JP5754399B2 - 半導体素子の駆動装置 - Google Patents

半導体素子の駆動装置 Download PDF

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JP5754399B2
JP5754399B2 JP2012056038A JP2012056038A JP5754399B2 JP 5754399 B2 JP5754399 B2 JP 5754399B2 JP 2012056038 A JP2012056038 A JP 2012056038A JP 2012056038 A JP2012056038 A JP 2012056038A JP 5754399 B2 JP5754399 B2 JP 5754399B2
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signal
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semiconductor element
circuit unit
input
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JP2013191989A5 (enExample
JP2013191989A (ja
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洋 羽生
洋 羽生
山本　雅裕
雅裕 山本
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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JP2012056038A 2012-03-13 2012-03-13 半導体素子の駆動装置 Active JP5754399B2 (ja)

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JP2012056038A JP5754399B2 (ja) 2012-03-13 2012-03-13 半導体素子の駆動装置

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JP2013191989A JP2013191989A (ja) 2013-09-26
JP2013191989A5 JP2013191989A5 (enExample) 2014-09-18
JP5754399B2 true JP5754399B2 (ja) 2015-07-29

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10673425B2 (en) 2018-04-26 2020-06-02 Fuji Electric Co., Ltd. Semiconductor device

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7541477B2 (ja) * 2020-12-18 2024-08-28 株式会社Soken 回転電機の制御装置、プログラム、回転電機の制御方法
CN114039586B (zh) * 2021-10-27 2025-08-19 广东汇芯半导体有限公司 一种半导体电路的驱动电路
CN114006347B (zh) * 2021-10-29 2023-09-08 广东汇芯半导体有限公司 一种半导体高压集成驱动芯片及电子设备
CN114039585B (zh) * 2021-10-29 2025-12-16 广东汇芯半导体有限公司 高压集成电路、半导体电路及其制备方法
JP7586051B2 (ja) 2021-11-04 2024-11-19 三菱電機株式会社 半導体装置
CN113922638B (zh) * 2021-11-18 2025-07-22 广东汇芯半导体有限公司 一种半导体驱动hvic

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7026801B2 (en) * 2003-09-15 2006-04-11 Texas Instruments Incorporated Guaranteed bootstrap hold-up circuit for buck high side switch
US7190208B2 (en) * 2004-04-08 2007-03-13 International Rectifier Corporation Self-oscillating full bridge driver IC
JP5473511B2 (ja) * 2009-09-18 2014-04-16 三菱電機株式会社 電力用半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10673425B2 (en) 2018-04-26 2020-06-02 Fuji Electric Co., Ltd. Semiconductor device

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