902 A JP 2008-81269 A JP 2008-81270 A

Under such circumstances, in recent years, particularly in the flat panel for liquid crystal display, it is required to manufacture a larger color filter forming substrate, and further to the transport and storage device for the color filter substrate and its intermediate process substrate. There is a need for further reductions in transportation costs by improving transportation efficiency, saving storage space, and safe handling of intermediate products.
Incidentally, the substrate referred to as the eighth generation has a size of 2200 mm × 2500 mm, and the ninth generation has a size of 2400 mm × 2800 mm.

A glass material having a certain rigidity is used for the color filter substrate, but it is originally a thin plate material. With the demand for an increase in the size of display devices and the increase in the number of facets, the size of the glass substrate has increased. When both sides are supported, the actual situation is that considerable deflection occurs in the central portion.
When large size glass is stored in a flat state and vibrations are applied during transportation, the substrate undulates and jumps up and down about several hundred mm, and contact damage occurs between the substrates unless the storage interval is very large. Alternatively, the glass itself jumps up and down by several hundred mm due to vibration and breaks down while it is deformed.
Accumulating and transporting and storing such glass substrates at a high density not only saves storage space, but also prevents the handling equipment and transport equipment from becoming large, thus saving resources. This will contribute to the reduction of manufacturing costs.
Conventionally, in the substrate holding frame that has been used, there has been a problem that the alignment portion between the frames is likely to be deformed during stacking and taking-out operations, and the glass substrate is easily damaged due to impact during stacking or transportation. . Further, generation of dust from the apparatus itself or mixing from the outside causes damage to the functional layer and increases defective products, so strict measures are required.
The glass substrate of the sixth generation (G6) is generally 0.7 mmt 1500 mm × 1850 mm, the weight of one sheet is 5 kg, and the deflection amount is about 350 mm when both ends are supported.
In addition to this, the thickness of the sixth generation (G6) glass substrate includes thin plates such as 0.4 mmt and 0.5 mmt and thick plates such as 1.1 mm and 1.6 mmt. There are also 1500mm * 1800mm in the external size.
In order to increase production efficiency and transport efficiency, a space-saving substrate storage device and transport device for storing and transporting such large glass substrates in large quantities are required. On the other hand, if even one large glass substrate breaks during transportation or handling, glass fragments adhere to other glass substrates, or other glass breaks due to glass substrates with glass fragments adhering to the equipment. Damage to the device, damage to expensive masks and jigs used in the process, and secondary loss occur.
In addition, in order to prevent secondary damage due to the breakage of one glass substrate, if the glass substrate breaks, the production is interrupted and thorough cleaning such as equipment and jigs is necessary. Loss due to breakage is enormous.
Even if the glass substrate is not damaged, even if the periphery of the glass substrate is scratched, damage may occur due to stress on the glass substrate such as contact in the subsequent process or heat treatment, so a large glass substrate It is an absolute requirement that even one sheet is not damaged.
The present invention has been completed through intensive research to solve such problems.

The first of the gist of the present invention for solving the above problems is that one of the rectangular thin plate substrates is housed in a substrate holding frame having a rectangular metal frame portion in a plan view, and the thin plate substrate is housed. A frame for holding a substrate for use in transportation or storage in a state where the frames are aligned and stacked in multiple stages, and (1) a metal frame having a square or rectangular cross-sectional shape; ) A first fitting portion 12a provided inclined from the upper surface of the metal frame portion to the lower side of the inner periphery, and a substrate support portion formed to extend further forward; and (3) from the lower surface of the metal frame portion A substrate holding frame having a thin plate substrate placed on the substrate support portion, and a second fitting portion 12b provided on the lower side of the inner periphery. By fitting the fitting part 12b, the upper and lower metal frame parts can be aligned and stacked in multiple stages. Substrate holding frame, characterized in that the. It is in.
In this invention, a thin plate substrate is placed on a substrate holding frame, the frame in the loaded state can be stacked in multiple stages without contact between the thin plate substrates, and the fitting portion is placed on the metal frame itself. Rather, it is formed on the inner circumference side of the metal frame that does not directly receive the load of the substrate holding frame itself or the thin plate substrate, and the sealed state is secured to prevent the entry of dust etc. is there.

The second of the gist of the present invention for solving the above problem is that one of the rectangular thin plate substrates is housed in a substrate holding frame body having a metal frame portion having a rectangular shape in plan view, and the thin plate substrate is housed. A frame for holding a substrate for use in transportation or storage in a state where the frames are aligned and stacked in multiple stages, and (1) a metal frame having a square or rectangular cross-sectional shape; ) A first fitting portion 12a provided inclined from the lower surface of the metal frame portion toward the inner peripheral lower side, and a substrate support portion formed to extend further forward; and (3) from the upper surface of the metal frame portion. A substrate holding frame having a thin plate substrate placed on the substrate support portion, and a second fitting portion 12b provided on the lower side of the inner periphery. By fitting the fitting part 12b, the upper and lower metal frame parts can be aligned and stacked in multiple stages. Substrate holding frame, characterized in that the. It is in.
In this invention, the thin plate substrate is placed on the substrate holding frame, the frame in the loaded state can be stacked in multiple stages without contact between the thin plate substrates, and the fitting portion is attached to the metal frame portion itself. Rather, it is formed on the inner circumference side of the metal frame that does not directly receive the load of the substrate holding frame itself or the thin plate substrate, and the sealed state is secured to prevent the entry of dust etc. is there.
The structure itself is the same as the substrate holding frame of the first invention, but in the substrate holding frame of the second invention, the substrate support part extends from the lower surface of the metal frame to the tip of the fitting part, There is a difference that other fitting portions protrude from the upper surface of the metal frame.
In the following description, the substrate holding frame may be simply referred to as “frame” in the specification.

The third of the gist of the present invention for solving the above-mentioned problems is that the thin plate substrate is sealed in the above-mentioned substrate holding frame by close fitting of the metal frame portion surface between each frame and fitting of the fitting portion. The upper lid fitting part is fitted to the fitting part of the uppermost substrate holding frame so that the surface is sealed and the upper lid is not in contact with the thin plate substrate. A thin plate substrate characterized in that the fitting portion of the inner pallet is fitted to the fitting portion of the substrate holding frame so that the surface is sealed and the surface of the inner pallet is not in contact with the thin plate substrate. It is in the package.
The present invention relates to a use state of the substrate holding frame. Stacked in multiple stages with thin substrates placed on the substrate holding frame, using an upper lid at the top and an inner pallet at the bottom, and the upper lid and inner pallet both prevent contact with the substrate. This is characterized by the prevention of mixing dust and the like in a substantially sealed state.

According to the substrate holding frame of the present invention, one surface of a thin plate substrate provided with a functional portion is not in contact with the other surface, and is securely stored and transported while maintaining a certain distance between the substrates. can do. In addition, the substrate does not jump or receive an impact due to vibration during transportation, and does not break or damage. Dust and foreign matter are not generated from the substrate holding frame itself, and the frames can be stacked in multiple layers so that dust does not enter from the outside.
In the configuration of the substrate holding frame of the present invention, the metal frame portion has a simple square or rectangular cross-sectional shape, and is a first fitting portion (and a substrate support portion formed by extending further ahead). And the 2nd fitting part has the structure protruded from the said metal frame part.
Only the role responsible for the strength and accuracy of the substrate holding frame itself is given to the metal frame. And, the fitting function and the glass holding function at the time of laminating the metal holding frame body are the first fitting part protruding from the metal frame part (and the substrate support part formed to extend further ahead), and The second fitting portion is borne. This makes it possible to solve the problems of work accuracy, handling strength, prevention of deformation due to heavy weight during stacking, and stability against load collapse during stacking, which are serious problems with large substrate holding frames. It was.
When the fitting portion is provided in the metal frame itself, the processing accuracy of the frame itself is lowered, and when it is a large metal frame, it is twisted and distorted and cannot be stacked. In the present invention, the first fitting part (and the board support part formed extending further ahead) and the second fitting part have a structure protruding from the metal frame part, and the metal frame body is simply Because it has a square or rectangular cross-sectional structure, a large frame can be made with high accuracy.
Further, when the substrate holding frame is handled by a robot or the like with a large and heavy glass such as G6 size, it is necessary to prevent the glass from being damaged due to deformation or twisting of the substrate holding frame. In the present invention, the metal frame portion has a function of purely taking strength as a simple square or rectangular cross-sectional shape to prevent deformation and twisting during handling. (In the structure in which the metal frame main body is provided with a fitting portion, that portion becomes a weak point in strength.)
When 150 layers are laminated with glass held on the substrate holding frame during use, the weight applied to the lowermost substrate holding frame is 1.5 tons or more for the G6 size. Since the upper surface of the lower metal frame and the lower surface of the upper metal frame are in horizontal contact with each other between the laminated metal frames of the present invention, the large weight of 1.5 tons or more can be stably supported. , No collapse of the load or deformation due to the weight of the metal frame.

The fitting part is not on the metal frame itself, but on the inner circumference side of the metal frame part that does not directly receive the load of the frame itself or the thin plate substrate. The joint is difficult to deform and alignment is less likely to be incomplete.
Since the fitting portion has a surface inclined in the inner circumferential direction of the frame portion, even when the fitting portion is slightly displaced and overlapped, a self-adjustment (self-alignment) function works, and correct alignment is easily performed. Further, since the fitting portion is provided on the inner periphery of the metal frame portion, the planar size of the substrate holding frame can be reduced, and the transport device can be reduced in size and space can be saved.
In the case where the cross-sectional shape of the metal frame portion is a square or rectangular hollow structure, it has strength compared to the case of using a solid material, is lighter, and can reduce the load of conveyance.

  According to the thin substrate packaging body of the present invention, the thin substrates are not brought into contact with each other and can be safely transported without being damaged. Moreover, since the package is sealed, dust and foreign substances are not mixed from the outside.

It is the top view which looked at the frame for substrate maintenance from the upper surface. It is sectional drawing of the metal frame part and fitting part of the left side which laminated | stacked the board | substrate holding frame in 3 steps | paragraphs, and a board | substrate support part. FIG. 3 is a cross-sectional view of a state in which a substrate holding member is mounted on the substrate support portion of FIG. 2 and a thin plate substrate is placed, and then substrate holding frames are stacked in three stages. It is a figure explaining the outline of the apparatus which transfers a thin-plate board | substrate to the frame for board | substrate holding | maintenance. It is a figure explaining the height position when a lift pin protrudes. It is a figure which shows the state at the time of transfer of a thin board | substrate (at the time of delivery). It is a figure which shows the state at the time of transfer of a thin board | substrate (at the time of reception). It is a figure which shows the relationship of each magnitude | size of the opening of a board | substrate holding frame, a thin-plate board | substrate, and the mount for transfer. It is a figure explaining the various of a lift pin. It is a perspective view which shows the external appearance of the frame for board | substrate holding | maintenance. It is an external appearance perspective view of the state which mounts a thin-plate board | substrate on the board | substrate holding frame. It is a perspective view which shows the state which puts a thin board | substrate on the board | substrate holding | maintenance frame body, covers the upper cover in the state which laminated | stacked the frame body in multiple steps, and attaches an inner pallet and a vibration isolating pallet to the lower side. It is a perspective view which shows the state which packed the board | substrate holding frame and the inner pallet with the binding material.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. For easy understanding, a thin plate using a substrate holding frame will be described before describing the substrate holding frame of the present invention in detail. The whole substrate transport / storage device, that is, a thin substrate packaging will be described.

FIG. 10 is a perspective view showing the appearance of the substrate holding frame. The substrate holding frame 10 is a rectangular frame in plan view, but in the perspective view, the substrate is a frame whose center is curved downward (in the direction of gravity). On the four sides, there are frame-shaped metal frame portions 11 (consisting of 11a, 11b, 11c, and 11d). The metal frame portion 11 is a structural member that supports the entire weight of the substrate holding frame body 10 and the thin plate substrate stacked in multiple stages.
The left and right sides 11a and 11b of the metal frame 11 are flat linear metal frames, but the front and rear sides 11c and 11d are curved downward. Here, the front and rear and the left and right sides of the frame body may originally be either the front or back or the left and right sides, but in this specification, the two sides on which the long side of the rectangular substrate is placed for easy distinction. Are the left and right sides.

A fitting portion and a substrate support portion 13 having a constant width are formed to extend on the inner peripheral side of the upper surface of the metal frame portion 11. Although not shown in FIG. 10, a fitting portion is formed along the inner periphery of the lower surface (see FIGS. 1 and 2). The substrate support portion 13 and the fitting portion are made of the same material as the metal frame portion 11.
A resin substrate holding member 14 is attached to the substrate support portion 13 so as to cover the metal surface at regular intervals. In some cases, the substrate holding member 14 is provided with cutouts or punched holes at regular intervals in the substrate support portion 13 and attached to the cutout portion. In this case, the substrate support portion 13 including the substrate holding member 14 is provided. Extends to the inner circumference side with a constant width. However, the substrate holding member 14 may be continuously attached in a band shape without a constant interval.
A central region K surrounded by the substrate support member 3 is an empty opening (space region).

FIG. 11 is an external perspective view of a state in which the thin plate substrate is placed on the substrate holding frame.
When placing the thin plate substrate A on the substrate holding frame 10, the thin plate substrate A may be lowered and placed on the substrate holding frame 10 in a stationary state. In general, a method is used in which the thin substrate A is temporarily stopped on the gantry and the substrate holding frame 10 is lifted from below the gantry and the thin substrate A is placed so as to scoop up.
The thin plate substrate A is placed in contact with the surface of the substrate holding member 14. At this time, the functional layer surface is the upper surface and is not in contact with the surface of the substrate holding member 14 of the substrate holding frame 10 placed on the upper stage.

FIG. 12 is a perspective view showing a state in which a thin plate substrate is placed on the substrate holding frame 10, the frames are stacked in multiple stages, an upper lid is covered, and an inner pallet and an anti-vibration pallet are applied to the lower side.
By sequentially stacking the substrate holding frame 10 on the other substrate holding frame 10 on which the thin plate substrate A is already placed, the multi-layer stack 100 of frames can be obtained. The upper and lower frames are stacked such that the upper surface of the fitting portion close to the metal frame portion 11 of the substrate support portion 13 of the lower substrate holding frame 10 and the lower surface of the fitting portion of the upper substrate holding frame 10. By engaging, it is fitted and alignment is performed reliably.

  The inner pallet 30 has a metal or resin surface plate that is shaped to match the curved surface of the substrate so as not to contact the thin plate substrate A mounted on the lowermost stage. Further, the total weight of the frames stacked in multiple stages and the thin plate substrate A is received by the four sides of the pallet. As in the case of the frame, consideration is given not to generate dust or the like. In order to obtain a sealing structure, the lower part of the board holding frame 10 has a fitting part of the pallet itself that is fitted to the lower surface fitting part.

The anti-vibration pallet 40 is for suppressing vibrations and the like that are exerted on the substrate during conveyance. In general, vibration-proof rubber is used to cushion vibration and impact during transportation and cargo handling. A commercially available product may be used as long as it does not generate dust or foreign matter.
As the upper lid 20, one having a surface plate 21 curved downward in accordance with the bending shape of the thin plate substrate A is used. For this purpose, it is preferable to use a strong metal or resin material so as to withstand impacts from above. Moreover, in order to set it as the sealing structure, it is set as the structure which has a fitting part also in the upper cover 20 itself so that it may fit with the upper surface of the uppermost board | substrate holding frame 10. FIG. More preferably, a binding mechanism 22 and a binding belt 23 are provided.

  FIG. 13 is a perspective view showing a state in which the substrate holding frame and the inner pallet are packed with a binding material. The stacked body 100 of the substrate holding frame 10 is sandwiched between the upper lid 20 and the inner pallet 30 and is bound using the binding mechanism 22 and the binding belt 23. A package is completed by covering an outer cover (not shown). It can be stored in this state, and can also be transported as cargo or air mail.

  Since the present application relates to the substrate holding frame and the thin package of the thin plate using the substrate holding frame in the overall description of the thin plate substrate transfer / storage device described above, the substrate holding frame 10 and its use will be described below. The method will be described in detail.

FIG. 1 is a plan view of the substrate holding frame as viewed from above.
As shown in FIG. 1, the outer shape of the substrate holding frame 10 when viewed in a planar state is a rectangular shape in which the shape of the thin plate substrate A is enlarged approximately in proportion. However, in the metal frame portion 11, the left and right frame portions 11a and 11b are linear parallel frames, whereas the front and rear frame portions 11c and 11d are curved.
A handle 15 is formed outside the left and right metal frame portions 11a and 11b. The handle portion 15 is a portion that is gripped by a robot arm or the like, and need not be provided along the entire length of the side, and may be of a partial length.

The substrate holding frame 10 uses a metal material having structural strength for the frame member. This is because it is necessary to withstand the total load of the substrate holding frame 10 itself and the thin plate substrate A. For example, in the case of the sixth generation (0.7 mmt 1500 mm × 1850 mm), one glass substrate is 5 kg, and the substrate holding frame is 5.5 kg. Become. As described above in paragraph [0009], the glass that is said to be the sixth generation has a slightly different size and thickness, and of course, the weight of the glass substrate and the weight of the substrate holding frame 10 are also included. Slightly different, total weight will also change.
From the upper surface of the metal frame part 11, the board | substrate support part 13 of a fixed width is extended and formed toward the inner peripheral side. A portion along the metal frame portion 11 of the substrate support portion 13 is the upper first fitting portion 12a, and is an inclined surface that can be fitted into the lower second fitting portion. In addition, the 1st fitting part means what the board | substrate support part 13 extended ahead, and the 2nd fitting part shall mean what consists only of the protrusion piece for a fitting. A fitting portion is formed on the lower surface of the metal frame portion 11 along the inclined surface, but is not shown in FIG. 1 (see FIG. 2 or FIG. 3).
The fitting portion is preferably provided on all four sides or at least three sides. This is because the front, rear, left and right of the frame 10 are aligned.

A resin substrate holding member 14 is attached to the substrate support portion 13 so as to cover the metal surface of the substrate support portion 13 at regular intervals. This is because a thin plate representative of glass is less likely to be damaged when subjected to an impact if it is in contact with a resin material that is an elastic body rather than a metal surface.
About 5 to 20 substrate holding members 14 are mounted on one side, depending on their dimensions. In the case of FIG. 1, six on each of the left and right sides and six on each of the front and rear sides are mounted. Accordingly, the single substrate holding member 14 has a width of about 5 to 10 cm and a length of about 10 to 25 cm. However, as described above, the substrate holding member 14 may not be mounted at intervals.
A region K surrounded by the substrate support 13 and the substrate holding member 14 is an opening region. The thin plate substrate A is placed over the entire region and the substrate holding member surface 14.

FIG. 2 is a cross-sectional view of the metal frame portion and the fitting portion on the left side in which the substrate holding frame bodies are stacked in three stages, and the substrate support portion. Although the right side has a symmetric cross-sectional shape, it is not shown. The three stages are examples, and the number of stages is actually increased.
A material such as aluminum or an aluminum alloy is used for the metal frame portion 11 for the purpose of weight reduction. As shown in the figure, the cross section is rectangular or square, and a hollow structure can be suitably employed.
A handle portion 15 serving as a handle portion of a robot arm or the like extends outward with a constant width as a smooth surface parallel to the upper surface of the metal frame portion 11. The reason for making the surface smooth is from the problems of preventing dust generation and easy cleaning.

In the case of FIG. 2, the substrate support portion 13 is provided extending from the upper surface of the metal frame 11, but may be extended from the lower surface side to serve as the substrate support portion 13. A portion along the metal frame of the substrate support portion 13 is a first fitting portion 12a. The second fitting portion 12 b is provided as a protruding piece that extends short from the lower surface of the metal frame 11. When the substrate support portion 13 is on the lower side, the protruding piece protrudes from the upper surface side. In the substrate holding frame of claim 1, the substrate support portion 13 extends from the upper side, and in the substrate holding frame of claim 2, the substrate support portion 13 extends from the lower side, and the fitting projection piece is reversed. It is a difference that only becomes the position. The figure shows only that of claim 1.
In both cases, the effect is not so much changed, but it is considered that the case where the substrate support portion 13 is the upper surface can reduce the fall of dust onto the thin substrate.

  The substrate support portion 13 is provided with a constant width H1. H1 is about 6 to 15 cm. The substrate support portions 13a and 13b provided on the left and right metal frame portions 11a and 11b are bent downward at an angle α. In the case of a 6th generation glass having a thickness of 0.7 mm, it is preferable that the amount of bending from both ends is about 100 mm to 120 mm at the deepest bent central portion. In this case, the angle α is in the range of about 5 degrees to 25 degrees. Substrate support portions 13c and 13d are also provided on the front and rear metal frame portions 11c and 11d. Since the metal frame portions 11c and 11d are curved, the length direction follows the bending shape. A slight bending is sufficient.

In the case of FIG. 2, the second fitting portion 12 b is formed by being inclined and bent from the lower side of the metal frame portion 11. Thus, the fitting part 12b is formed not on the metal frame part 11 itself but on the inner peripheral part of the frame part 11 that does not directly receive the load of the frame itself or the substrate. As described above in paragraph [0004], even when the frames are mistakenly shifted and overlapped, deformation of the fitting portion (engagement portion) in Patent Literature 1 and Patent Literature 2 can be prevented.
A first fitting portion 12 a is formed at a portion along the metal frame portion 11. This portion is similarly inclined downward so as to match the shape of the second fitting portion 12b. By the fitting of the lower surface of the second fitting portion 12b and the upper surface of the first fitting portion 12a, the upper and lower substrate holding frames 10 are aligned with each other. Thus, it is preferable to form the fitting parts 12a and 12b in the inner peripheral part which does not receive the load of the metal frame part 11 itself, when a frame body is stacked in multiple stages.
In addition, in the case of Claim 2, since the board | substrate support part 13 is extended and formed from the 1st fitting part 12a of the lower side, by fitting of the 1st fitting part 12a and the 2nd fitting part 12b, Positioning between the upper and lower substrate holding frames 10 is performed.

The angle β of the inclined surface of the fitting portion with respect to the horizontal plane of the metal frame is about 5 degrees to 45 degrees, more preferably 10 degrees to 20 degrees. Further, the width h of the hypotenuse is about 5 mm to 20 mm. By providing an appropriate inclination, even if a slight misalignment occurs, a function of fitting with the load and adjusting the position (self-alignment) occurs.
The upper and lower surfaces of the metal frame portion 11 are made smooth surface finish, and the fitting portions 12a and 12b and the upper and lower surfaces of the substrate support portion along the metal frame 11 are correctly aligned and stacked, so that the interval d between the frames is increased. In addition, the inside can be made substantially sealed.

FIG. 3 is a left-end cross-sectional view of a state in which a substrate holding member is mounted on the substrate support portion of FIG. 2 and a thin plate substrate is placed, and then the substrate holding frames are stacked in three stages.
A substrate holding member 14 is mounted on the surface of the substrate support portion 13. It is preferable that at least the front end side (the side looking into the opening K) of the substrate holding member 14 is formed thin. This is because if it is thick, the gap between the upper and lower substrate holding frames is narrowed. However, it is preferable that the rear end 14a of the substrate holding member 14 is made thick so as to be close to the gap width between the substrate support portions so as to perform the function of suppressing the displacement due to the back-and-forth and right-and-left swing of the thin substrate A.

  Various methods can be used for mounting the substrate holding member 14 to the substrate support portion 13. The structure is such that the vicinity of the front end (side facing the opening K) of the substrate holding member 14 can be opened and closed in a hinge-like manner, and at the rear end (metal frame side), the front and back pieces are passed through several small holes provided in the substrate support section. They may be fitted together. Alternatively, as described above, the substrate support portion 13 is provided with notches and punched holes having a shape smaller and proportional to the substrate holding member 14, and the slide grooves formed on the rear end and the left and right side surfaces of the thin substrate holding member 14 It can also be inserted into a notch or punch hole. In any case, it is necessary to have a structure that does not easily fall off and does not generate dust or the like.

In the case of FIG. 3, the substrate holding member 14 is fitted and fixed to the substrate support portion 13 by a complicated structure, but the detailed structure is not shown in the drawing. Further, the thickest rear end portion 14f of the substrate holding member 14 serves as a stopper that stops the thin substrate A from swinging. Such a structure of the substrate holding member 14 can suppress the swing of the thin plate substrate A within a certain range. In FIG. 3, the upper thin plate substrate A1 is in contact with the rearmost end portion 14f, and the lower thin plate substrate A2 is on the right side.
When the swing range of the thin plate substrate A is ± 5 mm, the distance between the left and right stoppers 14f along the bending curve can be set to the width of the thin plate substrate A + 10 mm.

  In the case of FIG. 2, the step pitch interval d can be set to 5 mm to 20 mm with a glass substrate (thickness, 0.7 mm) having a size of 1500 mm × 1850 mm. If the size of the thin plate substrate is further increased or the plate thickness is reduced, the amount of bending increases, but if the degree of bending is constant (there is no variation within the same product type), the amount of bending becomes uniform. The same step pitch interval can be adopted. However, as the size and thickness of the plate are increased, the swinging and vertical splashing when subjected to an impact, vibration, and the like increase, so the interval needs to be considered in that case.

As shown in FIG. 1, the four corners of the metal frame portion 11 can be connected by fitting a corner piece 16 made of resin or the like into the end portion, but may be joined by welding or the like if possible. In the case of a corner piece, care is taken so that the connecting portion with the metal frame portion 11 is connected smoothly.
The metal frame portion 11 inserted into the corner piece 16 is cut or pressed to be thinned so that no step is generated between the surface of the corner piece 16 and the surface of the metal frame portion 11.
It is preferable to form front and back fitting grooves in the corner piece 16 itself. The metal frame 11 and the corner piece 16 are firmly fixed with bolts and nuts so that the angles of the two sides are maintained at right angles.
In the claims, the substrate to be stored is a thin plate substrate. Typically, however, there are various types of substrates and intermediate products in which a thin glass substrate, a thin plastic substrate, or a functional layer for a display device is provided. It is clear what is targeted.

(Embodiments related to materials and manufacturing method)
As the material used for the metal frame 11, a metal material that is lightweight and does not cause corrosion can be used. Specifically, aluminum alloys such as pure aluminum, duralumin (aluminum, copper (3.5 to 5.5%), magnesium), and aluminum-manganese can be used. These materials can be hollow extruded to produce a frame shape.
The substrate holding member 14 includes a polyolefin resin material such as polyethylene and polypropylene, a polyamide resin such as ultra high molecular weight polyethylene (UHMW-PE), nylon 66 and nylon 610, polyethylene terephthalate (PET), polyimide, polyetheretherketone ( Materials such as PEEK) can be used. These materials can be manufactured by injection molding using a mold.
The corner piece 16 can be manufactured by processing the same material as the substrate holding member 14 in the same manner.

  Next, with reference to FIG. 4 to FIG. 9, a description will be given of an apparatus and its operation when a thin plate substrate A which is a finished product or an intermediate product discharged from the manufacturing apparatus is transferred to the substrate holding frame 10. And

4A and 4B are diagrams for explaining the outline of an apparatus for transferring a thin plate substrate to a substrate holding frame, in which FIG. 4A is a plan view and FIG. 4B is a front view.
As shown in FIG. 4A, when the thin substrate A is transferred (delivered and received) to the substrate holding frame 10, a transfer stand 50 and a robot arm (not shown) are used in FIG.
The transfer stand 50 is a stand having a substantially rectangular shape in plan view and having a size that allows the thin plate substrate A to be placed thereon. The substantially rectangular shape is a rotating shaft W (W1, W2,... Wn) for transporting the thin plate substrate A, a rotating wheel sw attached thereto, a rotating bearing J, and a number of lift pins P for moving the thin plate substrate A up and down. This is because it has (p1, p2,... Pn) and their drive mechanisms and does not have a clear outer shape like a table.
A plurality of rotating wheels sw are attached to each rotating shaft W for transporting the thin plate substrate A, and a surface connecting apexes (uppermost surface) of each rotating wheel sw forms a horizontal plane.

  The outer shape of the transfer platform 50 needs to be smaller than an opening K (indicated by a broken line in FIG. 4) formed by being surrounded by the substrate support portion 13 of the substrate holding frame 10. When transferring the thin substrate A, it is necessary to prepare the substrate holding frame 10 that is empty (no substrate is mounted) around the lower surface of the frame through the transfer frame 50. This is because it is necessary to pass the gantry 50 through the opening K of the substrate holding frame 10.

A large number of rotation axes W are arranged perpendicular to the transport direction of the thin plate substrate A. The thin plate substrate A (shown by a one-dot chain line in FIG. 4) that has been processed by the manufacturing apparatus 90 in the previous process is placed on the rotating wheel sw of the rotating shaft and is smoothly discharged onto the gantry surface. Accordingly, the rotating wheel sw rotates at a constant speed and carries the substrate in the arrow Y direction. A material such as ultra high molecular weight polyethylene is used for the surface of the rotating wheel sw that contacts the substrate A. This is to reduce wear and the like.
On the surface of the transfer platform 50, the thin plate substrate A must stop at a position where both the left and right and front and rear sides protrude outward from the platform 50. This is because when the frame 10 under the substrate A is raised, the substrate A needs to be struck by the substrate support portion 13 of the frame 10.
Therefore, the transfer platform 50 may be provided with a position inspection device and a position correction device for the thin plate substrate A.
Since the connecting portion between the manufacturing apparatus 90 and the transfer platform 50 in the previous process passes the rear side 11d of the substrate holding frame 10 at the time of transfer, the rotation axis W is set at a predetermined width interval so that the rotation axis W When 10 passes, it is structured to be retractable.

Further, the transfer platform 50 is vertically and horizontally aligned with lift pins P (p1, p2,... Pn) which can be curved when the thin plate substrate A is transferred. Is provided. When the thin plate substrate A is moving on the rotating wheel sw, the lift pin P is in a standby state so as not to protrude from the horizontal plane formed by the top of the wheel (see FIG. 4B).
In FIG. 4, four lift pins are arranged in one row (in the left-right direction), but the number of pins can be freely set as long as necessary. However, a total of three, one at the lowest center and two on the left and right, is necessary, and can be increased to about ten. At the time of transfer, the first row (lower side in FIG. 4 (A)) is used to raise the thin plate substrate A so that the left side edge and the right side edge are raised high and the center part is bent downward (gravity direction). The p2 and p3 pins are at the lowest position and the lift pins at p1 and p4 are raised to the highest position. Even if the lift pins P are not used, the transfer to the substrate holding frame 10 can be performed, but if the substrate A in a flat state is suddenly bent, a sudden stress change is applied, and cracks and the like are likely to occur. Because. The pin height will be described in detail later.

Since the lift pins of p2 and p3 are at the lowest position, it is not necessary to protrude so much from the surface of the gantry 50 at the time of transfer.
As the pins of p2 and p3, a pin having a hemispherical tip is used, but a pin that is adsorbed by negative pressure may be used. Since the pins near the left and right ends tend to bend the thin substrate A and easily rub the back surface with the operation, it is preferable to use pins that lift and hold the substrate in a non-contact manner by pressurized air. However, it is possible to use a lift pin loaded with a rotatable sphere at the tip of the pin without using air pressure.

If air pressure is not used, the lift pin P may be a simple straight rod with a small diameter (about 5 mm to 50 mm) made of metal or resin with a hemispherical tip, but if air pressure is used, it is connected to the pump. Piping is necessary. In either case, the lift pins P at the left and right symmetrical positions with respect to the center line of the substrate are paired and adjusted to the same rising height.
In FIG. 4B, each pipe or rod connected to the lift pin P is connected to a drive mechanism such as a servo cylinder. In the figure, the piping and the like are schematically shown, and do not show the actual structure.

FIG. 5 is a diagram illustrating the height position when the lift pin protrudes.
As mentioned above, the lift pins of p2 and p3 are brought to the lowest position, and the pins of p1 and p4 are raised to the highest position.
Of course, following the first row of pins, the subsequent pin rows are also adjusted to substantially the same height in principle. A line L connecting the vertices of the lift pins p1 to p4 has a shape that substantially matches the curved shape of the thin plate substrate A when the thin plate substrate A is supported by the substrate holding frame 10. At the time of transfer, control is performed so that each pin protrudes to a preset height position. At this time, the lift pins that are symmetrical with respect to the left and right center line of the substrate A are controlled to have the same height.

FIG. 6 is a view showing a state when the thin plate substrate is transferred (during delivery).
The robot arm is stacked below the surface of the gantry 50 on the surface of the gantry 50 with respect to the thin plate substrate A (FIG. 6A) which is raised to a predetermined height by the lift pins P from the surface of the gantry 50 for transfer. The substrate holding frame 10 is lifted while holding the handle 15.
The thin plate substrate A is accommodated in the frame 10 in a state of being held by the substrate support portion 13 of the substrate holding frame 10 (FIG. 6B). Thereafter, the robot arm transports the substrate A to a predetermined place. Each lift pin P sinks below the surface of the transfer platform 50, and the next thin plate substrate A is carried by the rotating wheel sw (FIG. 6C).

FIG. 7 is a diagram illustrating a state when the thin plate substrate is transferred (received).
At the time of receiving, contrary to the time of delivery, the thin plate substrate A housed in a bent state in the substrate holding frame 10 is carried onto the mount 50 (FIG. 7A). The thin substrate A is received on the lift pins P that stand by protruding to a preset height position (FIG. 7B).
The robot arm once falls below the surface of the transfer platform 50 in a state where the handle 15 of the frame 10 that has been emptied is gripped.
The lift pins that have received the substrate settle below the surface of the transfer platform 50 (FIG. 7C). The thin plate substrate A placed on the surface of the rotating wheel sw is transported to the manufacturing apparatus for the next process.
Thereafter, the robot arm stacks the empty frame body as it is under the surface of the gantry 50 or grips it and moves up again to transport it to other necessary places.

FIG. 8 is a diagram illustrating the relationship in size between the opening of the substrate holding frame, the thin plate substrate, and the transfer platform.
As is clear from the above description, the relationship among the sizes (planar outlines) of the opening K of the substrate holding frame 10, the thin substrate A, and the transfer platform 50 is as shown in FIG. That is, the planar outer shape of the thin plate substrate A is the maximum, the next is the size of the opening K, and the transfer platform 50 must be the minimum. However, the outer shape of the substrate holding frame 10 is naturally larger than that of the thin plate substrate A. The substrate holding frame 10 placed on the transfer stand 50 is placed around the transfer stand 50 and below the surface of the stand.
Further, the robot arm grips the substrate holding frame 10 with the handle portions of the left and right sides 11a and 11b, and immediately after the robot arm is placed on the lift pins P and flattened on the pedestal surface, The rear (next process device) side is structured so as not to obstruct the passage of the thin plate substrate A.

FIG. 9 is a diagram for explaining various types of lift pins.
FIG. 9A shows a simple straight bar-like shape made of metal or resin having a hemispherical tip 2 and having a small diameter. The sectional diameter of the lift pin P is preferably about 5 mm to 50 mm. The material is preferably stainless steel, resin, ultra high molecular weight polyethylene, or the like. In particular, a material that does not damage the substrate is selected.
FIG. 9B shows a pin shape having a minute rotating sphere 3 at the tip. The rotating sphere 3 rotated by the ball bearing is fixed by the fixing portion 31 and connected to the shaft body 32. A material such as polyether ether ketone (PEEK) is used as the material of the rotating sphere 3.

FIG. 9C is a pin that uses air pressure, and has a purpose of adsorption and a purpose of non-contact support. Both have a small opening 4 at the tip. In the case of the suction purpose, it is used for the purpose of fixing the thin plate substrate A at the time of transfer, and the pipe piping is connected to a vacuum pump.
In the case of aiming at non-contact support, the purpose is to support the substrate A in a non-contact manner from the opening 4 by blowing out air from the tip, and the pipe piping is connected to a pressure pump. The non-contact support state is continued until the substrate A is accommodated in the frame.
As shown in FIG. 9 (D), the substrate A tends to slip near the left and right ends of the thin substrate A, and therefore the rotating sphere 3 is provided, and the tip end of the pin is placed inside so as to support the substrate A surface at a right angle. It is also preferable to use a bent one.

The robot arm has a structure capable of gripping the handle 15 of the large substrate holding frame 10. The robot arm can freely expand and contract, move up and down, and rotate.
First, the stacked substrate holding frames 10 are transported to the first position in units of one to several stages (5 to 6 sheets), and the bottom surface of the frame 10 is opened from the surface through the transfer platform 50 through the opening K of the frame 10. Place it so that it is located in Since the frame body 10 is carried in a flat state, if the lowermost handle portion is gripped, it can be moved in units of several steps.
Next, in the above-described operation, the thin plate substrates A on the transfer platform 50 are placed on the stacked frame body 10 in units of one sheet, carried to the second position, and stacked. Depending on the purpose, the multi-stage stack 100 of frames is packed for storage and transportation, or supplied for use in the next process.

A substrate holding frame 10 having a size of 1500 mm × 1850 mm was manufactured using an aluminum alloy material. First, a metal frame having a cross-sectional shape shown in FIG. 2 was manufactured by hollow extrusion.
The left and right metal frame portions 11a and 11b were used as they were, but the front and rear metal frame portions 11c and 11d were subjected to bending after being extruded. The bending amount D was set to 100 mm to 150 mm. The thickness (step pitch) d of the metal frame portion 11 was 10 mm, the metal frame width W1 was 30 mm, and the width W2 of the second fitting portion 12b was 20 mm. The thickness of each part was changed from 3 mm to 5 mm.
The metal frame portions at the four corners were processed and connected so as to be fitted into the corner piece 16 made of polyamide resin. A substrate holding member 14 made of polypropylene resin was mounted on the surface of the substrate support portion 13. The outer shape of the completed substrate holding frame 10 was about 1670 mm × 1980 mm.

  A transfer test of the thin substrate A (thickness 0.7 mm, 1500 mm × 1850 mm glass substrate) was performed using the completed substrate holding frame 10 and the above-described transfer platform 50. It was confirmed that it could be received. Note that the amount of bending of the thin plate substrate A was set to about 120 mm.

DESCRIPTION OF SYMBOLS 10 Board | substrate holding frame 11 Metal frame part 12a 1st fitting part 12b 2nd fitting part 13 Board | substrate support part 14 Board | substrate holding member 15 Handle part 16 Corner piece 20 Top cover 21 Surface plate 22 Binding mechanism 23 Binding belt 30 Inner Pallet 40 Anti-vibration pallet 50 Transfer platform 90 Manufacturing device 100 in the previous process A multi-stage stack of frames A Thin plate substrate W Rotating shaft J Bearing sw Rotating wheel
D Metal frame bending amount

Claims (12)

In a state where one of the rectangular thin plate substrates is housed in a substrate holding frame body having a rectangular metal frame portion in plan view, and the frame bodies in a state where the thin plate substrates are stored are aligned and stacked in multiple stages. A substrate holding frame for use in transportation or storage,
(1) a square or a metal frame portion having a rectangular cross-sectional shape,
(2) a first fitting portion provided to be inclined from the upper surface of the metal frame portion toward the inner peripheral lower side, and a substrate support portion formed to extend further beyond the first fitting portion;
(3) a second fitting portion provided to be inclined downward from the lower surface of the metal frame portion toward the inner circumference;
And positioning the substrate holding frame in a state where the thin plate substrate is placed on the substrate support part by fitting the first fitting part and the second fitting part between the upper and lower metal frame parts. Thus, a substrate holding frame that can be stacked in multiple stages. In a state where one of the rectangular thin plate substrates is housed in a substrate holding frame body having a rectangular metal frame portion in plan view, and the frame bodies in a state where the thin plate substrates are stored are aligned and stacked in multiple stages. A substrate holding frame for use in transportation or storage,
(1) a square or a metal frame portion having a rectangular cross-sectional shape,
(2) a first fitting portion provided to be inclined from the lower surface of the metal frame portion toward the inner peripheral lower side, and a substrate support portion formed to extend further beyond the first fitting portion;
(3) a second fitting portion provided to be inclined from the upper surface of the metal frame portion to the inner peripheral lower side;
And positioning the substrate holding frame in a state where the thin plate substrate is placed on the substrate support part by fitting the first fitting part and the second fitting part between the upper and lower metal frame parts. Thus, a substrate holding frame that can be stacked in multiple stages. The fitting portion is formed in a portion that does not receive the load of the metal frame portion itself when the frames are stacked in multiple stages, and the frame is inclined at an angle of 5 to 45 degrees with respect to the horizontal plane of the metal frame portion. 3. The substrate holding frame according to claim 1, wherein the frame is provided with an inclined surface that descends toward the inner surface side of the body. The frame for holding a substrate according to claim 1 or 2, wherein the metal frame itself has a square or rectangular hollow structure. It is a rectangular frame in plan view in which the left and right sides are flat and the front and back sides are curved downward, and the substrate support portions on the left and right sides are inclined downward. The frame for holding a substrate according to claim 1 or 2. The substrate holding frame according to claim 1 or 2, wherein four corners of the metal frame portion having a rectangular shape in plan view are connected by a resin corner piece. 3. The substrate holding frame according to claim 1, wherein a resin substrate holding member is mounted on at least the thin plate substrate contact surface side of the substrate support portion. 3. The substrate holding frame according to claim 1, wherein a handle portion is provided so as to protrude from the left and right sides of the metal frame portion toward the outer peripheral side. 9. The substrate holding device according to claim 1, wherein the thin substrate is a thin glass substrate, a thin plastic substrate, or a substrate on which a functional layer for a display device is provided. Frame body. A substrate holding frame in a state in which a thin plate substrate is placed on the substrate holding frame according to any one of claims 1 to 8, wherein a metal frame portion surface between the frames is smooth. Stacked in multiple stages so as to be in a sealed state by closely fitting the fitting part, and fitting the upper lid fitting part to the fitting part of the uppermost substrate holding frame to seal between the surfaces, and the upper lid Prevent contact with the thin plate substrate, fit the fitting portion of the inner pallet to the fitting portion of the lowermost substrate holding frame, seal the surface, and prevent the surface of the inner pallet from contacting the thin plate substrate. And a thin substrate packaging body. 11. The thin substrate packaging body according to claim 10, wherein a multi-stage substrate holding frame is sandwiched between the upper lid and the inner pallet, and the upper lid and the inner pallet are bound by a binding belt. 12. The thin plate substrate package according to claim 10, wherein the thin plate substrate is a thin glass substrate, a thin plastic substrate, or a substrate provided with a functional layer for a display device.

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