JP6226712B2 - Substrate support structure - Google Patents

Substrate support structure Download PDF

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JP6226712B2
JP6226712B2 JP2013241137A JP2013241137A JP6226712B2 JP 6226712 B2 JP6226712 B2 JP 6226712B2 JP 2013241137 A JP2013241137 A JP 2013241137A JP 2013241137 A JP2013241137 A JP 2013241137A JP 6226712 B2 JP6226712 B2 JP 6226712B2
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substrate
support
substrate support
end side
support structure
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JP2015103565A (en
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淳司 中谷
淳司 中谷
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Koyo Thermo Systems Co Ltd
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Koyo Thermo Systems Co Ltd
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Priority to JP2013241137A priority Critical patent/JP6226712B2/en
Priority to KR1020140091028A priority patent/KR102182046B1/en
Priority to CN201810869433.9A priority patent/CN108807259B/en
Priority to CN201410474841.6A priority patent/CN104658955B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Description

この発明は、基板の熱処理装置などに備えられ、基板を略水平姿勢に支持する基板支持構造に関する。   The present invention relates to a substrate support structure that is provided in a substrate heat treatment apparatus or the like and supports a substrate in a substantially horizontal posture.

従来、液晶や有機ＥＬ用の基板を熱処理するに際しては、熱処理装置の内部に基板をその下面を支持するようにして保持する。このとき、基板の中央部を避けて、支持部が触れても影響のない周囲部（外縁から約10 mm程度）を支持する場合があり、接触許容範囲が狭いという制約がある。   Conventionally, when heat-treating a substrate for liquid crystal or organic EL, the substrate is held in a heat treatment apparatus so that its lower surface is supported. At this time, there is a case where a peripheral portion (about 10 mm from the outer edge) which is not affected by the support portion is supported while avoiding the central portion of the substrate, and there is a restriction that the allowable contact range is narrow.

このような制約を満たすため、図７に示すように、基板Ｗの支持方法としては、真下からピンまたは球１０１で支持していた（特許文献１、２参照）。図中、両矢印Ａ１で示された基板中央の領域は接触不可範囲を示し、両矢印Ａ２で示された基板周囲の領域は接触許容範囲を示す。   In order to satisfy such restrictions, as shown in FIG. 7, the substrate W is supported by pins or balls 101 from directly below (see Patent Documents 1 and 2). In the figure, the area at the center of the substrate indicated by the double-pointed arrow A1 indicates the non-contactable range, and the area around the substrate indicated by the double-pointed arrow A2 indicates the allowable contact range.

特開２００２−１００６６８号公報Japanese Patent Laid-Open No. 2002-1000066 特開２００４−１１１７８６号公報JP 2004-111786 A

しかしながら、基板に対して真下から支持すると、搬送精度、装置の据付精度、支持位置の精度などの誤差で基板が支持部から脱落したり、接触不可範囲Ａ１に接触する虞がある。   However, if the substrate is supported from directly below, there is a possibility that the substrate may drop from the support portion or come into contact with the non-contactable range A1 due to errors such as conveyance accuracy, apparatus installation accuracy, and support position accuracy.

本発明は、上記従来技術の課題に鑑みてなされたものであり、搬送精度、装置の据付精度、支持位置の精度などに誤差があっても基板が支持部から脱落したり、接触不可範囲に接触することを防止できる基板支持構造を提供することを目的とする。   The present invention has been made in view of the above-mentioned problems of the prior art, and even if there is an error in the conveyance accuracy, the installation accuracy of the apparatus, the accuracy of the support position, etc., the substrate may fall off from the support portion or be in a non-contact range. It is an object of the present invention to provide a substrate support structure capable of preventing contact.

本発明は、被処理基板が収容されて処理される処理空間内の所定の支持位置に前記被処理基板を略水平姿勢に支持するための構造に関する。本発明の基板支持構造は、基板支持部材を備える。基板支持部材は、基端側から先端側に向かって延び、前記支持位置の両側で、基端側から先端側に向かって下方に傾斜する支持部により被処理基板を支持する。又、基板支持部材は、下方への支持部の傾斜が可変となるように配設されている。 The present invention relates to a structure for supporting a substrate to be processed in a substantially horizontal position at a predetermined support position in a processing space in which the substrate to be processed is accommodated and processed. The substrate support structure of the present invention includes a substrate support member. The substrate support member extends from the base end side toward the tip end side, and supports the substrate to be processed by support portions that are inclined downward from the base end side toward the tip end side on both sides of the support position. Further, the substrate support member is arranged so that the inclination of the support portion downward is variable.

処理空間は処理容器の内部に形成される。そして、処理容器の側壁内面における基板の支持位置の両側に保持部材を設け、これらの保持部材により基板支持部材の基端側を保持するようにすると安定して基板支持部材を保持できる。   The processing space is formed inside the processing container. If holding members are provided on both sides of the substrate support position on the inner surface of the side wall of the processing container and the base end side of the substrate support member is held by these holding members, the substrate support member can be stably held.

この構成によると、基板支持部材の支持部は斜め下方に向かって傾斜しているため、基板の撓み度合いに因らず、基板の側端下縁部にのみ支持部を接触させることができる。このため、基板を突起等により真下側から支持する必要がなくなり、基板支持部材の取付精度や基板を処理空間に搬送して支持体上に載置する際の精度の影響を受けない。   According to this structure, since the support part of the board | substrate support member inclines toward diagonally downward, a support part can be made to contact only the side edge lower edge part of a board | substrate irrespective of the bending degree of a board | substrate. For this reason, it is not necessary to support the substrate from the lower side by a projection or the like, and it is not affected by the mounting accuracy of the substrate support member or the accuracy when the substrate is transported to the processing space and placed on the support.

具体的には、基板支持部材は、ベース体および支持体を備える。ベース体は、支持部を有し、基端側から先端側に向かって延びる形状をしており、支持体は、ベース体の上面から支持部を露出させるようにベース体に配設される。これによると、基板に接触される支持部を支持体として部品化することが可能となり、取り扱いの簡素化が図られる。   Specifically, the substrate support member includes a base body and a support body. The base body has a support portion and has a shape extending from the proximal end side toward the distal end side, and the support body is disposed on the base body so as to expose the support portion from the upper surface of the base body. According to this, it becomes possible to make a part using the support part in contact with the substrate as a support, and the handling is simplified.

支持体は円筒状に形成されていると、ベース体の長手方向に沿った軸回りに回転自在に配設することができる。これにより、基板の支持部上へ載置する際のショックを支持体の回転によって和らげ、基板の支持部と接触する部位が損傷を受けることを防ぐことができる。   When the support is formed in a cylindrical shape, the support can be disposed so as to be rotatable about an axis along the longitudinal direction of the base. Thereby, the shock at the time of mounting on the support part of a board | substrate can be relieved by rotation of a support body, and it can prevent that the site | part which contacts the support part of a board | substrate is damaged.

支持体の材質としては、樹脂または石英を好適に用いることができる。   As the material of the support, resin or quartz can be preferably used.

安定して基板を支持するために、基板支持部材が支持位置の片側について複数設けられる。保持部材を支持位置の両側に対向して処理空間の奥行き方向に延びて設けられた棚とすると、１つの保持部材に対して複数の基板支持部材を設けることが容易になる。   In order to stably support the substrate, a plurality of substrate support members are provided on one side of the support position. When the holding member is a shelf provided to extend in the depth direction of the processing space so as to face both sides of the support position, it is easy to provide a plurality of substrate support members for one holding member.

本発明によると、搬送精度、装置の据付精度、支持位置の精度などの誤差があっても基板が支持部から脱落したり、接触不可範囲に接触することを防止することができる。   According to the present invention, it is possible to prevent the substrate from dropping out of the support portion or coming into contact with the non-contactable range even if there are errors such as conveyance accuracy, apparatus installation accuracy, and support position accuracy.

図１（Ａ）は本発明の実施形態に係る基板支持構造の概略構成であって、基板を支持する前の状態を示す正面断面図である。図１（Ｂ）は同基板を支持した状態を示す正面断面図である。FIG. 1A is a schematic sectional view of a substrate support structure according to an embodiment of the present invention, and is a front sectional view showing a state before supporting a substrate. FIG. 1B is a front sectional view showing a state in which the substrate is supported. 基板支持構造に用いられる基板支持部材を示す分解斜視図である。It is a disassembled perspective view which shows the board | substrate support member used for a board | substrate support structure. 図３（Ａ）は基板支持部材の保持部材への取付け状態を説明する平面図である。図３（Ｂ）は同側面図である。FIG. 3A is a plan view illustrating a state in which the substrate support member is attached to the holding member. FIG. 3B is a side view of the same. 基板支持構造を一つの処理容器内で多段に構成した例を示す概略構成図である。It is a schematic block diagram which shows the example which comprised the substrate support structure in multiple steps within one processing container. 基板支持構造を多段式ユニットとして構成した例を示す概略構成図である。It is a schematic block diagram which shows the example which comprised the board | substrate support structure as a multistage unit. 基板支持部材の角度調整機構の一例を示す図である。It is a figure which shows an example of the angle adjustment mechanism of a board | substrate support member. 従来の基板支持構造の一例の概略構成を示す正面断面図である。It is front sectional drawing which shows schematic structure of an example of the conventional board | substrate support structure.

以下に、この発明の実施の形態に係る基板支持構造の構成を図面を参照して説明する。   Hereinafter, a configuration of a substrate support structure according to an embodiment of the present invention will be described with reference to the drawings.

図１に示すように、被処理基板（以下、「基板」と称する。）Ｗは処理容器４の内部に形成される処理空間１００に収容されて処理される。基板支持構造１は、処理空間１００内の所定の支持位置に基板Ｗを略水平姿勢に支持するように構成される。本発明の基板支持構造は、基板に何らかの処理をする基板処理装置（例えば、熱処理装置など。）のバッチ炉などへ適用されるものである。基板の材質は問わず、基板が薄く撓んだものにも対応可能である。基板形状は、矩形基板に限らず、半導体ウェーハなど円形基板でも構わない。   As shown in FIG. 1, a substrate to be processed (hereinafter referred to as “substrate”) W is accommodated and processed in a processing space 100 formed inside the processing container 4. The substrate support structure 1 is configured to support the substrate W at a predetermined support position in the processing space 100 in a substantially horizontal posture. The substrate support structure of the present invention is applied to a batch furnace of a substrate processing apparatus (for example, a heat treatment apparatus) that performs some processing on a substrate. Regardless of the material of the substrate, it can be applied to a thin and bent substrate. The substrate shape is not limited to a rectangular substrate, and may be a circular substrate such as a semiconductor wafer.

基板支持構造１は、基板支持部材２および保持部材３を有する。   The substrate support structure 1 includes a substrate support member 2 and a holding member 3.

基板支持部材２は、基端２Ａ側から先端２Ｂ側に向かって延び、上側に基板Ｗを支持するための支持部２Ｃを備えるものである。より具体的には、図２に示すように、基板支持部材２は、基端２Ａ側から先端２Ｂ側に向かって延びるベース体２１と、前記支持部２Ｃを有し、ベース体２１の上面から支持部２Ｃを露出させるようにベース体２１に配設される支持体２２と、を備える。   The substrate support member 2 extends from the base end 2A side toward the distal end 2B side, and includes a support portion 2C for supporting the substrate W on the upper side. More specifically, as shown in FIG. 2, the substrate support member 2 includes a base body 21 extending from the base end 2 </ b> A side toward the tip end 2 </ b> B side, and the support portion 2 </ b> C. And a support body 22 disposed on the base body 21 so as to expose the support portion 2C.

ベース体２１および支持体２２の材質は特に限定されるものではないが、基板支持構造１が熱処理装置に適用される場合には、耐熱性を有する材料であることが必要である。特に、支持体２２は基板Ｗに直接接触される部品なので、基板Ｗに対して損傷を与えないことも材質に求められる要件となる。このような要求を満たす材料としては、樹脂または石英材が好適である。   Although the material of the base body 21 and the support body 22 is not specifically limited, When the board | substrate support structure 1 is applied to a heat processing apparatus, it is required that it is a material which has heat resistance. In particular, since the support 22 is a component that is in direct contact with the substrate W, it is also a requirement for the material not to damage the substrate W. As a material satisfying such requirements, a resin or a quartz material is suitable.

支持体２２は図２に示すように、円筒形を呈する。支持体２２は、周面の頂点を軸方向に延びる線上の支持部２Ｃを有する。なお、支持体２２の形状は一例であって上記に限定されない。   As shown in FIG. 2, the support 22 has a cylindrical shape. The support 22 has a support portion 2C on a line extending in the axial direction at the apex of the peripheral surface. In addition, the shape of the support body 22 is an example, and is not limited to the above.

ベース体２１は図２に示すような角柱形を呈する。ベース体２１の上面には長手方向に沿って延びる凹部２１Ａが形成されている。凹部２１Ａには、支持体２２が収容される。本実施形態では、凹部２１Ａは、支持体２２の円筒形に対応してハーフパイプ状に形成される。したがって、支持体２２は凹部２１Ａに収容されると、略上半分を露出状態とされ、さらにベース体２１の長手方向に沿った軸回りに回転自在となる。   The base body 21 has a prismatic shape as shown in FIG. A concave portion 21 </ b> A extending along the longitudinal direction is formed on the upper surface of the base body 21. The support 22 is accommodated in the recess 21A. In the present embodiment, the recess 21 </ b> A is formed in a half pipe shape corresponding to the cylindrical shape of the support 22. Therefore, when the support body 22 is accommodated in the recess 21 </ b> A, the substantially upper half is exposed, and the support body 22 is rotatable about an axis along the longitudinal direction of the base body 21.

ベース体２１には、凹部２１Ａの軸中心を通過するボルト穴２１Ｂが軸方向に貫通している。ベース体２１や凹部２１Ａの形状は一例であって、上記に限定されない。   A bolt hole 21B passing through the axial center of the recess 21A penetrates the base body 21 in the axial direction. The shapes of the base body 21 and the recess 21A are examples, and are not limited to the above.

支持体２２は、凹部２１Ａに収容された後、ボルト穴２１Ｂにボルト２３を嵌合させてベース体２１に取り付けられる。ボルト２３は、支持体２２の空洞部に挿通され、支持体２２がベース体２１から抜けるのを防止している。なお、ボルト２３は支持体２２の回転に支障がないように設けられる。   After the support body 22 is accommodated in the recess 21 </ b> A, the bolt 23 is fitted into the bolt hole 21 </ b> B and attached to the base body 21. The bolt 23 is inserted into the hollow portion of the support body 22 to prevent the support body 22 from coming off the base body 21. The bolt 23 is provided so as not to hinder the rotation of the support 22.

以上のように構成される基板支持部材２は、図３に示すように、保持部材３によって支持部２Ｃが基端側から先端側に向かって下方に傾斜するように保持される。   As shown in FIG. 3, the substrate support member 2 configured as described above is held by the holding member 3 so that the support portion 2 </ b> C is inclined downward from the proximal end side toward the distal end side.

本実施形態では、保持部材３は、上片部３１、側壁部３２および底片部３３からコの字型に形成された部材である。このようなコの字型の部材は、例えば、板金の曲げ加工によって作製される。   In the present embodiment, the holding member 3 is a member formed in a U shape from the upper piece portion 31, the side wall portion 32, and the bottom piece portion 33. Such a U-shaped member is produced, for example, by bending a sheet metal.

処理空間１００内の基板Ｗの支持位置の両側に、上面が水平面に形成された梁７，７が奥行き方向に渡されている。図３（Ａ）に示すように、保持部材３は、底片部３３を使用して梁７の上面にビス止めで固定される。   On both sides of the support position of the substrate W in the processing space 100, beams 7 and 7 having an upper surface formed in a horizontal plane are passed in the depth direction. As shown in FIG. 3A, the holding member 3 is fixed to the upper surface of the beam 7 with screws using the bottom piece 33.

基板支持部材２は、ベース体２１の基端部で、保持部材３の側壁部３２にボルトおよびナットを用いて固定される。基板支持部材２は、ベース体２１の基端側が高く先端側が低くなる傾斜をもって取付けられる。このとき、ベース体２１の基端面上縁が保持部材３の上片部３１に当接することにより、ベース体２１の回動が阻止され、ベース体２１の傾きが一定に維持される。これにより、支持体２２を凹部２１Ａに装着すると、図１に示すように、支持体２２は支持部２Ｃが基端側から先端側に向かって下方に傾斜するように保持される。   The substrate support member 2 is fixed to the side wall portion 32 of the holding member 3 using bolts and nuts at the base end portion of the base body 21. The substrate support member 2 is attached with an inclination in which the base end side of the base body 21 is high and the tip end side is low. At this time, when the upper edge of the base end surface of the base body 21 contacts the upper piece 31 of the holding member 3, the rotation of the base body 21 is prevented, and the inclination of the base body 21 is maintained constant. As a result, when the support 22 is mounted in the recess 21A, the support 22 is held so that the support 2C is inclined downward from the proximal end side toward the distal end side, as shown in FIG.

基板Ｗを安定して支持するためには、処理空間１００内の基板Ｗの支持位置の片側について、複数箇所で基板Ｗを支持することが好ましい。矩形の基板であれば、前後の隅部を支持する２つの基板支持部材２を設けることができる。これにより、矩形の基板をより安定して支持するようにできる。本実施形態では、基板Ｗの支持位置の片側に、梁７が処理空間１００の奥行き方向に延在する。したがって、片側の梁７の長手方向に沿って複数の保持部材３を取付けることで、当該方向に並んで複数の基板支持部材２を設けることが可能である。   In order to stably support the substrate W, it is preferable to support the substrate W at a plurality of locations on one side of the support position of the substrate W in the processing space 100. If it is a rectangular board | substrate, the two board | substrate support members 2 which support the front-back corner part can be provided. Thereby, a rectangular board | substrate can be supported more stably. In the present embodiment, the beam 7 extends in the depth direction of the processing space 100 on one side of the support position of the substrate W. Therefore, by attaching the plurality of holding members 3 along the longitudinal direction of the beam 7 on one side, it is possible to provide the plurality of substrate support members 2 side by side in the direction.

上記保持部材３および基板支持部材２から成る基板支持構造の段数は限定されない。すなわち、図４に示すように、処理容器４の側壁内面４Ａに、基板支持構造１を多段に設けることにより、１つの処理容器４の処理空間１００に複数の基板Ｗを支持することができる。   The number of stages of the substrate support structure including the holding member 3 and the substrate support member 2 is not limited. That is, as shown in FIG. 4, a plurality of substrates W can be supported in the processing space 100 of one processing container 4 by providing the substrate support structure 1 in multiple stages on the side wall inner surface 4 </ b> A of the processing container 4.

多段式の変形例として、図５に示すように、１つの基板支持構造１を有する処理容器４を扁平なユニットとして形成し、このユニットの複数を多段に積み重ねる構成を採用することもできる。これによると、積み重ねるユニットの数は自由にレイアウトできるので、基板支持構造の段数を任意に設定することができるメリットがある。   As a multistage modification, as shown in FIG. 5, it is possible to adopt a configuration in which the processing container 4 having one substrate support structure 1 is formed as a flat unit, and a plurality of the units are stacked in multiple stages. According to this, since the number of units to be stacked can be freely laid out, there is an advantage that the number of steps of the substrate support structure can be arbitrarily set.

上記のように構成される基板支持構造１によって、基板Ｗを支持するときには、図１（Ａ）に示すように、不図示の搬送ロボットのロボットアームの先端部に配設されたフォークによって処理空間１００内の支持位置の上方へ基板Ｗを搬送する。続いて、ロボットアームを下降させることによって図１（Ｂ）に示すように、支持位置の両側で対峙する基板支持部材２の支持体２２上に基板Ｗを載置する。基板Ｗは、その両側端部で基板支持部材２の支持部２Ｃによって支持される。   When the substrate W is supported by the substrate support structure 1 configured as described above, as shown in FIG. 1A, a processing space is provided by a fork disposed at the tip of a robot arm of a transfer robot (not shown). The substrate W is transported above the support position in 100. Subsequently, by lowering the robot arm, as shown in FIG. 1B, the substrate W is placed on the support 22 of the substrate support member 2 facing each other at both sides of the support position. The substrate W is supported by the support portions 2C of the substrate support member 2 at both end portions thereof.

このようにして支持された基板Ｗは、基板支持部材２に直接支持されない中央部が自重で沈むように撓みが生じる。ただし、撓み具合は、基板Ｗの厚み、サイズ、或いは材質によって異なる。図１（Ｂ）に示した基板Ｗ１、Ｗ２、Ｗ３では、この順で撓みの度合いが大きくなくなっている。基板の撓み度合いは基板の厚み、サイズ、或いは材質によって異なる。   The substrate W supported in this way bends so that the central portion that is not directly supported by the substrate support member 2 sinks under its own weight. However, the degree of bending differs depending on the thickness, size, or material of the substrate W. In the substrates W1, W2, and W3 shown in FIG. 1B, the degree of bending does not increase in this order. The degree of bending of the substrate varies depending on the thickness, size, or material of the substrate.

本発明では、基板支持部材２の支持部２Ｃは斜め下方に向かって傾斜しているため、基板Ｗの撓み度合いに因らず、基板Ｗの側端下縁部にのみ支持部２Ｃを接触させることができる。このため、基板Ｗを突起等により真下側から支持する必要がなくなり、基板支持部材２の取付精度や基板Ｗを処理空間に搬送して支持体２２上に載置する際の精度の影響を受けない。   In the present invention, since the support portion 2C of the substrate support member 2 is inclined obliquely downward, the support portion 2C is brought into contact only with the lower edge of the side edge of the substrate W regardless of the degree of bending of the substrate W. be able to. For this reason, there is no need to support the substrate W from the lower side by a protrusion or the like, and it is affected by the mounting accuracy of the substrate support member 2 and the accuracy when the substrate W is transported to the processing space and placed on the support 22. Absent.

また、支持部２Ｃを有する支持体２２が回転自在であるため、基板Ｗを支持部２Ｃ上へ載置する際のショックを支持体２２の回転によって和らげ、基板Ｗの支持部２Ｃと接触する部位が損傷を受けることを防ぐことができる。さらに、支持部２Ｃの材質を樹脂または石英とすることで、より確実に基板Ｗの損傷を防ぐことができる。   Further, since the support body 22 having the support portion 2C is rotatable, the shock at the time of placing the substrate W on the support portion 2C is softened by the rotation of the support body 22 and the portion that contacts the support portion 2C of the substrate W. Can be prevented from being damaged. Furthermore, the damage of the board | substrate W can be prevented more reliably by making the material of the support part 2C into resin or quartz.

なお、本実施形態では、保持部材３に対して基板支持部材２を固定状態（回動不能）で取付ける場合で説明したが、処理対象となる基板Ｗのロットに応じて支持部２Ｃの下向きの傾斜角度を可変できるように回動可能に取付けるようにしても良い。例えば、図６に示すように、基板支持部材２を基端部で回動軸５を用いて保持部材３に対して回動自在に保持し、保持部材３には縦長の長孔３４を、基板支持部材２のベース体２１には横長の長孔２４をそれぞれ設けて、長孔３４，２４同士が交差する任意の位置でピン６などを用いて基板支持部材２の先端側を固定する。これによって、支持部２Ｃの傾斜角度を調整することが可能となる。   In the present embodiment, the substrate support member 2 is attached to the holding member 3 in a fixed state (unrotatable). However, the support portion 2C faces downward depending on the lot of the substrate W to be processed. You may make it attach so that rotation is possible so that an inclination angle may be varied. For example, as shown in FIG. 6, the substrate support member 2 is rotatably held with respect to the holding member 3 using the rotation shaft 5 at the base end portion, and the holding member 3 has a vertically long slot 34. The base body 21 of the substrate support member 2 is provided with a horizontally long hole 24, and the front end side of the substrate support member 2 is fixed using a pin 6 or the like at an arbitrary position where the long holes 34 and 24 intersect each other. As a result, the inclination angle of the support portion 2C can be adjusted.

上述の実施形態の説明は、すべての点で例示であって、制限的なものではないと考えられるべきである。この発明の範囲は、上述の実施形態ではなく、特許請求の範囲によって示される。さらに、この発明の範囲には、特許請求の範囲と均等の意味および範囲内でのすべての変更が含まれることが意図される。   The above description of the embodiment is to be considered in all respects as illustrative and not restrictive. The scope of the present invention is shown not by the above-described embodiments but by the claims. Furthermore, the scope of the present invention is intended to include all modifications within the meaning and scope equivalent to the claims.

Ｗ、Ｗ１、Ｗ２、Ｗ３…基板
１…基板支持構造
２…基板支持部材
２Ａ…基端
２Ｂ…先端
２Ｃ…支持部
２１…ベース体
２１Ａ…凹部
２１Ｂ…ボルト穴
２２…支持体
２３…ボルト
３…保持部材
４…処理容器
４Ａ…側壁内面
１００…処理空間 W, W1, W2, W3 ... Substrate 1 ... Substrate support structure 2 ... Substrate support member 2A ... Base end 2B ... Tip 2C ... Support portion 21 ... Base body 21A ... Recess 21B ... Bolt hole 22 ... Support 23 ... Bolt 3 ... Holding member 4 ... Processing container 4A ... Side wall inner surface 100 ... Processing space

Claims (5)

被処理基板が収容されて処理される処理空間内の所定の支持位置に前記被処理基板を略水平姿勢に支持するための基板支持構造であって、
基端側から先端側に向かって延び、前記支持位置の両側で、基端側から先端側に向かって下方に傾斜する支持部により前記被処理基板を支持する基板支持部材を備え、
前記基板支持部材は、下方への前記支持部の傾斜が可変となるように配設されている、基板支持構造。 A substrate support structure for supporting the substrate to be processed in a substantially horizontal position at a predetermined support position in a processing space in which the substrate to be processed is accommodated and processed,
A substrate support member that extends from the base end side toward the tip end side and supports the substrate to be processed by support portions that are inclined downward from the base end side toward the tip end side on both sides of the support position ,
The substrate support structure, wherein the substrate support member is disposed such that the inclination of the support portion downward is variable . 前記処理空間は、処理容器の内部に形成され、前記処理容器の側壁内面における前記支持位置の両側に、前記基板支持部材の基端側を保持する保持部材が設けられた、請求項１に記載の基板支持構造。   The processing space is formed inside the processing container, and holding members that hold the base end side of the substrate support member are provided on both sides of the support position on the inner surface of the side wall of the processing container. Substrate support structure. 前記基板支持部材が前記支持位置の片側について複数設けられる、請求項１に記載の基板支持構造。 The substrate support structure according to claim 1 , wherein a plurality of the substrate support members are provided on one side of the support position. 前記支持位置の両側に対向して前記処理空間の奥行き方向に延びて設けられる保持部材であって、複数の前記基板支持部材に対応して設けられる保持部材を備える、請求項３に記載の基板支持構造。 The substrate according to claim 3 , further comprising a holding member provided to extend in the depth direction of the processing space so as to face both sides of the support position, and is provided corresponding to the plurality of substrate support members. Support structure. 前記基板支持部材は、The substrate support member is
前記基端側から前記先端側に向かって延びるベース体と、A base body extending from the base end side toward the tip end side;
前記支持部を有し、前記ベース体の上面から前記支持部を露出させるように前記ベース体に配設される支持体と、A support body having the support part and disposed on the base body so as to expose the support part from an upper surface of the base body;
を備える、請求項１〜４の何れかに記載の基板支持構造。The board | substrate support structure in any one of Claims 1-4 provided with these.
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