JP5682910B2 - Substrate holder and substrate transfer device - Google Patents

Description

  The present invention relates to a substrate holder and a substrate transfer device.

  The substrate holder that supports the substrate is scratched or cracked at the place where the substrate receiving part and the substrate to be processed come into contact with each other due to the impact when the substrate to be processed is set or the vibration caused by the vibration during transfer after setting. It was easy to generate | occur | produce and it was calculated | required to suppress this. In particular, such a problem is remarkable in a so-called vertical type substrate holder that holds a substrate to be processed in a vertical state. Thus, conventionally, a vertical substrate holder is known which has a plurality of substrate receiving portions that contact the lower end surface of the substrate to be processed and support the substrate to be processed by this end surface (see, for example, Patent Document 1). ). The substrate receiving portion is provided with an elastic portion that is deformed by receiving a force from the substrate to be processed to the lower side, and that works upward by being deformed. By providing this elastic portion, the substrate to be processed is scratched at the place where the substrate receiving portion and the substrate to be processed come into contact with each other due to the impact at the time of setting the substrate to be processed or the impact caused by the vibration at the time of transfer after setting. It prevents the occurrence of cracks.

JP 2007-262539 A (Claim 1 etc.)

  However, in Patent Document 1, there is a problem that a problem occurs in that the substrate to be processed is scratched or cracked when the film formation surface of the substrate to be processed contacts the frame portion. Note that such a problem occurs not only when the substrate is held vertically to the floor but also when the substrate is held horizontally, even when the substrate is held horizontally. There is.

  Accordingly, an object of the present invention is to solve the above-mentioned problems of the prior art, and it is possible to prevent the processing surface of the substrate to be processed from being damaged or cracked due to an impact at the time of setting or transporting the substrate. It is intended to provide a holder and a substrate transfer apparatus using the holder.

The substrate holder of the present invention has a contact portion that contacts the outer peripheral portion of the substrate to be processed and an opening that exposes the surface to be processed of the substrate to be processed. A support member that supports the substrate to be processed by the contact portion in a state where the processing surface is exposed from the opening , and has a holding member that holds an end portion of the substrate to be processed . A tape-shaped cushioning material with high shock absorption is provided at least at a position facing the substrate to be processed. In the present invention, since the buffer material is provided in the contact portion that contacts the outer peripheral portion of the substrate to be processed on the surface to be processed, the substrate is processed on the surface to be processed due to an impact at the time of setting or transporting the substrate. Scratches and cracks can be prevented from occurring.

A protrusion is formed on the contact portion of the substrate holder, and the cushioning material is provided with an opening corresponding to the protrusion, and the opening is fitted to the protrusion to with a cushioning material is placed in abutment, to press the periphery of the opening of the cushioning material covering the protruding portion exposed from the opening portion, and a high front Kiho support member is a shock absorbing elastic It is preferable to consist of a member. By providing in this way, it is possible to suppress the occurrence of scratches and cracks on the surface to be processed of the substrate to be processed due to the impact at the time of setting or transporting the substrate, and the positioning of the cushioning material is easier and more reliable. It can be carried out.

  It is preferable that a plurality of the holding members are provided apart from each other over the end portion of the substrate. By providing a plurality of components apart from each other, it is possible to reduce the component material and to suppress the amount of gas generated from the component.

  The holding member has a prismatic portion that covers the protrusion and presses the periphery of the opening of the cushioning material, and the prismatic portion is fixed to the contact portion by a fixing member that passes through the center of the prismatic portion. It is preferred that By being configured in this manner, if the prismatic part is rotated around the fixing member, the holding member can be prevented from rattling during transportation due to the wear of the holding member, and the substrate to be processed can be further improved. It can suppress that a crack and a crack generate | occur | produce on the to-be-processed surface.

  As a preferred embodiment of the present invention, the holding member is an upper end holding member that supports the upper end of the substrate to be processed, or a lower end holding member that supports the lower end of the substrate to be processed. Can be mentioned.

  A substrate transfer apparatus according to the present invention includes any one of the substrate holders described above. By including any of the substrate holders described above, it is possible to suppress the occurrence of scratches or cracks on the surface to be processed of the substrate to be processed due to an impact at the time of setting or transporting the substrate.

According to the substrate holder and the substrate transport apparatus of the present invention, it is possible to achieve an excellent effect that it is possible to suppress the occurrence of scratches and cracks on the surface to be processed due to an impact at the time of setting or transporting the substrate.

3A is a perspective view and FIG. 2B is a cross-sectional view taken along line A-A ′ of the substrate holder according to the first embodiment. It is a perspective view of the substrate holder concerning Embodiment 2. FIG. 3 is a cross-sectional view taken along line B-B ′ of FIG. 2. It is sectional drawing in the A-A 'line of FIG. It is a perspective view of the substrate holder concerning Embodiment 3. FIG. It is sectional drawing in the A-A 'line of FIG. It is the schematic diagram and principal part expanded sectional view of a board | substrate conveyance apparatus using the board | substrate holder concerning Embodiment 1. FIG. (A) The schematic diagram of another board | substrate conveyance apparatus using the board | substrate holder concerning Embodiment 1, (b) It is sectional drawing in the XX of (a). FIG. 6 is a partially enlarged view showing an installation state of another substrate transfer apparatus using the substrate holder according to the first embodiment. It is sectional drawing in the (a) AA line of FIG. 9, (b) It is sectional drawing in the BB line.

(Embodiment 1)
An embodiment according to the substrate holder of the present invention will be described with reference to FIG. The substrate holder 1 includes a substantially rectangular frame-shaped support member 11 made of, for example, SUS. The support member 11 includes side wall portions 111 that surround four sides. In addition, the support member 11 includes a contact portion 112 that contacts an outer peripheral portion of the processing substrate S1 on the processing surface side, and an opening 113 formed so as to expose the processing surface. The abutting part 112 is a flange part provided on one side of the side wall part 111 so as to be perpendicular to the side wall part 111. The side wall portion 111 and the contact portion 112 define an accommodation portion 114 that accommodates the substrate to be processed S1 as shown in FIG. The accommodating portion 114 accommodates the substrate to be processed S <b> 1, and the surface to be processed of the substrate to be processed S <b> 1 accommodated in the accommodating portion 114 is exposed from the opening 113. The accommodating portion 114 is configured to be slightly larger than the substrate to be processed S1 so as to easily accommodate the substrate to be processed S1.

  The substrate holder 1 is held at a slight angle so as to be substantially vertical by a substrate transfer device described later. Thereby, the substrate S1 accommodated in the accommodating portion 114 of the substrate holder 1 is stably held by the substrate holder 1.

  When the substrate to be processed S1 is accommodated in the accommodating portion 114, or when the substrate to be processed S1 is accommodated in the accommodating portion 114 and the substrate holder 1 is transported, the outer periphery of the surface to be processed of the substrate to be processed S1 is in contact with the contact portion. Since the surface to be processed of the substrate to be processed S1 that comes into contact with the contact portion 112 is liable to be cracked or chipped by contacting the portion 112, it is necessary to suppress this.

  Therefore, in the present embodiment, the buffer member 12 is provided in the contact portion 112 to absorb the impact of the substrate to be processed S1, and the contact portion 112 that is likely to occur when the substrate to be processed S1 is transported or when the substrate to be processed S1 is installed. Cracks and chipping of the surface to be processed that come into contact with the surface. The cushioning material 12 is in a tape shape and is provided so as to cover each side of the contact portion 112 from the four cushioning materials 12. That is, the substrate holder 1 is configured to cover the peripheral edge of the opening 113 with the four cushioning materials 12. The buffer material 12 is made of a material having high heat resistance (200 to 280 ° C.) and high shock absorption. Examples of such a buffer material 12 include polyimide, polyamideimide, polyether ether ketone, polyphenylene sulfide, perfluoroalkyl vinyl ether, and the like. In this embodiment, a Kapton (registered trademark) tape made of polyimide is used. In the present embodiment, the cushioning material 12 is fixed to the contact portion 112 with an adhesive (not shown) having high heat resistance.

(Embodiment 2)
The substrate holder 1A according to the second embodiment shown in FIGS. 2 to 4 is a substrate to be processed S2 larger than the substrate S1 to be processed supported by the substrate holder 1 (see FIG. 1) according to the first embodiment shown in FIG. It is for supporting. In the second embodiment, the same components as those in the first embodiment are denoted by the same reference numerals. The substrate holder 1 </ b> A in the present embodiment is provided with a holding member for the substrate S <b> 2 to be processed in the contact portion 112 in order to hold a substrate larger than the substrate holder 1 according to the first embodiment.

A buffer material 12A is provided in the contact portion 112 that contacts the outer peripheral portion of the support substrate 11 on the processing surface side of the processing substrate S2. The buffer material 12A is made of the same material as that of the first embodiment, and each has a tape shape. Four cushioning materials 12A are provided so as to cover the entire contact portion 112, that is, the periphery of the opening 113, and each have a plurality of positioning openings 121. In the present embodiment, the contact portion 112 is provided with a plurality of convex portions 115 spaced apart from each other, and positioning openings 121 formed in the cushioning material 12A are fitted into the convex portions 115 and positioned. Yes. In this state, the cushioning material 12A has the pressing member 13 that supports the left and right ends of the substrate to be processed S2, the upper end holding member 14 that supports the upper end side of the substrate to be processed S2, and the lower end side of the substrate to be processed S2. It is fixed to the contact portion 112 by a supporting lower end side holding member 15. The pressing member 13, the upper end side holding member 14, and the lower end side holding member 15 are holding members described in the claims.

  Since the upper end side holding member 14, the lower end side holding member 15, and the pressing member 13 are respectively in contact with the substrate to be processed S2, they are made of an elastic member in order to suppress cracking or chipping of the substrate to be processed S2. It is preferable. Examples of such elastic members include polyimide, polyamideimide, polyetheretherketone, polyphenylene sulfide, perfluoroalkyl vinyl ether, and the like, and Vespel (registered trademark) made of polyimide is used in the present embodiment.

  The pressing member 13 will be described. The pressing member 13 is configured to press and hold the cushioning material 12A and to contact the end surface of the substrate to be processed S2 at the periphery of the pressing member 13, whereby the substrate to be processed S2 can be held in contact. Is possible. A plurality of pressing members 13 are provided on the left and right contact portions 112 of the substrate holder 1 </ b> A so as to be separated from each other in the longitudinal direction of the contact portion 112. The installation position of the pressing member 13 is a position corresponding to the convex portion 115 formed on the left and right contact portions 112 of the substrate holder 1A. Further, the pressing member 13 is slightly wider between the opposing pressing members 13 than between the processing substrates S2 so that the processing substrate S2 can be easily accommodated in the accommodating portion 114, and the processing substrate S2 always has both ends. Is not held by the pressing member 13.

  The pressing member 13 includes a pressing portion main body 131. The pressing portion main body 131 has a substantially columnar shape and can easily accommodate the substrate to be processed S2 in the accommodating portion 114. In the pressing portion main body 131, a pressing portion recess 132 is formed at the central portion on one side (the contact portion 112 side). The pressing portion concave portion 132 has a shape corresponding to the convex portion 115. In the center of the pressing portion main body 131, a pressing portion through hole 133 that penetrates the pressing portion main body 131 is formed. The pressing portion through-hole 133 communicates with a convex opening 116 formed at the center of the convex portion 115. The pressing member 13 presses and holds the cushioning material 12 </ b> A on the outer peripheral side of the pressing portion recess 132 of the pressing portion main body 131.

  The case where this pressing member 13 is fixed to the contact part 112 is demonstrated. First, the positioning opening 121 formed in the buffer material 12 </ b> A is fitted to the convex portion 115 of the contact portion 112, and the buffer material 12 </ b> A is installed in the contact portion 112. After that, the pressing portion recess 132 is fitted into the convex portion 115 to install the pressing member 13, and the edge of the positioning opening 121 of the cushioning material 12 </ b> A is pressed by the peripheral portion of the pressing portion concave portion 132 of the pressing portion main body 131. . In this pressed state, the screw 134 is inserted and fixed in the pressing portion through-hole 133 and the convex portion opening 116 to fix the pressing member 13 to the abutting portion 112, and at the same time outer peripheral side than the pressing portion concave portion 132 of the pressing portion main body 131. Then, the buffer material 12A is pressed and held on the contact portion 112, and the buffer material 12A is fixed to the contact portion 112.

  As described above, in the present embodiment, when the cushioning material 12A is fixed to the contact portion 112 by the pressing member 13, the positioning opening 121 is fitted to the convex portion 115 and fixed after positioning. Further, the entire surface of one side of the contact portion 112 can be covered with the cushioning material 12A. Thereby, it can suppress that a to-be-processed substrate S2 contacts the contact part 112, and a crack and a chip | tip generate | occur | produce. In addition, if the positioning accuracy is low, the buffer material is exposed from the opening 113, and the buffer material portion may be charged up at the time of film formation and abnormal discharge may occur. Since 121 can be fitted and accurately positioned and fixed to the projection 115, the cushioning material 12 </ b> A is not exposed to the opening 113.

  Next, the upper end holding member 14 will be described. A plurality (five in the present embodiment) of upper end side holding members 14 that support the upper end side of the substrate S2 to be processed are provided apart from the upper contact portion 112 of the substrate holder 1A. The upper end side holding member 14 includes a columnar portion 141 and a circular flange portion 142 extending to one end side of the columnar portion 141. The upper end holding member 14 is formed with a first through hole 143 that penetrates the columnar portion 141 and the flange portion 142, and a recess 144 is formed on the other end side of the columnar portion 141. The concave portion 144 of the cylindrical portion 141 is fitted into the convex portion 115, and the first through hole 143 communicates with the convex portion opening 116 of the convex portion 115. Then, a screw 145 is inserted and fixed in the first through hole 143 and the convex opening 116, and each upper end holding member 14 is fixed to the abutting portion 112, and at the same time on the outer peripheral side than the concave portion 144 of the columnar portion 141. The cushioning material 12A is held and fixed.

  In the upper end side holding member 14 configured as described above, the substrate to be processed S2 is held in contact with the periphery of the cylindrical portion 141. Further, by providing the flange portion 142, even if the substrate S2 to be processed is likely to fall down due to buckling, for example, during transportation, the flange portion 142 can restrain the substrate.

  The case where each upper end holding member 14 is fixed to the contact portion 112 is the same as the case where the pressing member 13 is fixed to the contact portion 112. The positioning opening 121 of the cushioning material 12 </ b> A is fitted into the convex portion 115, and the cushioning material 12 </ b> A is installed in the contact portion 112. In this state, each upper end holding member 14 is fixed to the contact portion 112 with the screw 145, and at the same time, the cushioning material 12A is fixed on the outer peripheral side of the concave portion 144 of the columnar portion 141. By fixing in this way, the buffer material 12A can be easily aligned and fixed to the upper contact portion 112 as well.

  The lower end holding member 15 that supports the lower end side of the substrate to be processed S2 is provided along the longitudinal direction of the lower contact portion 112 of the substrate holder 1, and the support member main body that supports the substrate to be processed S2 on the upper surface thereof. 151 and a return portion 152 extending on the upper surface edge of the support member main body 151. A support member recess 153 is formed on the surface of the support member main body 151 on the contact portion 112 side. The support member main body 151 is formed with a second through-hole 154 so as to penetrate the support member recess 153. Further, a convex portion 115 is formed in the lower contact portion 112 along the longitudinal direction of the contact portion 112, and the convex portion 115 and the support member concave portion 153 are fitted. The second through hole 154 communicates with the convex opening 116 of the convex 115. Then, a screw 155 is inserted and fixed in the second through hole 154 and the convex opening 116, and the support member concave portion 153 of the support member main body 151 is formed at the same time as the lower end side holding member 15 is fixed to the contact portion 112. The cushioning material 12A is held and fixed in a region where there is no space.

  In the lower end side holding member 15 configured as described above, the substrate to be processed S2 is installed and held on the support member main body 151. Further, by providing the return portion 152, it is possible to prevent the substrate to be processed S <b> 2 from moving and falling from the support member main body 151 during transportation.

  Also in this case, when the lower end side holding member 15 is fixed to the contact portion 112, the positioning opening 121 of the cushioning material 12A is fitted to the convex portion 115, and the cushioning material 12A is installed in the contact portion 112. In this state, the lower end side holding member 15 is fixed to the contact portion 112 with a screw 155. By fixing in this way, the cushioning material 12A can be easily aligned and fixed to the lower contact portion 112 as well.

  As described above, in this embodiment, the cushioning material 12A is aligned, and the projections necessary for the alignment are covered with the holding member for holding the large substrate S2 to be processed. The crack or chipping of the substrate S2 to be processed when S2 contacts the contact portion 112 is suppressed. That is, the buckling of the substrate to be processed becomes a problem particularly in a large substrate, but the buffer material 12A is fixed while suppressing the buckling of the substrate to be processed by providing a holding member.

(Embodiment 3)
The substrate holder 1B according to the third embodiment shown in FIGS. 5 and 6 is different from the substrate holder 1A according to the second embodiment (see FIG. 2) in the shape of the lower end side holding member 15A. In the third embodiment, the same components as those in the first and second embodiments are denoted by the same reference numerals.

  The lower end side holding member 15 </ b> A in the present embodiment is provided separately from each other along the longitudinal direction of the lower contact portion 112. That is, in Embodiment 2 shown in FIGS. 2 to 4, the lower end side holding member 15 is continuously provided over the entire surface of the lower contact portion 112. The side holding member 15 </ b> A is provided intermittently over the entire surface of the lower contact portion 112. Each of the lower end side holding members 15 </ b> A includes a prismatic portion 156 and a rectangular flange portion 157 extending to one end side of the prismatic portion 156.

  A support member recess 153A is formed on the other surface side of the prismatic portion 156, that is, on the side opposite to the flange portion 157. A second through hole 154A is formed in the prismatic portion 156 so as to penetrate the support member recess 153A. Further, the lower contact portion 112 is formed with a convex portion 115 along the longitudinal direction of the contact portion, and the lower end side holding is performed so that the convex portion 115 and the support member concave portion 153A are fitted. The member 15A is configured. The second through hole 154A communicates with the convex opening 116 of the convex 115. Then, a screw 155 is inserted and fixed in the second through hole 154A and the convex opening 116, and the lower end holding member 15A is fixed to the lower contact portion 112 of the substrate holder 1 and at the same time supports the prismatic portion 156. The buffer material 12A is held and fixed in a region where the member recess 153A is not formed.

  Even when such a lower end side holding member 15A is installed, the cushioning material 12A can be positioned by the convex portion 115, and the cushioning material 12A can be fixed to the contact portion 112 by the lower end side holding member 15A.

  By the way, in this lower end side holding member 15A, the substrate to be processed S3 is placed on the prismatic portion 156, but the upper surface side of the prismatic portion 156 is scraped by the substrate to be processed S3, thereby causing the substrate to be processed S3 to be processed. The shakiness may increase. When the backlash increases, the impact during the substrate transfer increases, and this makes it easier for the substrate S3 to be processed to crack or chip. In such a case, in the present embodiment, the prismatic portion 156 is rotated and the unused surface of the prismatic portion 156 is fixed again, so that the substrate to be processed S3 is mounted on a flat surface. It is possible to prevent rattling of the substrate S3 to be processed. Thereby, the vibration at the time of contact with to-be-processed substrate S3 and the contact part 112 can be suppressed more, and the crack and notch | chip of to-be-processed substrate S3 can be suppressed more.

  Further, in this embodiment, since the lower end side holding member 15A is provided apart from that in the second embodiment, the amount of gas released from the member is smaller than in the case where the lower end side holding member is continuously provided. It is preferable because it is small. If the holding members are spaced apart like the lower end side holding member 15A, the substrate to be processed S3 is likely to vibrate during transport, but in this embodiment, the buffer material 12A is provided and the lower end side holding member 15A is also shocked. Since it is formed of a material having high absorbability, it is possible to suppress cracking and chipping of the substrate S3.

(Substrate transfer device)
A substrate transfer apparatus I using the substrate holder 1 will be described. As shown in FIG. 7, the substrate transfer apparatus I holds the substrate to be processed S <b> 1 substantially vertically by the frame-shaped substrate holder 1 while exposing the film formation surface of the substrate to be processed S <b> 1 exposed from the opening 113 of the substrate holder 1. This is a vertical transfer type substrate transfer apparatus that performs processing on the substrate. Such a substrate transfer apparatus is used in an in-line type film forming apparatus including a plurality of processing chambers including a film forming chamber in which a film is formed by a sputtering method.

  On the bottom surface of the support member 11 of the substrate holder 1, a columnar rod-shaped member 21 is provided along the longitudinal direction thereof. The support member 11 is configured to be rotatable in the circumferential direction of the rod-shaped member 21.

  In addition, rollers 22 are juxtaposed on the floor surface of the film forming apparatus via a fixing member 23 at a predetermined interval. The rod-shaped member 21 is placed on the roller 22, and the rod-shaped member 21 is moved as the roller 22 rotates. Specifically, the roller 22 has a curved surface with a concave central portion so that the rod-shaped member 21 engages in a cross-sectional view. The rotating shaft 24 of the roller 22 is rotatably installed on the fixed member 23, and one end of the rotating shaft 24 is connected to a drive control device (not shown), and the rotary shaft 24 is rotated by the drive control device. . By this rotation, the support member 11 installed on the roller 22 can move in the rotation direction via the rod-shaped member 21. In the present embodiment, the plurality of rollers 22 are arranged side by side to form a holder conveyance path.

  A holder magnet 25 is attached to the ceiling portion of the support member 11 of the substrate holder 1. Further, on the ceiling surface of the film forming apparatus, a plurality of magnets 26 are arranged in parallel so as to be slightly outside from a position facing the shutter conveyance path and to face each of the holder magnets 25. Due to the attractive force between the holder magnet 25 and the magnet 26, the substrate holder 1 is moved while being held substantially perpendicular to the floor surface.

  In such a substrate transport apparatus I, cracks and chips on the surface to be processed of the substrate S1 supported by the substrate holder 1 are suppressed, thereby improving the yield.

  Another embodiment of the substrate transfer apparatus will be described with reference to FIGS.

  A rack member 41 is provided on the lower end surface of the substrate holder 1. As shown in FIG. 8B, the rack member 41 is provided with a recess 42 at the center of the lower end surface thereof, and the rack 43 is supported in the recess 42 via a support member 42a.

  On the other hand, as shown in FIGS. 9 and 10, the film forming apparatus into which the substrate holder 1 is carried is provided with a pinion 51 that fits with the rack 43. The pinion 51 is supported on the floor surface of the film forming apparatus by a pinion rotation shaft 52 provided on the pinion 51 being rotatably supported by a pair of pinion support members 53. The pinion rotation shaft 52 is inclined (in FIG. 10A, the pinion rotation shaft 52 is set such that the left end portion is higher than the right end portion). It is provided at different height positions. The pinion rotation shaft 52 is connected to a motor (not shown) provided outside the film forming apparatus, and is configured to be rotationally driven by this motor. That is, when the substrate holder 1 is carried into the film forming apparatus and the rack 43 and the pinion 51 are engaged with each other, the substrate holder 1 is transported by rotating the pinion 51 in this state.

  Here, although not shown, a plurality of pinions 51 are provided at a predetermined distance in the film forming apparatus. In the present embodiment, the predetermined distance is the length in the short direction (lateral direction) of the substrate holder 1, and the substrate holder 1 is configured to be always transported by one pinion 51.

  In the film forming apparatus, a plurality of transport rollers 54 are provided so as to be separated from each other in the width direction of the substrate holder 1. As shown in FIG. 10B, two transport rollers 54 are provided on one transport roller rotation shaft 55 in the thickness direction of the substrate holder 1. That is, the pair of transport rollers 54 is provided on one transport roller rotating shaft 55, and a plurality of the pair of transport rollers 54 are provided apart from each other in the width direction of the substrate holder 1. Each conveyance roller rotating shaft 55 is rotatably supported by a conveyance roller support member 56. Further, the conveyance roller rotation shaft 55 in this case is also inclined (that is, the conveyance roller rotation shaft 55 in FIG. 10B is set such that the left end is higher than the right end). The roller support members 56 are provided at different height positions. Thus, in the present embodiment, the pinion support member 53 and the transport roller support member 56 are provided to be inclined with respect to the bottom. For this reason, the substrate holder 1 can be formed and transported while maintaining the state inclined at the angle θ.

  When the substrate holder 1 is loaded and installed in the film forming apparatus, the pair of transport rollers 54 comes into contact with the bottom surface of the rack member 41 of the substrate holder 1, and the rack member 41 is moved when the substrate holder 1 is transported. The substrate holder 1 is supported. By providing the transport roller 54, when the substrate holder 1 is transported by the pinion 51, the load of the substrate holder is not applied to the pinion 51, so that the pinion 51 is backlashed between the rack 43 ( (Backlash) can be held, so that it can rotate freely. That is, in the absence of the transport roller 54, the entire load of the substrate holder 1 is applied to the pinion 51, the backlash of the pinion is eliminated, the pinion cannot be rotated, and the substrate holder 1 can be transported. Can not.

  Furthermore, the film forming apparatus is provided with a plurality of guide rollers 57 spaced from each other. The guide roller 57 is connected to a guide roller rotating shaft 58 at one end, and the guide roller rotating shaft 58 is supported by a support base 59 so as to be rotatable. The roller surface of the guide roller 57 comes into contact with the side surface of the rack member 41 of the substrate holder 1 and suppresses rattling of the substrate holder 1 during conveyance.

  Thus, in the present embodiment, the substrate holder 1 is transported in an inclined state by the rack 43 and the pinion 51 that is rotationally driven. In this case, the pinion 51 rotates by supporting the load of the substrate holder 1 by the transport roller 54. Therefore, the substrate can be transported in a state in which cracks and chips on the surface to be processed of the substrate to be processed S1 supported by the substrate holder 1 by the holding member are prevented. Furthermore, since the load of the substrate holder 1 is supported in this way, backlash can be generated in the pinion 51, and since the pinion 51 is easy to rotate, it can be transported more smoothly, resulting in a higher yield. It is possible to improve. Further, the substrate can be transported more stably by the guide roller 57. Furthermore, by transporting the substrate holder 1 in an inclined state, dust and particles can be prevented from adhering to the substrate to be processed.

(Other embodiments)
In each of the above-described embodiments, the holding member for the substrates to be processed S1 to S3 has been shown to suppress the movement of the substrate, but is not limited thereto. For example, the substrate holders 1 to 1B may be provided with clamps to hold the substrates to be processed S1 to S3.

  In the second and third embodiments, the upper end holding member 14 has the cylindrical portion 141. However, the upper end holding member 14 is not limited to this, and the upper end holding member 14 has a prismatic portion 156 like the lower end holding member 15A shown in the third embodiment. May be used. Further, if the upper end holding member 14 is also worn by use and the backlash of the substrate S2 to be processed is generated, the cylindrical portion 141 is formed as a prismatic portion, and can be rotated when worn. It may be configured.

  As the substrate transport device, the one provided with the substrate holder 1 is shown, but of course, it may be provided with the substrate holders 1A, 1B. The substrate holders 1A and 1B are also moved while being held substantially perpendicular to the floor surface by the attractive force between the holder magnet 25 and the magnet 26, respectively.

  According to the substrate holder and the substrate transfer apparatus of the present invention, cracks and chips on the surface to be processed of the substrate S1 to be processed are suppressed, and the yield can be improved. Therefore, it can be used in the semiconductor device manufacturing industry.

1, 1A, 1B Substrate holder 11 Support member 12, 12A Buffer member 13 Press member 14 Upper end side holding member 15, 15A Lower end side holding member 21 Bar member 22 Roller 23 Fixing member 24 Rotating shaft 25 Holder magnet 26 Magnet 111 Side wall 112 Contacting portion 113 Opening portion 114 Housing portion 115 Protruding portion 116 Protruding portion opening 121 Positioning opening 131 Pressing portion main body 132 Pressing portion concave portion 133 Pressing portion through hole 141 Columnar portion 142 Flange portion 143 First through hole 144 Recessing portion 151 Support member main body 152 Return portion 153 Support member concave portions 154, 154A Second through hole 156 Square columnar portion 157 Flange portion I Substrate transport device S1-S3 Substrate

Claims (7)

A contact portion that contacts the outer peripheral portion of the substrate to be processed; and an opening that exposes the surface to be processed of the substrate to be processed, and the surface to be processed of the substrate to be processed is exposed from the opening. A support member that supports the substrate to be processed at the contact portion, and a holding member that holds an end of the substrate to be processed.
A substrate holder, wherein the contact portion is provided with a tape-like cushioning material having high shock absorption at least at a position facing the substrate to be processed. The contact portion of the substrate holder is formed with a protrusion, and the cushioning material is provided with an opening corresponding to the protrusion,
The cushioning material is installed at the contact portion by fitting the opening to the protrusion, and
Pressing the periphery of the opening of the cushioning material covering the protruding portion exposed from the opening portion, and, according to claim 1, wherein the front Kiho support member is characterized by comprising the high elasticity member shock-absorbing Board holder.   The substrate holder according to claim 1, wherein a plurality of the holding members are provided so as to be separated from each other over an end portion of the substrate.   The holding member has a prismatic portion that covers the protrusion and presses the periphery of the opening of the cushioning material, and the prismatic portion is fixed to the contact portion by a fixing member that passes through the center of the prismatic portion. The substrate holder according to claim 3, wherein:   The substrate holder according to claim 2, wherein the holding member is an upper end side holding member that supports an upper end portion of the substrate to be processed.   The substrate holder according to claim 2, wherein the holding member is a lower end side holding member that supports a lower end portion of the substrate to be processed.   A substrate transport apparatus comprising the substrate holder according to claim 1.

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