CN101303993A - Wafer bearing device - Google Patents
Wafer bearing device Download PDFInfo
- Publication number
- CN101303993A CN101303993A CNA2007101032616A CN200710103261A CN101303993A CN 101303993 A CN101303993 A CN 101303993A CN A2007101032616 A CNA2007101032616 A CN A2007101032616A CN 200710103261 A CN200710103261 A CN 200710103261A CN 101303993 A CN101303993 A CN 101303993A
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- China
- Prior art keywords
- support
- wafer
- bearing apparatus
- chip bearing
- base
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a wafer bearing device, which comprises a base and a plurality of support bars vertically fixed on the base; wherein, each support bar is respectively provided with a support for bearing the wafer. The support is provided with an upper top surface which has a predetermined oblique angle towards the base, thus a rim of the wafer can lean on the upper top surface.
Description
Technical field
The present invention relates to a kind of bogey, particularly a kind of chip bearing apparatus.
Background technology
In the technology of semiconductor wafer, semiconductor wafer is placed on the brilliant boat usually, conveniently carries out multiple handling procedure, for example thermal oxidation, deposition or annealing.The brilliant boat 1 of the ladder type that Fig. 1 illustration is traditional.Wafer is placed on the support 14 of the brilliant boat 1 of ladder type with suitable interval S.So brilliant boat 1 can use robot apparatus to be carried.
The brilliant boat 1 of traditional ladder type comprises base 11, top cover 12, several support bars 13 and support 14.Support bar 13 links to each other with base 11 and top cover 12 respectively, on it and have a support 14.The support 14 that self-supporting bar 13 stretches out is vertical with support bar 13.Wafer 15 is placed on the brilliant boat 1 of ladder type via the support of support 14 usually.
Contact with wafer 15 because support 14 is the modes with " face contact ", so defective 16, thermal expansion or vibrations on the support 14 cause the small scratch of wafer 15 easily, and can on the contact site of wafer 15, find the gathering of particulate, as shown in Figure 2.
Because the small scratch that is caused and the existence of particulate all can impact and reduce rate of finished products respectively for the follow-up various handling procedures of semiconductor wafer.In addition, if when using support bar 13 more than four, wafer also can be in a kind of unsettled contact equilibrium usually, and this also can influence the quality of wafer output.
So need a kind of chip bearing apparatus of novelty, to solve above problem and to promote the quality and the rate of finished products of wafer.
Summary of the invention
The present invention makes that promptly at the chip bearing apparatus that a kind of " some contact " formula is provided the contact portion between wafer and support reduces to minimum.
The invention provides the chip bearing apparatus of a kind of " some contact " formula, it is minimum that the chance that makes wafer produce small scratch is reduced to.
The invention provides the chip bearing apparatus of a kind of " some contact " formula, make particles agglomerate reduce to minimum in the amount of wafer.
The invention provides the chip bearing apparatus of a kind of " some contact " formula, when making wafer placement in chip bearing apparatus, can not be in unsettled contact equilibrium state.
The invention provides the chip bearing apparatus of a kind of " some contact " formula, wherein the support on the support bar is with the inclined-plane that has a down dip the outer rim of wafer to be made point to support.
The invention provides the chip bearing apparatus of a kind of " some contact " formula, suitable wafer is put up or down.
Chip bearing apparatus of the present invention comprises base and the support bar of many vertical fixing on base.Each support bar comprises support respectively with bearing wafer.Support has the last end face towards the base predetermined oblique angle, makes the outer rim (rim) of wafer bear against on the end face.
Owing to have last end face, make the outer rim of wafer bear against on the end face, so support is with the inclined-plane that has a down dip the outer rim of wafer to be made point to support towards the base predetermined oblique angle.Thus, not only make contact portion between wafer and support reduce to minimum, that the chance that wafer produces small scratch is reduced to is minimum, particles agglomerate reduces to minimum in the amount of wafer, and wafer can not be in unsettled contact equilibrium state.In addition, chip bearing apparatus of the present invention, wafer not only can increase the film equality and the back side uniformity, can also make progress or can put downwards, and many advantages are arranged really.
Description of drawings
The brilliant boat of the ladder type that Fig. 1 illustration is traditional.
In the brilliant boat of the ladder type that Fig. 2 illustration is traditional, find the gathering of particulate on the contact site of wafer.
Fig. 3 illustration chip bearing apparatus of the present invention.
Description of reference numerals
12 top covers, 13 support bars
14 supports, 15 wafers
16 defectives, 30 chip bearing apparatus
31 bases, 32 top covers
33 support bars, 34 supports
351 lower edges, 36 supports
371 lower edges, 38 auxiliary support bars
381 beams
Embodiment
The invention provides the chip bearing apparatus of a kind of " some contact " formula, support wherein has the last end face towards the base predetermined oblique angle, makes the outer rim of wafer bear against on the end face in the mode of a contact.Thus, not only make contact portion between wafer and support can reduce to minimum, that the chance that wafer produces small scratch is reduced to is minimum, particles agglomerate reduces to minimum in the amount of wafer, and wafer can not be in unsettled contact equilibrium state.Also have, wafer both can make progress and also can be placed in the chip bearing apparatus downwards.
Fig. 3 illustration chip bearing apparatus 30 of the present invention, it comprises base 31 and many support bars 33 of vertical fixing on base 31.Each support bar 33 comprises support 34 respectively with bearing wafer 35.Support 34 has a last end face 341 that tilts, and it is towards base 31 predetermined oblique angle, makes the lower edge 351 of the side of wafer 35 bear against on the end face 341.
If necessary, each support bar 33 can further comprise support 36 respectively with bearing wafer 37 in the chip bearing apparatus 30.Preferably, support 36 similar supports 34 have the last end face 361 of inclination, and it makes the lower edge 371 of wafer 37 sides can bear against on the end face 361 towards base 31 predetermined oblique angle.
The angle of inclination of last end face 341 or last end face 361 depends on the circumstances, and relevant with spacing P.For example, the angle of inclination of last end face 341 or last end face 361 can be preferably 3 degree independently between the 1-25 degree.
If necessary, chip bearing apparatus 30 can comprise at least one auxiliary support bar 38 that links via beam 381 or base 31 with support bar 33 in addition.Support bar 38 does not have any support, as the usefulness of auxiliary support bar 33 bearing wafers.In addition, chip bearing apparatus 30 also can include loam cake 32.
Because chip bearing apparatus 30 of the present invention often need follow wafer to carry out various handling procedures, so each support bar 33/38 preferred independent packet contains thermally-stabilised inorganic material, for example silicon, silicon dioxide or carborundum.
Wafer of the present invention be with the mode of a contact see through lower edge 351/371 be carried on end face 341 or on the end face 361, so no matter wafer with which direction is seated on the chip bearing apparatus 30, can not hurt the active surface of wafer.
The above only is the preferred embodiments of the present invention, and all equalizations of doing according to claim of the present invention change and modify, and all should belong to covering scope of the present invention.
Claims (9)
1. chip bearing apparatus comprises:
Base; And
Many support bars, vertical fixing is on this base, and respectively this support bar comprises at least one support respectively with bearing wafer, and wherein this support has the last end face of inclination, should go up end face towards this base predetermined angular that tilts, and make the lower edge of the side of this wafer bear against on this on end face.
2. chip bearing apparatus as claimed in claim 1 wherein comprises many auxiliary support bars in addition, and it does not have any these supports, and this auxiliary support bar links via this base and this support bar.
3. chip bearing apparatus as claimed in claim 1, wherein this support bar comprises thermally-stabilised inorganic material.
4. chip bearing apparatus as claimed in claim 3, wherein this thermally-stabilised inorganic material is a silicon.
5. chip bearing apparatus as claimed in claim 3, wherein this thermally-stabilised inorganic material is a silicon dioxide.
6. chip bearing apparatus as claimed in claim 3, wherein this thermally-stabilised inorganic material is a carborundum.
7. chip bearing apparatus as claimed in claim 1, wherein this predetermined angular is between the 1-25 degree.
8. chip bearing apparatus as claimed in claim 1, wherein this predetermined angular is about 3 degree.
9. chip bearing apparatus as claimed in claim 1, wherein the spacing of this support is 2.5mm-15mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101032616A CN101303993A (en) | 2007-05-10 | 2007-05-10 | Wafer bearing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101032616A CN101303993A (en) | 2007-05-10 | 2007-05-10 | Wafer bearing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101303993A true CN101303993A (en) | 2008-11-12 |
Family
ID=40113825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007101032616A Pending CN101303993A (en) | 2007-05-10 | 2007-05-10 | Wafer bearing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101303993A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103280418A (en) * | 2013-05-07 | 2013-09-04 | 上海华力微电子有限公司 | High-temperature oxidization equipment |
| CN104152866A (en) * | 2014-08-20 | 2014-11-19 | 上海华力微电子有限公司 | Cassette and method for growing oxide layer by utilizing cassette |
| CN104658955A (en) * | 2013-11-21 | 2015-05-27 | 光洋热系统株式会社 | Substrate Supporting Structure |
| CN114426138A (en) * | 2021-11-05 | 2022-05-03 | 宁波润华全芯微电子设备有限公司 | Can be at spool box that oven used |
| WO2023093541A1 (en) * | 2021-11-25 | 2023-06-01 | 拉普拉斯新能源科技股份有限公司 | Boat structure |
-
2007
- 2007-05-10 CN CNA2007101032616A patent/CN101303993A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103280418A (en) * | 2013-05-07 | 2013-09-04 | 上海华力微电子有限公司 | High-temperature oxidization equipment |
| CN103280418B (en) * | 2013-05-07 | 2016-04-13 | 上海华力微电子有限公司 | High-temperature oxidization equipment |
| CN104658955A (en) * | 2013-11-21 | 2015-05-27 | 光洋热系统株式会社 | Substrate Supporting Structure |
| CN104658955B (en) * | 2013-11-21 | 2019-01-04 | 光洋热系统株式会社 | Substrate support structure |
| CN104152866A (en) * | 2014-08-20 | 2014-11-19 | 上海华力微电子有限公司 | Cassette and method for growing oxide layer by utilizing cassette |
| CN114426138A (en) * | 2021-11-05 | 2022-05-03 | 宁波润华全芯微电子设备有限公司 | Can be at spool box that oven used |
| CN114426138B (en) * | 2021-11-05 | 2024-09-27 | 宁波润华全芯微电子设备有限公司 | Box capable of being used in oven |
| WO2023093541A1 (en) * | 2021-11-25 | 2023-06-01 | 拉普拉斯新能源科技股份有限公司 | Boat structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20081112 |