JP5761610B2 - セラミック電子部品、及びセラミック電子部品の製造方法 - Google Patents
セラミック電子部品、及びセラミック電子部品の製造方法 Download PDFInfo
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- JP5761610B2 JP5761610B2 JP2011192022A JP2011192022A JP5761610B2 JP 5761610 B2 JP5761610 B2 JP 5761610B2 JP 2011192022 A JP2011192022 A JP 2011192022A JP 2011192022 A JP2011192022 A JP 2011192022A JP 5761610 B2 JP5761610 B2 JP 5761610B2
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- 229910052759 nickel Inorganic materials 0.000 claims description 5
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- 229910002077 partially stabilized zirconia Inorganic materials 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
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- 229910018605 Ni—Zn Inorganic materials 0.000 description 2
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- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
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Description
次に、CuO、Fe2O3、Mn2O3の各含有モル量を、上述の範囲にした理由について詳述する。
Ni−Zn系フェライトでは、融点が1026℃と低いCuOをフェライト磁器組成物中に含有させることにより、より低温での焼成が可能となり、焼結性を向上させることができる。
Fe2O3を化学量論組成から減量させ、Feの一部をMnで置換する形態でMn2O3を含有させることにより、比抵抗ρが低下するのを回避でき、絶縁性の向上を図ることができる。
4a、4b 第1のコイルパターン
5a、5b 第2のコイルパターン
8c、8e ビア導体(第1のコイル導体用ビア導体)
9b、9d ビア導体(第2のコイル導体用ビア導体)
Claims (6)
- 第1のコイル導体と、該第1のコイル導体と略同一形状であって始端及び終端が前記第1のコイル導体に対し一定の離間距離を有して配された第2のコイル導体とが磁性体部に埋設されたセラミック電子部品であって、
前記第1のコイル導体及び前記第2のコイル導体がCuを主成分とする導電性材料で形成されると共に、
前記磁性体部が、フェライト磁器組成物で形成され、
前記フェライト磁器組成物が、少なくともFe、Mn、Ni、及びZnを含有し、Cuの含有モル量がCuOに換算して0〜5mol%であり、かつ、FeをFe2O3に換算したときの含有モル量xmol%、及びMnをMn2O3に換算したときの含有モル量ymol%を(x,y)で表したときに、(x,y)が、A(25,1)、B(47,1)、C(47,7.5)、D(45,7.5)、E(45,10)、F(35,10)、G(35,7.5)、及びH(25,7.5)で囲まれる領域にあり、
Cu−Cu 2 Oの平衡酸素分圧以下の雰囲気で焼成されてなることを特徴とするセラミック電子部品。 - 前記Znの含有モル量が、ZnOに換算して33mol%以下であることを特徴とする請求項1記載のセラミック電子部品。
- 前記Znの含有モル量が、ZnOに換算して6mol%以上であることを特徴とする請求項1又は請求項2記載のセラミック電子部品。
- 前記第1及び第2のコイル導体と前記磁性体部は同時焼成されてなることを特徴とする請求項1乃至請求項3のいずれかに記載のセラミック電子部品。
- Cuの含有モル量がCuOに換算して0〜5mol%であり、かつ、FeをFe2O3に換算したときの含有モル量xmol%、及びMnをMn2O3に換算したときの含有モル量ymol%を(x,y)で表したときに、(x,y)が、A(25,1)、B(47,1)、C(47,7.5)、D(45,7.5)、E(45,10)、F(35,10)、G(35,7.5)、及びH(25,7.5)で囲まれる領域を満たすようにFe化合物、Mn化合物、Cu化合物、Zn化合物、及びNi化合物を秤量し、これら秤量物を混合した後、仮焼して仮焼粉末を作製する仮焼工程と、
前記仮焼粉末からセラミック薄層体を作製するセラミック薄層体作製工程と、
Cuを主成分とする第1のコイルパターンを前記セラミック薄層体上に形成する第1のコイルパターン形成工程と、
Cuを主成分とする第2のコイルパターンを前記セラミック薄層体上に形成する第2のコイルパターン形成工程と、
前記第1のコイルパターンが形成された前記セラミック薄層体と前記第2のコイルパターンが形成された前記セラミック薄層体とを交互に所定枚数積層し、第1のコイル導体及び第2のコイル導体を内蔵した積層体を形成する積層体形成工程と、
Cu−Cu2Oの平衡酸素分圧以下の焼成雰囲気で前記積層体を焼成する焼成工程とを含んでいることを特徴とするセラミック電子部品の製造方法。 - 前記第1のコイルパターンが形成された前記セラミック薄層体の表面に前記第1のコイルパターンと電気的に絶縁された前記第2のコイル導体用ビア導体を形成し、
前記第2のコイルパターンが形成された前記セラミック薄層体の表面に前記第2のコイルパターンと電気的に絶縁された前記第1のコイル導体用ビア導体を形成することを特徴とする請求項5記載のセラミック電子部品の製造方法。
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CN2012103139661A CN102976728A (zh) | 2011-09-02 | 2012-08-29 | 铁素体陶瓷组合物、陶瓷电子部件以及陶瓷电子部件的制造方法 |
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US13/601,842 US20130057376A1 (en) | 2011-09-02 | 2012-08-31 | Ferrite ceramic composition, ceramic electronic component, and process for producing ceramic electronic component |
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