JP5788210B2 - 発光素子、発光素子パッケージ - Google Patents

発光素子、発光素子パッケージ Download PDF

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Publication number
JP5788210B2
JP5788210B2 JP2011097256A JP2011097256A JP5788210B2 JP 5788210 B2 JP5788210 B2 JP 5788210B2 JP 2011097256 A JP2011097256 A JP 2011097256A JP 2011097256 A JP2011097256 A JP 2011097256A JP 5788210 B2 JP5788210 B2 JP 5788210B2
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JP
Japan
Prior art keywords
layer
light emitting
light
emitting device
electrode layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2011097256A
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English (en)
Japanese (ja)
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JP2011233897A5 (enExample
JP2011233897A (ja
Inventor
鮮京 金
鮮京 金
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Innotek Co Ltd
Original Assignee
LG Innotek Co Ltd
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Filing date
Publication date
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Publication of JP2011233897A publication Critical patent/JP2011233897A/ja
Publication of JP2011233897A5 publication Critical patent/JP2011233897A5/ja
Application granted granted Critical
Publication of JP5788210B2 publication Critical patent/JP5788210B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/832—Electrodes characterised by their material
    • H10H20/835—Reflective materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H10H20/82—Roughened surfaces, e.g. at the interface between epitaxial layers

Landscapes

  • Led Devices (AREA)
  • Led Device Packages (AREA)
  • Electroluminescent Light Sources (AREA)
JP2011097256A 2010-04-23 2011-04-25 発光素子、発光素子パッケージ Expired - Fee Related JP5788210B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100037944A KR101064020B1 (ko) 2010-04-23 2010-04-23 발광 소자 및 그 제조방법
KR10-2010-0037944 2010-04-23

Publications (3)

Publication Number Publication Date
JP2011233897A JP2011233897A (ja) 2011-11-17
JP2011233897A5 JP2011233897A5 (enExample) 2014-07-03
JP5788210B2 true JP5788210B2 (ja) 2015-09-30

Family

ID=44310820

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011097256A Expired - Fee Related JP5788210B2 (ja) 2010-04-23 2011-04-25 発光素子、発光素子パッケージ

Country Status (6)

Country Link
US (1) US8624283B2 (enExample)
EP (1) EP2381490B1 (enExample)
JP (1) JP5788210B2 (enExample)
KR (1) KR101064020B1 (enExample)
CN (1) CN102237463B (enExample)
TW (1) TWI513042B (enExample)

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US9404197B2 (en) 2008-07-07 2016-08-02 Soraa, Inc. Large area, low-defect gallium-containing nitride crystals, method of making, and method of use
US10036099B2 (en) 2008-08-07 2018-07-31 Slt Technologies, Inc. Process for large-scale ammonothermal manufacturing of gallium nitride boules
US9589792B2 (en) 2012-11-26 2017-03-07 Soraa, Inc. High quality group-III metal nitride crystals, methods of making, and methods of use
US9543392B1 (en) 2008-12-12 2017-01-10 Soraa, Inc. Transparent group III metal nitride and method of manufacture
US8247886B1 (en) 2009-03-09 2012-08-21 Soraa, Inc. Polarization direction of optical devices using selected spatial configurations
US8791499B1 (en) 2009-05-27 2014-07-29 Soraa, Inc. GaN containing optical devices and method with ESD stability
US9000466B1 (en) 2010-08-23 2015-04-07 Soraa, Inc. Methods and devices for light extraction from a group III-nitride volumetric LED using surface and sidewall roughening
US9293644B2 (en) 2009-09-18 2016-03-22 Soraa, Inc. Power light emitting diode and method with uniform current density operation
US8933644B2 (en) 2009-09-18 2015-01-13 Soraa, Inc. LED lamps with improved quality of light
US9583678B2 (en) 2009-09-18 2017-02-28 Soraa, Inc. High-performance LED fabrication
CN107256915A (zh) 2009-09-18 2017-10-17 天空公司 发光二极管器件
US10147850B1 (en) 2010-02-03 2018-12-04 Soraa, Inc. System and method for providing color light sources in proximity to predetermined wavelength conversion structures
US8905588B2 (en) 2010-02-03 2014-12-09 Sorra, Inc. System and method for providing color light sources in proximity to predetermined wavelength conversion structures
US8740413B1 (en) 2010-02-03 2014-06-03 Soraa, Inc. System and method for providing color light sources in proximity to predetermined wavelength conversion structures
US9450143B2 (en) 2010-06-18 2016-09-20 Soraa, Inc. Gallium and nitrogen containing triangular or diamond-shaped configuration for optical devices
US9564320B2 (en) 2010-06-18 2017-02-07 Soraa, Inc. Large area nitride crystal and method for making it
US8786053B2 (en) 2011-01-24 2014-07-22 Soraa, Inc. Gallium-nitride-on-handle substrate materials and devices and method of manufacture
US8686431B2 (en) 2011-08-22 2014-04-01 Soraa, Inc. Gallium and nitrogen containing trilateral configuration for optical devices
US8912025B2 (en) 2011-11-23 2014-12-16 Soraa, Inc. Method for manufacture of bright GaN LEDs using a selective removal process
US9847372B2 (en) * 2011-12-01 2017-12-19 Micron Technology, Inc. Solid state transducer devices with separately controlled regions, and associated systems and methods
JP2015509669A (ja) * 2012-03-06 2015-03-30 ソラア インコーポレーテッドＳｏｒａａ Ｉｎｃ． 導波光効果を低減させる低屈折率材料層を有する発光ダイオード
US9437783B2 (en) * 2012-05-08 2016-09-06 Cree, Inc. Light emitting diode (LED) contact structures and process for fabricating the same
US9450152B2 (en) 2012-05-29 2016-09-20 Micron Technology, Inc. Solid state transducer dies having reflective features over contacts and associated systems and methods
US10145026B2 (en) 2012-06-04 2018-12-04 Slt Technologies, Inc. Process for large-scale ammonothermal manufacturing of semipolar gallium nitride boules
US9275912B1 (en) 2012-08-30 2016-03-01 Soraa, Inc. Method for quantification of extended defects in gallium-containing nitride crystals
US9299555B1 (en) 2012-09-28 2016-03-29 Soraa, Inc. Ultrapure mineralizers and methods for nitride crystal growth
US9978904B2 (en) 2012-10-16 2018-05-22 Soraa, Inc. Indium gallium nitride light emitting devices
US8802471B1 (en) * 2012-12-21 2014-08-12 Soraa, Inc. Contacts for an n-type gallium and nitrogen substrate for optical devices
US9761763B2 (en) 2012-12-21 2017-09-12 Soraa, Inc. Dense-luminescent-materials-coated violet LEDs
TWD156894S (zh) * 2013-02-08 2013-11-01 旭明光電股份有限公司 發光二極體晶片
US8994033B2 (en) 2013-07-09 2015-03-31 Soraa, Inc. Contacts for an n-type gallium and nitrogen substrate for optical devices
KR102098323B1 (ko) * 2013-09-17 2020-05-26 엘지이노텍 주식회사 발광소자
CN104851947B (zh) * 2015-04-21 2017-11-14 北京邮电大学 一种带有表面糙化透光结构的led芯片及其制作方法
KR102363290B1 (ko) * 2016-06-13 2022-02-16 삼성디스플레이 주식회사 광학 터치 필름, 이를 포함하는 표시 장치 및 그 제조 방법
US11466384B2 (en) 2019-01-08 2022-10-11 Slt Technologies, Inc. Method of forming a high quality group-III metal nitride boule or wafer using a patterned substrate
CN115104174A (zh) 2020-02-11 2022-09-23 Slt科技公司 改进的iii族氮化物衬底、制备方法和使用方法
US11721549B2 (en) 2020-02-11 2023-08-08 Slt Technologies, Inc. Large area group III nitride crystals and substrates, methods of making, and methods of use
US12091771B2 (en) 2020-02-11 2024-09-17 Slt Technologies, Inc. Large area group III nitride crystals and substrates, methods of making, and methods of use
FR3115930B1 (fr) * 2020-10-29 2024-03-22 Commissariat Energie Atomique Diode électroluminescente à structure de contact tridimensionnelle, écran d’affichage et procédé de fabrication associé

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JP3956918B2 (ja) * 2002-10-03 2007-08-08 日亜化学工業株式会社 発光ダイオード
JP3910171B2 (ja) * 2003-02-18 2007-04-25 シャープ株式会社 半導体発光装置、その製造方法および電子撮像装置
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US7161188B2 (en) * 2004-06-28 2007-01-09 Matsushita Electric Industrial Co., Ltd. Semiconductor light emitting element, semiconductor light emitting device, and method for fabricating semiconductor light emitting element
US7375380B2 (en) * 2004-07-12 2008-05-20 Rohm Co., Ltd. Semiconductor light emitting device
KR100631981B1 (ko) 2005-04-07 2006-10-11 삼성전기주식회사 수직구조 ３족 질화물 발광 소자 및 그 제조 방법
US20070018182A1 (en) * 2005-07-20 2007-01-25 Goldeneye, Inc. Light emitting diodes with improved light extraction and reflectivity
WO2007015330A1 (ja) * 2005-08-03 2007-02-08 Stanley Electric Co., Ltd. 半導体発光素子及びその製造方法
KR100896576B1 (ko) 2006-02-24 2009-05-07 삼성전기주식회사 질화물계 반도체 발광소자 및 그 제조방법
KR100832070B1 (ko) 2006-08-10 2008-05-27 삼성전기주식회사 질화갈륨계 발광 다이오드 소자
JP4835376B2 (ja) 2006-10-20 2011-12-14 日立電線株式会社 半導体発光素子
JP2008130878A (ja) 2006-11-22 2008-06-05 Sharp Corp 窒化物半導体発光素子
JP4980041B2 (ja) 2006-12-21 2012-07-18 ローム株式会社 半導体発光素子
JP5130730B2 (ja) * 2007-02-01 2013-01-30 日亜化学工業株式会社 半導体発光素子
JP5405467B2 (ja) 2007-08-31 2014-02-05 エルジー イノテック カンパニー リミテッド 発光デバイスパッケージ
KR101449005B1 (ko) 2007-11-26 2014-10-08 엘지이노텍 주식회사 반도체 발광소자 및 그 제조방법
DE102008003182A1 (de) * 2008-01-04 2009-07-09 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
JP5057398B2 (ja) * 2008-08-05 2012-10-24 シャープ株式会社 窒化物半導体発光素子およびその製造方法
JP2010080741A (ja) 2008-09-26 2010-04-08 Sharp Corp 半導体発光素子
KR100986523B1 (ko) * 2010-02-08 2010-10-07 엘지이노텍 주식회사 반도체 발광소자 및 그 제조방법
JP5185308B2 (ja) * 2010-03-09 2013-04-17 株式会社東芝 半導体発光装置の製造方法

Also Published As

Publication number Publication date
US8624283B2 (en) 2014-01-07
TWI513042B (zh) 2015-12-11
KR101064020B1 (ko) 2011-09-08
US20110260189A1 (en) 2011-10-27
JP2011233897A (ja) 2011-11-17
TW201214765A (en) 2012-04-01
EP2381490A3 (en) 2014-10-15
EP2381490B1 (en) 2017-07-05
EP2381490A2 (en) 2011-10-26
CN102237463B (zh) 2016-01-27
CN102237463A (zh) 2011-11-09

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