JP5757852B2 - 撮像モジュールおよび撮像ユニット - Google Patents

撮像モジュールおよび撮像ユニット Download PDF

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Publication number
JP5757852B2
JP5757852B2 JP2011266073A JP2011266073A JP5757852B2 JP 5757852 B2 JP5757852 B2 JP 5757852B2 JP 2011266073 A JP2011266073 A JP 2011266073A JP 2011266073 A JP2011266073 A JP 2011266073A JP 5757852 B2 JP5757852 B2 JP 5757852B2
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Japan
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electrode
chip
cable
imaging
disposed
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JP2011266073A
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English (en)
Japanese (ja)
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JP2013118337A (ja
JP2013118337A5 (enExample
Inventor
中山　高志
高志 中山
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Olympus Corp
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Olympus Corp
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Publication date
Application filed by Olympus Corp filed Critical Olympus Corp
Priority to JP2011266073A priority Critical patent/JP5757852B2/ja
Priority to EP12854656.1A priority patent/EP2790218A4/en
Priority to PCT/JP2012/072882 priority patent/WO2013084553A1/ja
Publication of JP2013118337A publication Critical patent/JP2013118337A/ja
Priority to US14/291,178 priority patent/US9455358B2/en
Publication of JP2013118337A5 publication Critical patent/JP2013118337A5/ja
Application granted granted Critical
Publication of JP5757852B2 publication Critical patent/JP5757852B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/93—Interconnections
    • H10F77/933—Interconnections for devices having potential barriers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/018—Manufacture or treatment of image sensors covered by group H10F39/12 of hybrid image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Lens Barrels (AREA)
  • Studio Devices (AREA)
  • Endoscopes (AREA)
JP2011266073A 2011-12-05 2011-12-05 撮像モジュールおよび撮像ユニット Active JP5757852B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011266073A JP5757852B2 (ja) 2011-12-05 2011-12-05 撮像モジュールおよび撮像ユニット
EP12854656.1A EP2790218A4 (en) 2011-12-05 2012-09-07 PICTURE MODULE AND IMAGING UNIT
PCT/JP2012/072882 WO2013084553A1 (ja) 2011-12-05 2012-09-07 撮像モジュールおよび撮像ユニット
US14/291,178 US9455358B2 (en) 2011-12-05 2014-05-30 Image pickup module and image pickup unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011266073A JP5757852B2 (ja) 2011-12-05 2011-12-05 撮像モジュールおよび撮像ユニット

Publications (3)

Publication Number Publication Date
JP2013118337A JP2013118337A (ja) 2013-06-13
JP2013118337A5 JP2013118337A5 (enExample) 2015-01-15
JP5757852B2 true JP5757852B2 (ja) 2015-08-05

Family

ID=48573937

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011266073A Active JP5757852B2 (ja) 2011-12-05 2011-12-05 撮像モジュールおよび撮像ユニット

Country Status (4)

Country Link
US (1) US9455358B2 (enExample)
EP (1) EP2790218A4 (enExample)
JP (1) JP5757852B2 (enExample)
WO (1) WO2013084553A1 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6344935B2 (ja) * 2014-03-13 2018-06-20 Hoya株式会社 半導体装置及び内視鏡
CN106104791B (zh) * 2014-03-20 2019-05-14 奥林巴斯株式会社 安装构造体的制造方法、安装用夹具、安装构造体的制造装置、摄像装置以及内窥镜装置
JP6515431B2 (ja) * 2015-03-31 2019-05-22 国立大学法人東北大学 挿入器具および挿入器具の製造方法
JP6625615B2 (ja) 2015-04-17 2019-12-25 オリンパス株式会社 撮像装置
WO2016194074A1 (ja) * 2015-05-29 2016-12-08 オリンパス株式会社 撮像装置、内視鏡システムおよび撮像装置の製造方法
US10122953B2 (en) 2015-11-30 2018-11-06 Fujikura Ltd. Imaging module
JP2019047300A (ja) 2017-08-31 2019-03-22 株式会社フジクラ 撮像モジュール及びハーネスユニット
TWI646939B (zh) * 2017-11-10 2019-01-11 沅聖科技股份有限公司 微內視鏡裝置
WO2019138462A1 (ja) * 2018-01-10 2019-07-18 オリンパス株式会社 撮像装置、内視鏡、および、撮像装置の製造方法
CN112135557B (zh) * 2018-03-14 2024-09-13 奥林巴斯株式会社 摄像单元和斜视型内窥镜
CN108511475B (zh) * 2018-05-17 2023-10-10 黄琴 一种超小型pad的辅助焊接元件的制造方法和辅助焊接方法
JP6792661B2 (ja) * 2019-03-27 2020-11-25 Hoya株式会社 撮像モジュール及び内視鏡
JP2020194854A (ja) * 2019-05-27 2020-12-03 株式会社 Ｒｏｓｎｅｓ 固体撮像装置へ配線する製造方法
CN116635769A (zh) * 2021-01-18 2023-08-22 三星电子株式会社 包括微型相机的可穿戴的电子装置
JP7688783B2 (ja) * 2022-09-09 2025-06-04 オリンパスメディカルシステムズ株式会社 撮像装置、内視鏡、および、撮像装置の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5436492A (en) * 1992-06-23 1995-07-25 Sony Corporation Charge-coupled device image sensor
JP2000092477A (ja) * 1998-09-07 2000-03-31 Olympus Optical Co Ltd 撮像装置
JP2001118967A (ja) * 1999-10-19 2001-04-27 Sanyo Electric Co Ltd 固体撮像素子のパッケージ構造
JP4271904B2 (ja) * 2002-06-24 2009-06-03 富士フイルム株式会社 固体撮像装置の製造方法
JP4495544B2 (ja) * 2004-08-16 2010-07-07 Ｈｏｙａ株式会社 電子内視鏡の先端部
DE102004056946A1 (de) * 2004-11-23 2006-05-24 Karl Storz Gmbh & Co. Kg Bildaufnehmermodul sowie Verfahren zum Zusammenbauen eines Bildaufnehmermoduls
JP2006324304A (ja) * 2005-05-17 2006-11-30 Yuutekku System:Kk 半導体パッケージ及びイメージセンサー型モジュール
JP2010263020A (ja) * 2009-04-30 2010-11-18 Panasonic Corp 光学デバイスモジュール
JP2011188375A (ja) * 2010-03-10 2011-09-22 Olympus Corp 撮像装置

Also Published As

Publication number Publication date
US20140264697A1 (en) 2014-09-18
EP2790218A1 (en) 2014-10-15
JP2013118337A (ja) 2013-06-13
WO2013084553A1 (ja) 2013-06-13
EP2790218A4 (en) 2015-07-29
US9455358B2 (en) 2016-09-27

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