JP5748849B2 - 設置面積を取らない高密度モジュラーデータセンターおよびエネルギー効率の優れた冷却システム - Google Patents
設置面積を取らない高密度モジュラーデータセンターおよびエネルギー効率の優れた冷却システム Download PDFInfo
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Images
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20827—Liquid cooling with phase change within rooms for removing heat from cabinets, e.g. air conditioning devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B49/00—Arrangement or mounting of control or safety devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20754—Air circulating in closed loop within cabinets
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
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Description
本願は、前記仮出願全体の内容は、参照することにより本書に含まれる、「SPACE-SAVING HIGH DENSITY MODULAR DATA PODS AND ENERGY-EFFICIENT
COOLING SYSTEM」と題する2011年6月23日に出願された米国仮特許出願第61/357,851号、「CLOSE-COUPLED COOLING SYSTEMS AND METHODS FOR CHILLERLESS OPERATION IN
HIGH WET BULB TEMPERATURE APPLICATIONS」と題する2010年11月16日に出願された米国仮特許出願第61/414,279号、「MODULAR IT RACK COOLING ASSEMBLIES AND METHODS FOR ASSEMBLING SAME」と題する2011年3月2日に出願された米国仮出願第61/448,631号、および「SYSTEMS AND METHODS FOR CLOSE-COUPLED COOLING OF IT EQUIPMENT」と題する2011年5月3日に出願された米国仮特許出願第61/482,070号の利益を主張する。
MWの電力消費容量を有する大型データセンターをサポートするために、約280トンのチラー容量を要する。さらに、従来のチラー設備は、データセンター内部のいくつかの選択された領域とは対照的に、通常、データセンター全体を冷却するように設計されている。その結果、従来のチラー設備は、冷却する必要がない領域に対して多大な量のエネルギーを費やしている。さらに、従来のチラー設備を実装するために使用される設計制約の1つは、データセンター全体の電力消費容量である。その理由から、データセンターが負荷変動のために独自の電力消費容量で運転しない場合、従来のチラー設備の効率は大幅に低下する。
kWのITラック負荷を有するデータセンター等の高密度データセンターに十分な冷却を提供することができない。
MWのサーバラック容量)をサポートするように設計され、配備され得る。図1は、モジュラーデータポッドの幾何学形状の設置空間節約属性を示す。モジュラー式ではない典型的なデータセンターは、このレベルのサーバラック容量および密度を処理するために3倍から4倍多くの空間を要する。
を含む。
kWから高性能、つまりサーバラックあたり約40 kWの多種多様のサーバラック負荷を処理するように設計されてよい。
kWのサーバラック)に適合してよい。2つのサーバラック、たとえば図示されるようにサーバラック804と806との間には空間805’があり、人間のオペレータにアクセスドア81を介したアクセスを提供する。いくつかの実施形態では、モジュラーデータポッドは、アクセスドアを含まない。これらの実施形態では、モジュラーデータポッド構造は、8つのサーバラックに適合してよい。
gpmの流速で調節される。ポンプは、以下の形、つまり中央ポンピング冷却塔、乾燥クーラー、流体クーラー、または他の冷水回路または井戸水回路のどれかをとってよい。
gpmを、第2の流体のその小さな部分が第4の回路4400から熱を抽出するサブクーラーコンデンサ1300aの入口に逸らす分割経路4200bを含む。第2の流体の残りの逸らされていない部分は、メインコンデンサ1300まで流体経路4200dをたどり、第1の回路から熱を取り除く。
kW等の高密度ITデータセンターにより適している。
kW等の高密度ITデータセンターに対する最適冷却選択肢となる。
図7の例示的な実施形態では、冷却システム2000は、図2Aのモジュラーデータポッド50に適用されているとして示されている。冷却システムは、3つの独立した個別ポンプ式の冷媒冷却コイル回路を含む。チラーレス動作用の専用密結合冷却システム525は、図2Aに関して上述されたように、補助エンクロージャまたはコンパートメント515の内部に収容される。専用密結合冷却システム525は、3つのサブクーリング回路2011、2012、および2013を含む。サブクーリング回路2011、2012、および2013は、それぞれ図6の冷却システム4000に類似している。サブクーリング回路2011、2012、および2013は、それぞれ第1の冷却回路2100、第2の冷却回路2200、および第3の冷却回路2300をそれぞれ含む。図6に関して上述されたように、湿球温度が所定の湿球温度限度である、または所定の湿球温度限度を超えている場合、第2の流体回路2200は、第1の冷却回路2100を通って流れる第1の流路をサブクールするための動作に入れられる。第2の流体回路2200の動作は、1つまたは複数の圧縮機2200、およびサブクーラーコンデンサ1200a、および蒸発サブクーラー1200b、および1つまたは複数のポンプ210に入口で安定した液面を提供するように設計される冷媒流体受器2130の動作を含む。
屋内または屋外の環境または用途では輸送システムは、頭上ガントリー、クレーン、およびレールを含んでよい。支持材用に十分な頭上の空間的な余地が利用できない場合、データポッドのチェーン間の通路の幅を増加できる。これによって、フォークリフトまたは他の等級レベルの支持材装置は、データポッドを容易に取り外すまたは配備できるように、通路に接近できるようになる。
kWのサーバラック等の高密度サーバ設備を処理するように設計される。モジュラーデータポッド設計は拡張可能であり、サーバ技術での進展の結果として、サーバ機器の1立方フィートあたりの電力出力の増加に対応する。モジュラーデータポッド設計を拡大縮小するには、熱交換器およびポンピング設備およびサーバラックへの配電を改装することを必要とすることがある。モジュラーデータポッド設計を拡大縮小するために行われるあらゆる修正の範囲は、電力出力の増加量に依存してよい。
kWと12 kWの間で生成する能力を有してよい。いくつかのラックは、たとえば16から24 kWのより高い出力を生じさせることができる。対照的に、本開示のいくつかの実施形態にかかるモジュラーデータポッドは、相対的に小さい物理的な設置面積で40
kW以上を消費する8台のサーバラックを冷却するほど十分に高レベルの熱遮断を達成できる。
PUEレベルで動作できるようにする制御戦略を使用してよい。
Claims (9)
- 電子機器を冷却するためのシステムであって、
大気を使用して電子機器と熱連通する第1の流体を冷却するように構成されるフリークーリングシステムと、
前記フリークーリングシステムに結合される第1の機械サブクーリングシステムであって、前記第1の機械サブクーリングシステムは、前記フリークーリングシステムがその最大冷却容量を超えた量の関数として、前記フリークーリングシステム内を流れる第2の流体を冷却するように構成される、第1の機械サブクーリングシステムと、
を備える、システム。 - 前記フリークーリングシステムが、
大気を使用して前記第2の流体を冷却するように構成されるフリークーリング装置と、
前記フリークーリング装置と流体連通するメイン熱交換器であって、前記メイン熱交換器は、前記第1の流体から前記第2の流体への熱伝達を可能にするように構成される、メイン熱交換器と、
を備える、請求項1に記載のシステム。 - 前記第1の機械サブクーリングシステムが、前記第2の流体の温度の関数として前記メイン熱交換器に流れ込む前記第2の流体を冷却するように構成される、請求項2に記載のシステム。
- 前記第1の機械サブクーリングシステムが、
前記メイン熱交換器に流れ込む前記第2の流体から第3の流体への熱伝達を可能にするように構成される第1の熱交換器であって、前記第3の流体は前記第1の熱交換器を通って流れる、第1の熱交換器と、
前記第1の熱交換器と流体連通し、前記第1の熱交換器から流れ出す前記第3の流体を圧縮するように構成される圧縮機と、
前記圧縮機と流体連通し、圧縮された前記第3の流体から、前記メイン熱交換器から流れ出す前記第2の流体への熱伝達を可能にするように構成される第2の熱交換器と、
前記第1の熱交換器と前記第2の熱交換器との間で流体結合される減圧ユニットであって、前記減圧ユニットは、前記第2の熱交換器から前記第1の熱交換器へ流れる前記第2の流体の温度を下げるように構成される、減圧ユニットと、
を備える、請求項2に記載のシステム。 - 大気の湿球温度を感知するように構成される温度センサと、
前記温度センサおよび前記圧縮機に結合される制御装置であって、前記制御装置は、感知された大気の湿球温度の関数として前記圧縮機の速度を変えるように構成される、制御装置と、
をさらに備える、請求項4に記載のシステム。 - 前記メイン熱交換器から流れ出す前記第1の流体を受け入れるように構成される流体受器と、
前記流体受器に入れられる前記第1の流体の液面を感知するように構成されるセンサと、
前記流体受器に入れられる前記第1の流体の液面が所定のレベルを下回るときに、前記第1の流体を冷却するように構成される第2の機械サブクーリングシステムと、
をさらに備える、請求項4に記載のシステム。 - 前記第2の機械サブクーリングシステムが、
前記流体受器内に置かれ、前記流体受器に入れられる前記第1の流体から第4の流体への熱伝達を可能にするように構成される第3の熱交換器であって、前記第4の流体は前記第3の熱交換器を通って流れる、第3の熱交換器と、
前記第3の熱交換器と流体連通し、前記第3の熱交換器から流れ出す前記第4の流体を圧縮するように構成される第2の圧縮機と、
前記第2の圧縮機と流体連通し、圧縮された前記第4の流体から、前記第2の流体への熱伝達を可能にするように構成される第4の熱交換器と、
前記第3の熱交換器と前記第4の熱交換器との間で流体結合される減圧ユニットであって、前記減圧ユニットは、前記第4の熱交換器から前記第3の熱交換器へ流れる前記第4の流体の温度を下げるように構成される、減圧ユニットと、
を備える、請求項6に記載のシステム。 - 前記第1の流体、前記第3の流体、および前記第4の流体が冷媒を含み、前記第2の流体が水を含む、請求項7に記載のシステム。
- 前記第1の機械サブクーリングシステムが前記電子機器に密結合される、請求項1に記載のシステム。
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