JP5728770B2 - 基板処理装置、基板処理方法、ならびに、プログラム - Google Patents

基板処理装置、基板処理方法、ならびに、プログラム Download PDF

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JP5728770B2
JP5728770B2 JP2011022050A JP2011022050A JP5728770B2 JP 5728770 B2 JP5728770 B2 JP 5728770B2 JP 2011022050 A JP2011022050 A JP 2011022050A JP 2011022050 A JP2011022050 A JP 2011022050A JP 5728770 B2 JP5728770 B2 JP 5728770B2
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substrate
arms
chamber
processing
substrates
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JP2012164716A (ja
JP2012164716A5 (enrdf_load_stackoverflow
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藤原　隆行
隆行 藤原
昌和 中村
昌和 中村
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Showa Shinku Co Ltd
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Showa Shinku Co Ltd
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JP2011022050A 2011-02-03 2011-02-03 基板処理装置、基板処理方法、ならびに、プログラム Active JP5728770B2 (ja)

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JP2012164716A JP2012164716A (ja) 2012-08-30
JP2012164716A5 JP2012164716A5 (enrdf_load_stackoverflow) 2014-10-16
JP5728770B2 true JP5728770B2 (ja) 2015-06-03

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6559543B2 (ja) * 2015-11-09 2019-08-14 サムコ株式会社 基板処理装置
JP2017183665A (ja) * 2016-03-31 2017-10-05 芝浦メカトロニクス株式会社 基板搬送装置、基板処理装置及び基板処理方法
US20180061696A1 (en) * 2016-08-23 2018-03-01 Applied Materials, Inc. Edge ring or process kit for semiconductor process module
KR102164067B1 (ko) * 2017-09-29 2020-10-12 시바우라 메카트로닉스 가부시끼가이샤 기판 처리 장치 및 기판 처리 방법
JP7320369B2 (ja) * 2019-04-17 2023-08-03 株式会社アルバック 基板処理装置

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DE634783T1 (de) * 1993-07-16 1996-02-15 Semiconductor Systems Inc Thermische Behandlungsmodul für Beschichtungs/Entwicklungseinrichtung für Substrat.

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