CN108807259B - Substrate supporting structure - Google Patents
Substrate supporting structure Download PDFInfo
- Publication number
- CN108807259B CN108807259B CN201810869433.9A CN201810869433A CN108807259B CN 108807259 B CN108807259 B CN 108807259B CN 201810869433 A CN201810869433 A CN 201810869433A CN 108807259 B CN108807259 B CN 108807259B
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- substrate
- support
- supporting
- substrate support
- end side
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
Abstract
The invention provides a substrate supporting structure which can prevent a substrate from falling off from a supporting part or contacting to an untouchable range even if errors exist in conveying precision, installation precision of a device, precision of a supporting position and the like. A substrate support structure (1) is provided with a substrate support member (2) and a holding member (3). The substrate support member (2) extends from the base end side to the tip end side, and supports the substrate (W) to be processed by a support portion (2C) formed on the upper side. The holding member (3) holds the substrate support member (2) at both sides of the support position of the substrate (W) such that the support portion (2C) is inclined downward from the base end (2A) side toward the tip end (2B) side.
Description
The present application is a divisional application of an invention patent application having an application date of 09/17/2014, an invention name of "substrate support structure", and a national application number of "201410474841.6".
Technical Field
The present invention relates to a substrate support structure provided in a substrate heat treatment apparatus or the like for supporting a substrate in a substantially horizontal posture.
Background
Conventionally, when a substrate for liquid crystal and organic EL is subjected to heat treatment, the substrate is held inside a heat treatment apparatus so as to support the lower surface of the substrate. In this case, the peripheral portion (about 10mm from the outer edge) which is not affected even when the supporting portion is contacted is sometimes supported while avoiding the central portion of the substrate, and there is a limit that the contact tolerance range is narrow.
In order to overcome such a limitation, as shown in fig. 7, as a method of supporting the substrate W, the substrate W is supported by pins or balls 101 from directly below (see patent documents 1 and 2). In the figure, the region in the center of the substrate indicated by the double arrow A1 indicates the non-contact range, and the region around the substrate indicated by the double arrow A2 indicates the contact tolerance range.
Patent document 1: japanese patent laid-open publication No. 2002-100668
Patent document 2: japanese patent laid-open publication No. 2004-111786
However, when the substrate is supported from directly below, the substrate may fall off the support portion or come into contact with the inaccessible area A1 due to errors in conveyance accuracy, mounting accuracy of the apparatus, accuracy of the support position, and the like.
Disclosure of Invention
In view of the above-described problems, it is an object of the present invention to provide a substrate support structure capable of preventing a substrate from coming off a support portion or coming into contact with an inaccessible range even if there are errors in conveyance accuracy, mounting accuracy of a device, accuracy of a support position, and the like.
The present invention relates to a structure for supporting a substrate to be processed in a substantially horizontal posture at a predetermined supporting position in a processing space for storing and processing the substrate. The substrate support structure of the present invention includes a substrate support member. The substrate support member extends from the base end side to the tip end side, and supports the substrate to be processed by support portions inclined downward from the base end side to the tip end side on both sides of the support position.
The processing space is formed inside the processing container. Further, the holding members are provided on both sides of the supporting position on the inner surface of the sidewall of the processing container, and when the base end side of the substrate supporting member is held by these holding members, the substrate supporting member can be stably held.
According to this configuration, since the supporting portion of the substrate supporting member is inclined obliquely downward, the supporting portion can only contact the side end lower edge portion of the substrate regardless of the degree of warpage of the substrate. Therefore, it is not necessary to support the substrate from the directly lower side by the projection or the like, and there is no influence of the mounting accuracy of the substrate support member and the accuracy when the substrate is transported to the processing space and carried on the support.
Specifically, the substrate support member includes a base and a support. The base body has a shape extending from the base end side to the tip end side, and the support member has a support portion and is disposed on the base body so that the support portion is exposed from the upper surface of the base body. Thus, the support portion contacting the substrate can be formed as a support member, and the process can be simplified.
When the support member is cylindrical, it can be arranged to be rotatable about an axis extending in the longitudinal direction of the base. Thus, the impact when the substrate is placed on the support part is alleviated by the rotation of the support member, and the portion of the substrate in contact with the support part can be prevented from being damaged.
The support member is preferably made of resin or quartz.
In order to stably support the substrate, a plurality of substrate support members are provided on one side of the support position. When the holding member is a holder provided so as to face each other on both sides of the supporting position and extend in the depth direction of the processing space, it is easy to provide a plurality of substrate supporting members to one holding member.
According to the present invention, even if there is an error in the conveyance accuracy, the mounting accuracy of the apparatus, the accuracy of the support position, or the like, the substrate can be prevented from falling off the support portion or coming into contact with an inaccessible range.
Drawings
Fig. 1 (a) is a front cross-sectional view showing a substrate support structure according to an embodiment of the present invention, in a state before supporting a substrate. Fig. 1 (B) is a front cross-sectional view showing a state in which the same substrate is supported.
Fig. 2 is an exploded perspective view showing a substrate support member used in the substrate support structure.
Fig. 3 (a) is a plan view illustrating a state in which the substrate support member is mounted on the holding member. Fig. 3 (B) is a side view illustrating a state in which the substrate support member is mounted on the holding member.
Fig. 4 is a schematic configuration diagram showing an example of a configuration of a multi-stage substrate support structure in one processing container.
Fig. 5 is a schematic configuration diagram showing an example in which the substrate support structure is configured as a multi-stage unit.
Fig. 6 is a diagram showing an example of an angle adjustment mechanism of the substrate support member.
Fig. 7 is a front cross-sectional view showing a schematic structure of an example of a conventional substrate support structure.
Description of the reference numerals
W, W1, W2, W3 \8230andsubstrate
1-8230and substrate supporting structure
2 8230A substrate support member
2A 8230and base end
2B 8230a front end
2C 8230a support part
21' \ 8230and base body
21A 8230and concave part
21B 8230and bolt hole
22- (8230); bearing part
23 \ 8230and bolt
3 \ 8230and holding member
4-8230and treating container
4A 8230and the inner surface of side wall
100 v 8230and treating space
Detailed Description
Hereinafter, the structure of the substrate support structure according to the embodiment of the present invention will be described with reference to the drawings.
As shown in fig. 1, a substrate W to be processed (hereinafter, referred to as a "substrate") is accommodated and processed in a processing space 100 formed inside a processing container 4. The substrate support structure 1 supports the substrate W in a substantially horizontal posture at a predetermined support position in the processing space 100. The substrate support structure of the present invention is suitable for use in a batch furnace or the like of a substrate processing apparatus (e.g., a heat treatment apparatus or the like) that performs a certain process on a substrate. The present invention can be applied to a thin and warped substrate regardless of the material of the substrate. The substrate shape is not limited to a rectangular substrate, and may be a circular substrate such as a semiconductor wafer.
The substrate support structure 1 has a substrate support member 2 and a holding member 3.
The substrate support member 2 extends from the base end 2A side to the tip end 2B side, and includes a support portion 2C for supporting the substrate W on the upper side. More specifically, as shown in fig. 2, the substrate support member 2 includes: a base 21 extending from the base end 2A side to the leading end 2B side; and a support 22 that is provided with the support portion 2C and is disposed on the base 21 so that the support portion 2C is exposed from the upper surface of the base 21.
The material of the base 21 and the support 22 is not particularly limited, but when the substrate support structure 1 is applied to a heat treatment apparatus, a material having heat resistance is required. In particular, since the support 22 is a member directly contacting the substrate W, the material thereof is required not to damage the substrate W. As a material satisfying such a requirement, a resin or quartz material is preferable.
As shown in fig. 2, the support member 22 has a cylindrical shape. The support member 22 has a linear support portion 2C extending in the axial direction on the cylindrical peripheral surface. The shape of the support 22 is an example, and is not limited to the above shape.
As shown in fig. 2, the base body 21 has a prismatic shape. A recess 21A extending in the longitudinal direction is formed in the upper surface of the base 21. The support 22 is housed in the recess 21A. In the present embodiment, the recess 21A corresponds to the cylindrical shape of the support 22 and is formed in a half-pipe shape. Therefore, when the support 22 is accommodated in the recess 21A, the substantially half of the support 22 is exposed, and the support 22 is rotatable about an axis along the longitudinal direction of the base 21.
A bolt hole 21B passing through the axial center of the recess 21A penetrates the base 21 in the axial direction. The shapes of the base 21 and the recess 21A are examples and are not limited to the above shapes.
After the support 22 is accommodated in the recess 21A, the support 22 is attached to the base 21 by fitting the bolt 23 into the bolt hole 21B. The bolt 23 is inserted into the hollow portion of the support member 22 to prevent the support member 22 from coming off the base 21. In addition, the bolt 23 is provided so as not to interfere with the rotation of the support member 22.
As shown in fig. 3, the substrate supporting member 2 configured as described above is held by the holding member 3 such that the supporting portion 2C is inclined downward from the base end side toward the tip end side.
In the present embodiment, the holding member 3 is a member formed into a shape of a \12467bythe upper sheet portion 31, the side wall portion 32, and the bottom sheet portion 33. Such a \12467shapedmember is made, for example, by bending processing of a metal plate.
The substrate support member 2 is fixed to the side wall portion 32 of the holding member 3 at the base end portion of the base body 21 by bolts and nuts. The substrate support member 2 is attached to the base 21 in an inclined manner such that the base end is higher and the tip end is lower. At this time, the upper edge of the base end surface of the base 21 is brought into contact with the upper piece 31 of the holding member 3, whereby the base 21 is prevented from rotating, and the inclination of the base 21 is kept constant. Thus, if the support member 22 is attached to the recess 21A, the support member 22 is held such that the support portion 2C is inclined downward from the base end side toward the tip end side, as shown in fig. 1.
In order to stably support the substrate W, it is preferable to support the substrate W at a plurality of positions on one side of the support position of the substrate W in the processing space 100. In the case of a rectangular substrate, two substrate support members 2 supporting the front and rear corners may be provided. This enables the rectangular substrate to be supported more stably. In the present embodiment, the beam 7 extends in the depth direction of the processing space 100 on one side of the supporting position of the substrate W. Therefore, by attaching a plurality of holding members 3 in the longitudinal direction of the one-side beam 7, a plurality of substrate support members 2 can be arranged in parallel in this direction.
The number of stages of the substrate support structure constituted by the holding member 3 and the substrate support member 2 is not limited. That is, as shown in fig. 4, the substrate support structure 1 is provided in multiple stages on the inner surface 4A of the sidewall of the processing container 4, whereby a plurality of substrates W can be supported in the processing space 100 of one processing container 4.
As shown in fig. 5, as a multi-stage modification, the following configuration may be adopted: the processing container 4 having one substrate support structure 1 is formed as a flat unit, and a plurality of the units are stacked in multiple stages. This has the advantage that the number of stacked units can be freely arranged, and thus the number of stages of the substrate support structure can be arbitrarily set.
When the substrate W is supported by the substrate support structure 1 configured as described above, the substrate W is conveyed above the support position in the processing space 100 by a fork arm disposed at the tip of the robot arm of the conveying robot (not shown), as shown in fig. 1 (a). Next, the robot arm is lowered, and as shown in fig. 1 (B), the substrate W is carried on the support 22 of the substrate support member 2 facing each other on both sides of the support position. The substrate W is supported at both side ends thereof by the support portions 2C of the substrate support member 2.
The center portion of the substrate W supported in this manner, which is not directly supported by the substrate support member 2, sinks due to its own weight, and the substrate W is warped. However, the warpage varies depending on the thickness, size, and material of the substrate W. The degrees of warpage of the substrates W1, W2, and W3 shown in fig. 1 (B) increase in this order. The degree of warpage of the substrate may vary depending on the thickness, size or material of the substrate.
In the present invention, since the support portion 2C of the substrate support member 2 is inclined obliquely downward, the support portion 2C can be brought into contact with only the side end lower edge portion of the substrate W regardless of the degree of warpage of the substrate W. Therefore, it is not necessary to support the substrate W from the directly lower side by a projection or the like, and there is no influence of the mounting accuracy of the substrate support member 2 and the accuracy when the substrate W is transported to the processing space and carried on the support 22.
Further, since the support member 22 having the support portion 2C is rotatable, the impact when the substrate W is placed on the support portion 2C is alleviated by the rotation of the support member 22, and the portion of the substrate W contacting the support portion 2C can be prevented from being damaged. Further, by using the support portion 2C made of resin or quartz, the substrate W can be more reliably prevented from being damaged.
In addition, although the present embodiment describes the case where the substrate support member 2 is attached to the holding member 3 in a fixed state (non-rotatable), the substrate support member 2 may be attached to be rotatable so that the downward inclination angle of the support portion 2C can be changed according to the group of substrates W to be processed. For example, as shown in fig. 6, the substrate support member 2 is rotatably held at the base end portion with respect to the holding member 3 by the rotating shaft 5, a long hole 34 is provided in the holding member 3, a long hole 24 is provided in the base 21 of the substrate support member 2, and the tip end side of the substrate support member 2 is fixed by a pin 6 or the like at an arbitrary position where the long holes 34 and 24 intersect each other. In this way, the inclination angle of the support portion 2C can be adjusted.
All of the features in the above description of the embodiments are exemplary features and not restrictive features. The scope of the present invention is not limited to the above embodiments but is represented by the claims. The scope of the present invention includes the equivalent contents of the claims and any modifications within the scope of the claims.
Claims (5)
1. A substrate support structure for supporting a substrate to be processed in a horizontal posture at a predetermined support position in a processing space for storing and processing the substrate,
comprises a substrate supporting member extending from a base end side to a tip end side and supporting the substrate to be processed by a supporting portion inclined downward from the base end side to the tip end side on both sides of the supporting position,
the substrate support member includes:
a base extending from the base end side to the tip end side; and
a support member having the support portion and disposed on the base body so that the support portion is exposed from an upper surface of the base body,
the support member has a cylindrical side surface and is disposed to be rotatable about an axis along a longitudinal direction of the base.
2. The substrate support structure of claim 1, wherein the support is formed of resin or quartz.
3. The substrate support structure according to claim 1 or 2, wherein the processing space is formed inside a processing container, and holding members for holding a base end side of the substrate support member are provided on both sides of the supporting position on an inner surface of a sidewall of the processing container.
4. The substrate support structure of claim 1 or 2, wherein a plurality of the substrate support members are provided on a single side of the support location.
5. The substrate support structure according to claim 4, comprising holding members provided so as to oppose on both sides of the support position, extending in a depth direction of the processing space, and provided corresponding to a plurality of the substrate support members.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-241137 | 2013-11-21 | ||
| JP2013241137A JP6226712B2 (en) | 2013-11-21 | 2013-11-21 | Substrate support structure |
| CN201410474841.6A CN104658955B (en) | 2013-11-21 | 2014-09-17 | Substrate support structure |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410474841.6A Division CN104658955B (en) | 2013-11-21 | 2014-09-17 | Substrate support structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108807259A CN108807259A (en) | 2018-11-13 |
| CN108807259B true CN108807259B (en) | 2022-12-16 |
Family
ID=53249925
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410474841.6A Active CN104658955B (en) | 2013-11-21 | 2014-09-17 | Substrate support structure |
| CN201810869433.9A Active CN108807259B (en) | 2013-11-21 | 2014-09-17 | Substrate supporting structure |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410474841.6A Active CN104658955B (en) | 2013-11-21 | 2014-09-17 | Substrate support structure |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6226712B2 (en) |
| KR (1) | KR102182046B1 (en) |
| CN (2) | CN104658955B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7131334B2 (en) * | 2018-11-29 | 2022-09-06 | 株式会社安川電機 | Substrate support device, substrate transfer robot and aligner device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2392309A (en) * | 2002-08-22 | 2004-02-25 | Leica Microsys Lithography Ltd | Substrate loading and unloading apparatus |
| KR20040110563A (en) * | 2003-06-19 | 2004-12-31 | 삼성전자주식회사 | Panel supporting apparatus |
| CN101667530A (en) * | 2008-09-05 | 2010-03-10 | 东京毅力科创株式会社 | Processing apparatus and vertical thermal processing apparatus |
| JP2012224352A (en) * | 2011-04-18 | 2012-11-15 | Dainippon Printing Co Ltd | Substrate holding frame body and package of sheet substrate |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001358191A (en) * | 2000-06-09 | 2001-12-26 | Asm Japan Kk | Substrate support plate for semiconductor manufacturing apparatus |
| JP2002100668A (en) | 2000-09-25 | 2002-04-05 | Mitsubishi Materials Silicon Corp | Substrate support for heat treatment |
| JP2004014829A (en) * | 2002-06-07 | 2004-01-15 | Hitachi Kokusai Electric Inc | Heat treatment apparatus and method of manufacturing semiconductor device |
| JP2004111786A (en) | 2002-09-20 | 2004-04-08 | Hitachi Kokusai Electric Inc | Heat treatment equipment and manufacturing method of semiconductor device |
| JP2005340488A (en) * | 2004-05-27 | 2005-12-08 | Matsushita Electric Ind Co Ltd | Device for manufacturing electronic device |
| CN101303993A (en) * | 2007-05-10 | 2008-11-12 | 南亚科技股份有限公司 | Wafer bearing device |
| JP5261085B2 (en) * | 2008-09-05 | 2013-08-14 | 東京エレクトロン株式会社 | Substrate placing mechanism, substrate processing apparatus, substrate placing mechanism control method, and storage medium |
| JP5435039B2 (en) * | 2009-12-11 | 2014-03-05 | 株式会社Ｓｕｍｃｏ | CVD tray and film forming method using the same |
| US9330949B2 (en) * | 2012-03-27 | 2016-05-03 | SCREEN Holdings Co., Ltd. | Heat treatment apparatus for heating substrate by irradiating substrate with flash of light |
| JP5964630B2 (en) * | 2012-03-27 | 2016-08-03 | 株式会社Ｓｃｒｅｅｎホールディングス | Heat treatment equipment |
-
2013
- 2013-11-21 JP JP2013241137A patent/JP6226712B2/en active Active
-
2014
- 2014-07-18 KR KR1020140091028A patent/KR102182046B1/en active IP Right Grant
- 2014-09-17 CN CN201410474841.6A patent/CN104658955B/en active Active
- 2014-09-17 CN CN201810869433.9A patent/CN108807259B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2392309A (en) * | 2002-08-22 | 2004-02-25 | Leica Microsys Lithography Ltd | Substrate loading and unloading apparatus |
| KR20040110563A (en) * | 2003-06-19 | 2004-12-31 | 삼성전자주식회사 | Panel supporting apparatus |
| CN101667530A (en) * | 2008-09-05 | 2010-03-10 | 东京毅力科创株式会社 | Processing apparatus and vertical thermal processing apparatus |
| JP2012224352A (en) * | 2011-04-18 | 2012-11-15 | Dainippon Printing Co Ltd | Substrate holding frame body and package of sheet substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20150059072A (en) | 2015-05-29 |
| CN104658955A (en) | 2015-05-27 |
| JP6226712B2 (en) | 2017-11-08 |
| KR102182046B1 (en) | 2020-11-23 |
| CN104658955B (en) | 2019-01-04 |
| JP2015103565A (en) | 2015-06-04 |
| CN108807259A (en) | 2018-11-13 |
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