CN108807259A - Substrate support structure - Google Patents
Substrate support structure Download PDFInfo
- Publication number
- CN108807259A CN108807259A CN201810869433.9A CN201810869433A CN108807259A CN 108807259 A CN108807259 A CN 108807259A CN 201810869433 A CN201810869433 A CN 201810869433A CN 108807259 A CN108807259 A CN 108807259A
- Authority
- CN
- China
- Prior art keywords
- substrate
- supporting member
- supporting
- support structure
- end side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention provides a kind of substrate support structure, though delivery precision, the installation accuracy of device, precision of bearing position etc. there are can prevent substrate from falling off or touching from supporting part if error can not contact range.The substrate support structure (1) of the present invention has supporting member for substrate (2) and holding member (3).From base end side, end side extends supporting member for substrate (2) forward, is supported by processing substrate (W) using the supporting part (2C) for being formed in upside.Supporting member for substrate (2) is kept into supporting part (2C) from the cardinal extremity side (2A) towards front end (2B) lateral inclined downward by holding member (3) at the both sides of the bearing position of substrate (W).
Description
The application be on 09 17th, 2014 the applying date, entitled " substrate support structure ", national application number are
The divisional application of the application for a patent for invention of " 201410474841.6 ".
Technical field
The present invention relates to the substrate support structure that annealing device of substrate etc. has, the substrate support structure is used for
By substrate supporting at approximate horizontal posture.
Background technology
In the past, when being heat-treated to the substrate of liquid crystal and organic EL, by base in a manner of the lower surface of supporting substrates
Plate is maintained at the inside of annealing device.At this point, avoiding the central portion of substrate sometimes but supporting even if contact supporting part
The periphery (from outer rim about 10mm or so) being unaffected, to there is the narrow limitation of contact permissible range.
In order to overcome this limitation, as shown in fig. 7, the bearing method as substrate W, from underface pin or 101, ball
Hold substrate W (referring to patent document 1, patent document 2).In figure, the region of substrate center shown in two arrow A1 indicates to connect
Range is touched, the region around substrate shown in two arrow A2 indicates contact permissible range.
Patent document 1：Japanese Laid-Open Patent Publication 2002-100668
Patent document 2：Japanese Laid-Open Patent Publication 2004-111786
However, from underface supporting substrates when, due to delivery precision, the installation accuracy of device, precision of bearing position etc.
Error, there is a possibility that substrate falls off or touched from supporting part can not contact range A1.
Invention content
The present invention is in view of the above problems, it is therefore an objective to a kind of substrate support structure is provided, even if the installation of delivery precision, device
There are errors for precision, precision of bearing position etc., and can also prevent substrate from falling off or touching from supporting part can not contact range.
The present invention relates to for accommodating and handling by the defined bearing position in the processing space of processing substrate, incite somebody to action
It is described by processing substrate supporting at the structure of approximate horizontal posture.The substrate support structure of the present invention includes supporting member for substrate.
Supporting member for substrate from base end side forward end side extend, and the both sides of bearing position utilize from base end side towards front end side it is downward
The inclined supporting part bearing in side is by processing substrate.
Processing space is formed in the inside of process container.Also, the bearing position in the side wall inner surfaces of process container
Both sides are provided with holding member, when keeping the base end side of supporting member for substrate by these holding members, can stably keep substrate
Supporting member.
According to this configuration, since the supporting part of supporting member for substrate oliquely downward tilts, thus no matter the warpage of substrate
How is degree, and supporting part is only capable of the side lower edge of contact substrate.Therefore, it is not necessary to by protrusion etc. from underface side bearing base
Plate, not precision by the installation accuracy of supporting member for substrate and when conveying and carried on the bearer by from substrate to processing space
It influences.
Specifically, supporting member for substrate includes matrix and supporting member.Matrix is from the base end side shape that end side extends forward
Shape, supporting member has supporting part, and is configured at matrix in a manner of so that supporting part is exposed from the upper surface of matrix.Thus, it is possible to
The supporting part componentization as supporting member that will be in contact with substrate, realizes the simplification of processing.
When supporting member is cylindric, it can be configured to rotate freely around the axis of the long side direction along matrix.It utilizes as a result,
The impact when rotation of supporting member has been mitigated on base plate carrying to supporting part, the position that can prevent substrate from being contacted with supporting part
It is impaired.
The material of supporting member preferably uses resin or quartz.
For steadily supporting substrates, the unilateral side of bearing position is provided with multiple supporting member for substrate.Holding member is
It is arranged in the holder that the both sides of bearing position are opposite and extend to the longitudinal direction of processing space, is easy to a holding structure
Multiple supporting member for substrate are arranged in part.
According to the present invention, even if there are can if error for delivery precision, the installation accuracy of device, precision of bearing position etc.
With prevent substrate from falling off from supporting part or touch can not contact range.
Description of the drawings
(A) of Fig. 1 indicates the brief configuration of the substrate support structure of embodiment of the present invention, is before indicating supporting substrates
State main view cross-section diagram.(B) of Fig. 1 is the main view cross-section diagram for indicating to support the state after same substrate.
Fig. 2 is the exploded perspective view of supporting member for substrate used by indicating substrate support structure.
(A) of Fig. 3 is the vertical view for illustrating supporting member for substrate relative to the installation condition of holding member.(B) of Fig. 3 be
Illustrate side view of the supporting member for substrate relative to the installation condition of holding member.
Fig. 4 is the exemplary brief configuration figure for indicating to constitute multi-stage base plate supporting structure in a process container.
Fig. 5 is the exemplary brief configuration figure for indicating substrate support structure being configured to multi-stag unit.
Fig. 6 is the figure of an example for the angle-adjusting mechanism for indicating supporting member for substrate.
Fig. 7 is the main view cross-section diagram of the brief configuration of an example for indicating existing substrate support structure.
Reference sign
W, W1, W2, W3 ... substrate
1 ... substrate support structure
2 ... supporting member for substrate
2A ... cardinal extremities
The front ends 2B ...
2C ... supporting parts
21 ... matrixes
21A ... recess portions
21B ... bolts hole
22 ... supporting members
23 ... bolts
3 ... holding members
4 ... process containers
4A ... side wall inner surfaces
100 ... processing spaces
Specific implementation mode
Hereinafter, being described with reference to the composition of the substrate support structure of embodiment of the present invention.
As shown in Figure 1, accommodated in the processing space 100 being formed in inside process container 4 and handle by processing substrate (with
It is known as " substrate " down) W.Substrate W is supported to greatly by substrate support structure 1 on the defined bearing position in processing space 100
Cause flat-hand position.The substrate board treatment that the substrate support structure of the present invention is suitable for carrying out substrate certain processing is (such as warm
Processing unit etc.) batch furnace etc..No matter the material of substrate, it can also correspond to thin and warpage substrate.Substrate shape
Shape is not limited to rectangular substrate, can also be the circular substrates such as semiconductor wafer.
Substrate support structure 1 has supporting member for substrate 2 and holding member 3.
Supporting member for substrate 2 extends from the sides cardinal extremity 2A to the front end sides 2B, has the supporting part for supporting substrates W in upside
2C.More specifically, as shown in Fig. 2, supporting member for substrate 2 includes：Matrix 21 extends from the sides cardinal extremity 2A to the front end sides 2B；With
And supporting member 22, have the supporting part 2C, and base is configured in a manner of so that supporting part 2C is exposed from the upper surface of matrix 21
Body 21.
The material of matrix 21 and supporting member 22 is not particularly limited, but is applied to annealing device in substrate support structure 1
When it is necessary to have the materials of heat resistance.Especially because supporting member 22 is the component being in direct contact with substrate W, so its material
It is required that being unable to wounded substrate W.As the material for meeting this requirement, preferred resin or quartz material.
As shown in Fig. 2, supporting member 22 is cylindrical.Supporting member 22 has and axially extends on the columnar circumferential surface
Linear supporting part 2C.In addition, as an example of the shape of supporting member 22, it is not limited to above-mentioned shape.
As shown in Fig. 2, matrix 21 is in prismatic.The upper surface of matrix 21 is formed with the recess portion 21A extended along long side direction.
Supporting member 22 is accommodated in recess portion 21A.In present embodiment, recess portion 21A is corresponding with the cylindrical shape of supporting member 22, is formed as semicanal
Shape.Therefore, when supporting member 22 is accommodated in recess portion 21A, the substantially first half of supporting member 22, which reveals, to do well, and supporting member 22
Axis around the long side direction along matrix 21 rotates freely.
By the bolt hole 21B in the axle center of recess portion 21A axially through matrix 21.The shape of matrix 21 and recess portion 21A is
An example is not limited to above-mentioned shape.
After supporting member 22 is contained in recess portion 21A, by supporting member 22 by bolt 23 is embedded in bolt hole 21B
It is installed on matrix 21.Bolt 23 inserts the blank part of supporting member 22, prevents supporting member 22 from deviating from from matrix 21.In addition, bolt 23
It is arranged to not interfere the rotation of supporting member 22.
As shown in figure 3, the supporting member for substrate 2 constituted in the above described manner, which is kept component 3, is kept into supporting part 2C from base
End side tilts downwards towards front end side.
In present embodiment, holding member 3 is the component that U shape is formed by upper piece portion 31, side of sidewall portion 32 and egative film portion 33.
Such as the component of this U shape is made by the bending machining of metallic plate.
The both sides of the bearing position of substrate W in processing space 100, it is horizontal plane to be provided with upper surface along longitudinal direction
Beam 7.As shown in (A) of Fig. 3, holding member 3 is fixed by screws in the upper surface of beam 7 using egative film portion 33.
Supporting member for substrate 2 is fixed on using screw bolt and nut the side of sidewall portion 32 of holding member 3 in the base end part of matrix 21.
Supporting member for substrate 2 is installed with the angled manner that the base end side of matrix 21 is high and front end side is low.At this point, the base by making matrix 21
End face upper limb is connected to upper piece portion 31 of holding member 3, and matrix 21 is prevented to rotate, to which the inclination of matrix 21 is remained one
It is fixed.As a result, if supporting member 22 is installed on recess portion 21A, as shown in Figure 1, supporting member 22 is retained supporting part 2C from base
End side tilts downwards towards front end side.
For steadily supporting substrates W, the unilateral side of the bearing position of the substrate W preferably in processing space 100, multiple
Position supporting substrates W.If it is the substrate of rectangle, then two supporting member for substrate 2 in the front and back corner of bearing can be set.By
This, can more stably support the substrate of rectangle.In present embodiment, in the unilateral side of the bearing position of substrate W, beam 7 is along processing
The longitudinal direction in space 100 extends.Therefore, multiple holding members 3, Ke Yi are installed by the long side direction along unilateral beam 7
It is set up in parallel multiple supporting member for substrate 2 in this direction.
The series for the substrate support structure being made of above-mentioned holding member 3 and supporting member for substrate 2 does not limit.That is, such as
Shown in Fig. 4, by the multistage setting substrate support structure 1 on the side wall inner surfaces 4A of process container 4, appearance can be handled at one
Multiple substrate W are supported in the processing space 100 of device 4.
As shown in figure 5, the variation as multi-stag, may be used such as lower structure：Substrate support structure 1 there are one having
Process container 4 be formed as flat unit, and multiple unit multistages are laminated.As a result, due to the unit number energy of stacking
It freely arranges, thus has the advantages that arbitrarily set the series of substrate support structure.
When using the 1 supporting substrates W of substrate support structure constituted in the above described manner, as shown in (A) of Fig. 1, configuration is utilized
Substrate W is transported to the bearing position in processing space 100 by the yoke in the front end of the mechanical arm of transfer robot (not shown)
The top set.Then by making mechanical arm decline, as shown in (B) of Fig. 1, substrate W is carried in the both sides pair of bearing position
On the supporting member 22 for the supporting member for substrate 2 set.Using supporting member for substrate 2 supporting part 2C substrate W both side ends branch
Hold substrate W.
As above the substrate W's supported is not sunk by the central portion that supporting member for substrate 2 directly supports because of dead weight, to
Cause substrate W that warpage occurs.But warpage situation according to the thickness of substrate W, size or material difference.Shown in (B) of Fig. 1
The warpage degree of substrate W1, W2, W3 be sequentially increased.The warpage degree of substrate can because the thickness of substrate, size or material without
Together.
In the present invention, since the supporting part 2C of supporting member for substrate 2 is oliquely downward tilted, no matter so warpage of substrate W
How is degree, and supporting part 2C can be made only to contact the side lower edge of substrate W.Therefore, it is not necessary to using protrusion etc. from underface
Side bearing substrate W, will not by supporting member for substrate 2 installation accuracy and substrate W conveyed to processing space and be carried to branch
The influence of precision when in bearing member 22.
Further, since the supporting member 22 with supporting part 2C rotates freely, so the rotation using supporting member 22 mitigates
Impact when substrate W is carried on supporting part 2C can prevent the position of substrate W contact supporting parts 2C impaired.Moreover, passing through
It is resin or quartz to make the material of supporting part 2C, and it is impaired to be further reliably prevented substrate W.
In addition, present embodiment illustrates supporting member for substrate 2 being installed in a manner of stationary state (cannot rotate)
The case where holding member 3, but supporting member for substrate 2 can also be mounted to energy according to the group of the substrate W as process object
Enough rotations, to make supporting part 2C's to tilt down variable-angle.Such as shown in Fig. 6, supporting member for substrate 2 in base end part
Place is kept into using rotation axis 5 and is rotated freely relative to holding member 3, and on holding member 3 be arranged lengthwise slot hole 34,
Horizontally long slot hole 24 is set on the matrix 21 of supporting member for substrate 2, at the arbitrary position intersected with each other of slot hole 34,24, profit
With the front end side of the fixed substrates such as pin 6 supporting member 2.In this way, the angle of inclination of supporting part 2C can be adjusted.
All features are all exemplary features in the explanation of the above embodiment, rather than restrictive feature.The present invention
Range be not limited to the above embodiment, but indicated by claim.Moreover, the scope of the present invention includes and claim
Arbitrary change in equivalent content and right.
Claims (5)
1. a kind of substrate support structure, for accommodating and handling by the defined bearing position in the processing space of processing substrate
On, by it is described by processing substrate supporting at flat-hand position, the substrate support structure is characterized in that,
Including supporting member for substrate, from base end side, end side extends the supporting member for substrate forward, and in the bearing position
Both sides utilize supported from base end side towards front end side supporting part inclined downward it is described by processing substrate,
The supporting member for substrate includes：
Matrix extends from the cardinal extremity side to the front end side；And
Supporting member has the supporting part, and is configured in a manner of so that the supporting part is exposed from the upper surface of described matrix
Described matrix,
The supporting member has cylinder sides, and is configured to rotate freely around the axis of the long side direction along described matrix.
2. substrate support structure according to claim 1, which is characterized in that the supporting member is formed by resin or quartz.
3. substrate support structure according to claim 1 or 2, which is characterized in that the processing space is formed in processing and holds
The inside of device, the bearing position both sides in the side wall inner surfaces of the process container are provided with holding member, the guarantor
Hold base end side of the component for keeping the supporting member for substrate.
4. substrate support structure according to claim 1 or 2, which is characterized in that in the unilateral side setting of the bearing position
There are multiple supporting member for substrate.
5. substrate support structure according to claim 4, which is characterized in that including holding member, the holding member is set
Be set to it is opposite in the both sides of the bearing position, along the processing space longitudinal direction extend, and with multiple substrate branch
Bearing member is correspondingly arranged.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-241137 | 2013-11-21 | ||
| JP2013241137A JP6226712B2 (en) | 2013-11-21 | 2013-11-21 | Substrate support structure |
| CN201410474841.6A CN104658955B (en) | 2013-11-21 | 2014-09-17 | Substrate support structure |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410474841.6A Division CN104658955B (en) | 2013-11-21 | 2014-09-17 | Substrate support structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108807259A true CN108807259A (en) | 2018-11-13 |
| CN108807259B CN108807259B (en) | 2022-12-16 |
Family
ID=53249925
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410474841.6A Active CN104658955B (en) | 2013-11-21 | 2014-09-17 | Substrate support structure |
| CN201810869433.9A Active CN108807259B (en) | 2013-11-21 | 2014-09-17 | Substrate supporting structure |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410474841.6A Active CN104658955B (en) | 2013-11-21 | 2014-09-17 | Substrate support structure |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6226712B2 (en) |
| KR (1) | KR102182046B1 (en) |
| CN (2) | CN104658955B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111244019A (en) * | 2018-11-29 | 2020-06-05 | 株式会社安川电机 | Substrate supporting device, substrate transfer robot, and alignment device |
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| GB2392309A (en) * | 2002-08-22 | 2004-02-25 | Leica Microsys Lithography Ltd | Substrate loading and unloading apparatus |
| KR20040110563A (en) * | 2003-06-19 | 2004-12-31 | 삼성전자주식회사 | Panel supporting apparatus |
| CN101667530A (en) * | 2008-09-05 | 2010-03-10 | 东京毅力科创株式会社 | Processing apparatus and vertical thermal processing apparatus |
| JP2012224352A (en) * | 2011-04-18 | 2012-11-15 | Dainippon Printing Co Ltd | Substrate holding frame body and package of sheet substrate |
| US20130259457A1 (en) * | 2012-03-27 | 2013-10-03 | Dainippon Screen Mfg. Co., Ltd. | Heat treatment apparatus for heating substrate by irradiating substrate with flash of light |
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| JP2001358191A (en) * | 2000-06-09 | 2001-12-26 | Asm Japan Kk | Substrate support plate for semiconductor manufacturing apparatus |
| JP2002100668A (en) | 2000-09-25 | 2002-04-05 | Mitsubishi Materials Silicon Corp | Substrate support for heat treatment |
| JP2004014829A (en) * | 2002-06-07 | 2004-01-15 | Hitachi Kokusai Electric Inc | Heat treatment apparatus and method of manufacturing semiconductor device |
| JP2004111786A (en) | 2002-09-20 | 2004-04-08 | Hitachi Kokusai Electric Inc | Heat treatment equipment and manufacturing method of semiconductor device |
| JP2005340488A (en) * | 2004-05-27 | 2005-12-08 | Matsushita Electric Ind Co Ltd | Device for manufacturing electronic device |
| CN101303993A (en) * | 2007-05-10 | 2008-11-12 | 南亚科技股份有限公司 | Wafer bearing device |
| JP5261085B2 (en) * | 2008-09-05 | 2013-08-14 | 東京エレクトロン株式会社 | Substrate placing mechanism, substrate processing apparatus, substrate placing mechanism control method, and storage medium |
| JP5435039B2 (en) * | 2009-12-11 | 2014-03-05 | 株式会社Ｓｕｍｃｏ | CVD tray and film forming method using the same |
| JP5964630B2 (en) * | 2012-03-27 | 2016-08-03 | 株式会社Ｓｃｒｅｅｎホールディングス | Heat treatment equipment |
-
2013
- 2013-11-21 JP JP2013241137A patent/JP6226712B2/en active Active
-
2014
- 2014-07-18 KR KR1020140091028A patent/KR102182046B1/en active IP Right Grant
- 2014-09-17 CN CN201410474841.6A patent/CN104658955B/en active Active
- 2014-09-17 CN CN201810869433.9A patent/CN108807259B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2392309A (en) * | 2002-08-22 | 2004-02-25 | Leica Microsys Lithography Ltd | Substrate loading and unloading apparatus |
| KR20040110563A (en) * | 2003-06-19 | 2004-12-31 | 삼성전자주식회사 | Panel supporting apparatus |
| CN101667530A (en) * | 2008-09-05 | 2010-03-10 | 东京毅力科创株式会社 | Processing apparatus and vertical thermal processing apparatus |
| JP2012224352A (en) * | 2011-04-18 | 2012-11-15 | Dainippon Printing Co Ltd | Substrate holding frame body and package of sheet substrate |
| US20130259457A1 (en) * | 2012-03-27 | 2013-10-03 | Dainippon Screen Mfg. Co., Ltd. | Heat treatment apparatus for heating substrate by irradiating substrate with flash of light |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111244019A (en) * | 2018-11-29 | 2020-06-05 | 株式会社安川电机 | Substrate supporting device, substrate transfer robot, and alignment device |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20150059072A (en) | 2015-05-29 |
| CN104658955A (en) | 2015-05-27 |
| JP6226712B2 (en) | 2017-11-08 |
| KR102182046B1 (en) | 2020-11-23 |
| CN104658955B (en) | 2019-01-04 |
| JP2015103565A (en) | 2015-06-04 |
| CN108807259B (en) | 2022-12-16 |
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