KR20090002930A - Transferring robot and apparatus of treating a substrate having the transferring robot - Google Patents

Transferring robot and apparatus of treating a substrate having the transferring robot Download PDF

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Publication number
KR20090002930A
KR20090002930A KR1020070067345A KR20070067345A KR20090002930A KR 20090002930 A KR20090002930 A KR 20090002930A KR 1020070067345 A KR1020070067345 A KR 1020070067345A KR 20070067345 A KR20070067345 A KR 20070067345A KR 20090002930 A KR20090002930 A KR 20090002930A
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KR
South Korea
Prior art keywords
substrate
robot
transfer
alignment
disposed
Prior art date
Application number
KR1020070067345A
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Korean (ko)
Inventor
양준혁
Original Assignee
세메스 주식회사
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Priority to KR1020070067345A priority Critical patent/KR20090002930A/en
Publication of KR20090002930A publication Critical patent/KR20090002930A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The transporting robot and the substrate processing apparatus are provided to arrange the notch while transferring the substrate and to reduce the cost and space. The transporting robot(600) comprises the body of robot(610), the robot arm(620), and the cancer blade(630) and the aligner(640). The robot arm is disposed on the body of robot to transfer the substrate having the notch. The robot arm is combined on the center region of the body of robot in order to be rotatable. The arm blade includes the alignment edge part(634) arranged in the end connected to the robot arm. The aligner is arranged on the seating surface.

Description

TRANSFER ROBOT AND APPARATUS OF TREATING A SUBSTRATE HAVING THE TRANSFERRING ROBOT}

The present invention relates to a transfer robot and a substrate processing apparatus, and more particularly, to a transfer robot and a substrate processing apparatus for aligning a substrate during transfer of the substrate.

The semiconductor manufacturing process includes a plurality of unit processes, in which a semiconductor substrate moves between devices that perform the unit processes. For example, the substrate is transferred from an etching process to a deposition process or from a manufacturing process to a test process, respectively. The transferred substrate goes through the corresponding unit process, and the completed substrate is transferred for the next process. At this time, the substrate should be aligned in a constant direction before each unit process. This is because each unit process is designed based on a constant direction of the substrate.

The semiconductor manufacturing apparatus includes a process chamber for performing a series of processes on a semiconductor substrate, and various substrate transfer apparatuses for transferring or receiving a substrate to the process chamber. In particular, an IN-LINE type semiconductor manufacturing apparatus has a process system in which at least one transfer chamber having a transfer robot for transferring a substrate and process chambers arranged on both sides of the transfer chamber are arranged in parallel in series. Have them.

In the in-line type semiconductor device, the first aligned direction is changed when the first loaded substrate passes through a multi-step process system. Therefore, when the alignment direction of the substrate to be designed based on a certain direction is changed, the in-line type semiconductor device is arranged between the transfer chamber and the adjacent transfer chamber to separate the alignment device for aligning the substrate in a predetermined direction It includes more. As a separate device is additionally arranged, a problem arises in that the overall foot-print of the semiconductor manufacturing apparatus increases and the overall process time increases.

One object of the present invention is to provide a transfer robot for aligning a substrate during transfer of the substrate.

Another object of the present invention is to provide a substrate processing apparatus having the transfer robot.

According to embodiments of the present invention for achieving the above object, the transfer robot includes a robot body, robot arm, arm blade and the alignment portion. The robot arm is disposed on the robot body to transport a substrate having a notch for indicating a set direction. The arm blade extends from the end of the robot arm and has a seating surface for seating the substrate. In addition, the alignment unit is disposed on the seating surface, and rotates the substrate in a predetermined direction so that the notch portion of the substrate is directed in the predetermined direction while the robot arm transports the substrate.

According to an embodiment of the present invention, the robot arm may be coupled to be rotatable based on a central portion of the robot body.

According to an embodiment of the present invention, the arm blade is disposed at the end connected to the robot arm, and further includes an alignment edge portion for seating and fixing the substrate by interviewing a portion of the outer surface of the substrate.

According to an embodiment of the present invention, the notch unit includes a driving unit for rotating the alignment unit in a predetermined direction so as to face the set direction.

According to embodiments of the present invention for achieving the above another object, the substrate processing apparatus includes a process chamber and a transfer chamber having a transfer robot for transferring a substrate from or to the substrate from the process chamber. . The transfer robot includes a robot body, a robot arm, an arm blade, and an alignment unit. The robot arm is disposed on the robot body to transport a substrate having a notch for indicating a set direction. The arm blade extends from the end of the robot arm and has a seating surface for seating the substrate. In addition, the alignment unit is disposed on the seating surface, and rotates the substrate in a predetermined direction so that the notch portion of the substrate faces the set direction while the robot arm transports the substrate.

According to an embodiment of the present invention, the notch unit includes a driving unit for rotating the alignment unit in a predetermined direction so as to face the set direction.

According to an embodiment of the present invention, a load port in which a container containing the substrates is placed, a substrate transfer module disposed adjacent to the load port, and carrying the substrate in and out of the container, and between the substrate transfer module and the transfer chamber. It further comprises a load lock chamber disposed to receive the substrate.

According to the present invention, by aligning the notch portion during the transfer of the substrate by the alignment portion disposed on the transfer robot, it is possible to reduce the overall foot-print by reducing the cost and space of the installation of a separate substrate alignment device have.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. In describing the drawings, similar reference numerals are used for similar components. In the accompanying drawings, the dimensions of the structures are shown in an enlarged scale than actual for clarity of the invention.

Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "having" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described in the specification, and that one or more other features It should be understood that it does not exclude in advance the possibility of the presence or addition of numbers, steps, actions, components, parts or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

1 is a schematic diagram illustrating a substrate processing apparatus according to embodiments of the present invention.

Referring to FIG. 1, a substrate processing apparatus 100 according to embodiments of the present invention may include a load port 200, a substrate transfer module 300, a load lock chamber 400, a transfer chamber 500, and a process chamber ( 700).

The load port 200 has a container (not shown) loaded with a plurality of substrates to be processed in the process chambers 700 to be described later by an automation system (not shown). The container is a means for accommodating a plurality of substrates in which the same process is performed in a predetermined number of units and transferring the same to a process facility such as each process chamber. For example, a front opening integrated pod (FOUP) is used. do.

The substrate transfer module 300 is disposed adjacent to one side of the load port 200. For example, the substrate transfer module 300 includes a transfer unit 310. The transfer unit 310 carries in and out the substrate W loaded in the container of the load port 200.

The load lock chamber 400 is disposed on one side of the substrate transfer module 300. The load lock chamber 400 includes a loading chamber in which substrates transferred to the process chambers 700 are temporarily placed, and an unloading chamber in which substrates received from the process chambers 700 are temporarily placed after the process is completed. When the substrate is transferred into the load lock chamber 400, a controller (not shown) decompresses the interior of the load lock chamber 400 to an initial low vacuum state, whereby the foreign material is transferred to the process chambers 700 and the transfer chamber. It can be prevented to flow into the 500.

The transfer chamber 500 is disposed on one side of the load lock chamber 400. The transfer chamber 500 includes a transfer robot 600 disposed therein.

The transfer robot 600 includes a robot body 610, a robot arm 620, an arm blade 630, and an alignment unit 640.

The robot body 610 is disposed in one region of the transfer chamber 500.

The robot arm 620 is formed on the upper surface of the robot body 610 and extends in one direction from the center portion with respect to the center portion of the robot body 610. Specifically, the robot arm 620 has a central axis connected to the upper center portion of the robot body 610. For example, the robot arm 620 may transfer the substrate to the plurality of process chambers 700. The robot arm 620 is rotatably formed with respect to the central axis in order to transfer substrates to the process chambers 700. That is, the robot arm 620 is coupled to be rotatable based on the central portion of the robot body 610.

The arm blade 630 extends from the end of the robot arm 620. The arm blade 630 has, for example, a tong shape for supporting a substrate. Alternatively, the arm blade 630 may have various shapes for supporting the substrate. For example, the arm blade 630 may have a linear shape formed extending in the longitudinal direction of the robot arm 620. In addition, the arm blade 630 may have a circular shape similar to the shape and size of the substrate to sufficiently support the substrate.

The alignment unit 640 is disposed in one region of the arm blade 630. In embodiments of the present invention, the alignment unit 640 rotates the substrate in a predetermined direction while transferring the substrate so that the substrate is directed in a desired direction. Therefore, an aligner (not shown) for rotating or moving the substrate to face in a predetermined direction is not separately disposed, and the alignment portion 640 disposed on the transfer robot 600 aligns the substrate, thereby reducing the arrangement space of the devices. This can reduce the overall foot-print.

The alignment unit 640 will be described in detail with reference to FIGS. 2 to 4.

The process chambers 700 may be provided with a plurality of chambers for performing various substrate processes. For example, process chambers 700 may include a chemical vapor deposition (CVD) chamber configured to supply reactant gases for deposition of a material film on a substrate, an etching chamber configured to supply gas for etching of the deposited material film, or a photo process. An ashing chamber or the like configured to remove the photoresist layer remaining on the substrate.

2 is a perspective view illustrating the transfer robot of FIG. 1, and FIGS. 3 and 4 are plan views illustrating a process of aligning a substrate by the alignment unit of FIG. 2.

2 to 4, the transfer robot 600 includes a robot body 610, a robot arm 620, an arm blade 630, and an alignment unit 640.

The robot body 610 is disposed in one region of the transfer chamber 500. The robot body 610 may further include driving means (not shown) for driving the robot arm 620. The driving means may be made of a driving means such as a stepping motor. The robot body 610 may transmit power to the robot arm 620 to rotate the robot arm 620 or extend its length.

The robot arm 620 is formed on the upper surface of the robot body 610, the robot arm 620 has a central axis connected to the central portion of the upper surface of the robot body 610. For example, the robot arm 620 is rotatably formed about the central axis to transfer the substrate to the plurality of process chambers 700. That is, the robot arm 620 is coupled to be rotatable based on the central portion of the robot body 610.

The robot arm 620 carries a substrate having a notch 622. For example, the robot arm 620 may rotate based on the upper center portion of the robot body and extend the arm of the robot arm 620 to transfer the substrate to the set process chamber 700. Here, the notch 622 refers to a specific mark on a portion of the substrate in order to display the set direction of the substrate. In embodiments of the present invention, the notch 622 may be formed by removing a portion of the edge of the substrate with a letter 'V'. In other embodiments of the present disclosure, a predetermined direction of the substrate may be displayed by using a substrate flat zone in which a portion of an edge of the substrate is flat to mark a specific point of the substrate.

The arm blade 630 extends from the end of the robot arm 620. In embodiments of the present invention, the arm blade 630 has a tong shape for supporting the substrate. Alternatively, the arm blade 630 may have various shapes for supporting the substrate.

The arm blade 630 has a seating surface 632 for seating the substrate. For example, the seating surface 632 interviews a portion of the lower surface of the substrate to seat the substrate. Here, the seating surface 632 may be made of a flat surface to seat the substrate. For example, the arm blade 630 may further include a vacuum suction unit (not shown) for stably supporting the substrate. The vacuum adsorption unit may support the substrate by vacuum adsorption using the supplied vacuum. For example, the vacuum suction unit may be disposed in the form of a plurality of vacuum holes (not shown) on the upper surface of the seating surface 632 to stably support the substrate. Accordingly, the arm blade 630 may support the substrate more stably by using the seating surface 632 and / or the vacuum suction unit.

The arm blade 630 further includes an alignment edge portion 634 disposed at an end connected to the robot arm 620. That is, the alignment edge portion 634 is formed at the site where the alignment arm 620 is interviewed. The alignment edge portion 634 is formed to protrude upward from the seating surface 632 of the arm blade 630. For example, the alignment edge portion 634 aligns the substrate seated on the seating surface 632 of the arm blade 630. The alignment edge portion 634 interviews a portion of the outer surface of the substrate to be seated to fix the substrate. The alignment edge portion 634 may have a curved shape corresponding to the outer surface of the substrate.

The alignment portion 640 is disposed on the seating surface 632 of the arm blade 630. For example, the alignment unit 640 may be formed in a size corresponding to the size of the seating surface 632. As shown, the alignment portion 640 has the shape of a circle. This is for the alignment unit 640 to uniformly support the lower surface of the substrate. In contrast, the alignment unit 640 may have various shapes as long as it can stably support the substrate.

Meanwhile, when the alignment unit 640 is disposed on the seating surface 632, the height may vary between some regions of the seating surface 632 on which the alignment unit 640 is disposed and the remaining regions. That is, the area of the seating surface 632 in which the alignment part 640 is disposed is formed to protrude more than the remaining area. Therefore, in order to maintain the entire surface of the seating surface 632, when forming the seating surface 632, an area where the alignment unit 640 is to be formed may be lower than that of the remaining areas. Although not shown, the upper surface of the alignment portion 640 and the upper surface of the seating surface 632 may have substantially the same height. Therefore, the substrate seated on the seating surface 632 and the alignment unit 640 can be stably supported.

In embodiments of the present invention, the alignment unit 640 rotates and aligns the substrate. Specifically, the alignment unit 640 rotates the substrate in a predetermined direction while transferring the substrate so that the substrate is directed in a desired direction. For example, when the substrate transferred from the outside is seated on the seating surface 632 and the alignment portion 640, the substrate may not be seated in the desired direction. At this time, the alignment unit 640 rotates the substrate in a set direction to align the substrate in a desired direction. For example, when the notch 622 of the substrate faces a direction other than the set direction, the alignment unit 640 rotates the substrate in a predetermined direction to align the substrate so that the notch 622 faces the set direction. . For example, the notch 622 may be set toward the alignment edge 634 when the substrate is seated on the seating surface 632 of the arm blade 630. At this time, when the notch portion 622 of the substrate seated on the seating surface 632 faces in a direction other than the set direction, the alignment portion 640 so that the notch portion 622 faces the direction of the alignment edge portion 624. ) May rotate the substrate. Thus, the substrates may be aligned in a set direction to improve the efficiency of the process for the substrate in subsequent processes. Furthermore, there is no need to separately configure an aligner (not shown) for aligning the substrate, thereby reducing the cost of the part and utilizing the space efficiently to reduce the overall footprint.

The transfer robot 600 may further include a driving unit 650 for rotating the alignment unit 640. The driving unit 650 is disposed at a position adjacent to the alignment unit 640 and connected to the alignment unit 640. For example, when the alignment unit 640 rotates the substrate to align the substrate, the driving unit 650 provides a driving force for the alignment unit 640 to rotate.

In other embodiments of the invention, the transfer robot 600 may include an alignment member (not shown) for aligning the substrate. The alignment member may comprise a notch stopper (not shown) and drive means (not shown). The notch stopper may be formed to correspond to the size and shape of the notch 622 to be inserted into the notch 622 of the substrate. The driving means may rotate the notch stopper inserted in the notch 622 in a predetermined direction. Therefore, when the direction of the substrate seated on the seating surface 632 of the arm blade 630 is different from the set direction, the notch stopper may be inserted into the notch portion 622 of the substrate. In addition, the driving means may rotate the notch stopper in a predetermined direction to align the substrate toward the set direction.

In addition, the transfer robot 600 may further include a sensor unit (not shown) for sensing whether the substrate faces the set direction. The sensor unit may be arranged to be connected to the driving unit 650. The sensor unit inputs a sensing signal to the driving unit 650 when the substrate is not aligned in the set direction, and the driving unit 650 receiving the sensing signal rotates the alignment unit 640 in a predetermined direction to rotate the substrate in the set direction. You can sort by.

5 is a schematic diagram illustrating a substrate processing apparatus according to another embodiment of the present invention. Substrate processing apparatus according to another embodiment of the present invention has the same configuration as the substrate processing apparatus according to the embodiments of the present invention described above, except for the process chamber and the transfer chamber further disposed, the duplicated description The same reference numerals and names are used for the same components.

Referring to FIG. 5, in another embodiment of the present invention, the substrate processing apparatus 100 is a method in which two process chambers are mounted in one transfer chamber, and an in-line transfer chamber type. )to be. For example, the substrate processing apparatus 100 may continuously connect the second transfer chamber and the third transfer chamber to the first transfer chamber to improve the overall yield according to a user's request. In other embodiments of the present invention, the substrate processing apparatus includes a first transfer chamber 800 and a second transfer chamber 900 connected to one side of the first transfer chamber 800. The first process chambers 810 may be disposed at both sides of the first transfer chamber 800, and the second process chambers 910 may be disposed at both sides of the second transfer chamber 900.

In other embodiments of the present invention, the substrate transfer module 300 delivers the substrate from the load port 200 to the first load lock chamber 820. In addition, the first transfer robot 830 of the first transfer chamber 800 receives the substrate from the first load lock chamber 820 and transfers the substrate to the second load lock chamber 920. In addition, the second transfer robot 930 disposed in the second transfer chamber 900 receives the substrate from the second load lock chamber 920, and performs the second process chamber 910 to perform a series of processes on the substrate. Transfer the substrate).

In other embodiments of the invention, the first transfer robot 830 transfers the substrate to the second load lock chamber 920, and the second transfer robot 930 transfers the substrate from the second load lock chamber 920. Received. At this time, the direction in which the first transfer robot 830 delivers the substrate to the second load lock chamber 920 and the direction in which the second transfer robot 930 receives the substrate from the second load lock chamber 920 are mutually different. can be different. For example, the substrate seated on the first transfer robot 830 and the substrate seated on the second transfer robot 930 may substantially face the opposite direction by 180 °.

Accordingly, the first and second transfer robots 830 and 930 respectively include alignment units 640 of FIG. 2 for rotating the substrate in a predetermined direction. Here, the shape, structure, arrangement and operation of the first and second transfer robots 830 and 930 and the alignment units are substantially the same as those described with reference to FIGS. 2 to 4. Accordingly, the alignment parts may align the substrate in a predetermined direction without using an aligner disposed between the first transfer robot 830 and the second transfer robot 930 to align the substrate.

In this way, the alignment parts disposed in the first and second transfer robots 830 and 930 align the substrate, thereby reducing the cost of the separate aligner and using the space efficiently, thereby reducing the overall foot-print. print) can be reduced.

According to the present invention, a substrate processing apparatus includes an alignment portion disposed in a transfer robot in a transfer chamber, and the alignment portion aligns the notch portion of the substrate in a set direction while transferring the substrate. Therefore, there is no need to separately provide a substrate alignment apparatus for aligning the substrate during the substrate transfer process, thereby reducing manufacturing cost and manufacturing time and reducing the overall footprint.

As described above, although described with reference to preferred embodiments of the present invention, those skilled in the art will be variously modified without departing from the spirit and scope of the invention described in the claims below. And can be changed.

1 is a schematic diagram illustrating a substrate processing apparatus according to embodiments of the present invention.

FIG. 2 is a perspective view illustrating the transfer robot of FIG. 1. FIG.

3 and 4 are plan views illustrating a process of aligning a substrate by the alignment unit of FIG. 2.

5 is a schematic diagram illustrating a substrate processing apparatus according to other embodiments of the present invention.

<Description of the symbols for the main parts of the drawings>

100: substrate processing apparatus 200: load port

300: substrate transfer module 400: load lock chamber

500: transfer chamber 600: transfer robot

610: robot body 620: robot arm

622: notch 630: arm blade

640: alignment unit 650: driving unit

700: process chamber 800: first transfer chamber

810: First process chamber 820: First load lock chamber

830: first transfer robot 900: second transfer chamber

910: Second process chaber 920: Second load lock chamber

930: second transfer robot

Claims (8)

Robot body; A robot arm disposed on the robot body for transporting a substrate having a notch for displaying a set direction; An arm blade extending from an end of the robot arm and having a seating surface for seating the substrate; And And an alignment part disposed on the seating surface, the alignment part rotating the substrate in a predetermined direction so that the notch of the substrate faces the predetermined direction while the robot arm is transferring the substrate. The transfer robot of claim 1, wherein the robot arm is rotatably coupled to a central portion of the robot body. The transfer robot of claim 1, wherein the arm blade further comprises an alignment edge portion disposed at an end connected to the robot arm, the alignment portion configured to interview a portion of an outer surface of the substrate to seat and fix the substrate. The transfer robot according to claim 1, further comprising a driving unit for rotating the alignment unit in a predetermined direction such that the notch unit faces the set direction. Process chambers; And A transfer chamber having a transfer robot for transferring a substrate from the process chamber or receiving the substrate from the process chamber, The transfer robot is a robot arm disposed on the robot body for transferring a substrate having a notch for displaying a set direction, the robot arm is disposed extending from the end of the robot arm, the seating surface for seating the substrate A substrate blade disposed on the seating surface, and an alignment portion arranged to rotate and align the substrate in a predetermined direction so that the notch portion of the substrate faces the set direction while the robot arm transfers the substrate. Device. 6. The substrate processing apparatus of claim 5, further comprising a drive unit for rotating the alignment unit in a predetermined direction such that the notch unit faces the set direction. The method of claim 5, A load port on which a container containing the substrates is placed; A substrate transfer module disposed adjacent to the load port and carrying in and out of the substrate from the container; And And a load lock chamber disposed between the substrate transfer module and the transfer chamber to receive the substrate. 8. The substrate processing apparatus of claim 7, wherein the substrate transfer module further comprises a transfer unit for carrying in and out the substrate.
KR1020070067345A 2007-07-05 2007-07-05 Transferring robot and apparatus of treating a substrate having the transferring robot KR20090002930A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180077914A (en) * 2016-12-29 2018-07-09 주식회사 테스 Substrate etching control method of substrate etching
CN110808217A (en) * 2019-10-22 2020-02-18 长江存储科技有限责任公司 Replacement device and replacement method for wafer limiter of manipulator

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180077914A (en) * 2016-12-29 2018-07-09 주식회사 테스 Substrate etching control method of substrate etching
CN110808217A (en) * 2019-10-22 2020-02-18 长江存储科技有限责任公司 Replacement device and replacement method for wafer limiter of manipulator

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